SBIR Phase II: An Innovative Method for Removing Resist from Wafers

SBIR 第二阶段：一种从晶圆上去除抗蚀剂的创新方法

• 批准号: 0750623
• 负责人: Hang Ji
• 金额: $ 50万
• 依托单位: Uncopiers, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-01-01 至 2009-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0750623&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Innovative; Method

The Small Business Innovation Research (SBIR) Phase II project seeks to develop an innovative, environment friendly method for removing resist from semiconductor wafers. After every lithography step, and the following processing step, e.g., etching or ion implantation, the process-hardened resist must be stripped away and the wafer cleaned. Existing photoresist removal methods (plasma ashing and wet chemical stripping) are proving too aggressive for current state-of-the-art interconnect materials-they tend to degrade and damage low-k dielectrics and corrode copper; they are also detrimental to the delicate device structures. In this project the resist stripping and wafer cleaning are accomplished in a single process step through controlled microcavitation in ultrapure water with no damage to the underlying layers and features.Resist stripping is a growing $2.64B market. The proposed resist remover and wafer cleaner successfully overcome a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industry, the microcavitation based layer removal will find applications in all areas requiring controlled thin film removal,e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. This will be an enabling technology useful in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.

小型企业创新研究(SBIR)第二阶段项目寻求开发一种创新的、环境友好的方法来去除半导体晶圆的抗蚀剂。在每个光刻步骤和随后的处理步骤(例如，蚀刻或离子注入)之后，必须剥离工艺硬化的抗蚀剂并清洁晶片。事实证明，现有的光刻胶去除方法(等离子灰化和湿化学剥离)对于当前最先进的互连材料来说过于激进-它们往往会降解和损坏低k电介质并腐蚀铜；它们也不利于微妙的器件结构。在该项目中，抗蚀剂剥离和晶片清洗通过在超纯水中的受控微空化在单一工艺步骤中完成，而不会对底层和特征造成损害。抗蚀剂剥离市场价值26.4亿美元。建议的抗蚀剂去除剂和晶片清洁剂成功地克服了当今IC制造业面临的关键技术障碍。除了IC制造行业，基于微空化的涂层去除将在所有需要受控薄膜去除的领域中得到应用，例如MEMS、印刷电路板、光学、汽车(油漆去除)和航空航天。这将是一项在薄膜加工中有用的使能技术。微空化是一种不含化学物质、环境友好的技术。