SBIR Phase I: An Innovative Method for Removing Resist from Wafers

这个小型企业创新研究（SBIR）第一阶段项目旨在开发一种创新的方法，从半导体晶片上去除抗蚀剂。Microcavitation Resist Remover将有助于实现对下一代更快芯片至关重要的低k集成。微空化将是一种机械去除过程，受断裂的机械性能而不是抗蚀剂的化学成分的影响。抗蚀剂剥离是一个增长的37亿美元的市场。所提出的微空化抗蚀剂去除剂和晶片清洁剂成功地克服了当今IC制造业面临的关键技术障碍。除了IC制造业，微空化抗蚀剂去除剂在薄膜去除至关重要的所有领域都至关重要，例如，MEMS、PCB、光学、汽车（除漆）和航空航天。更广泛地说，它将是一种用于薄膜加工的技术。微空化技术是一种无化学品、环境友好的技术。

This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a mechanical removal process influenced by the mechanical properties of fracture rather than the chemical constitution of the resist.Resist stripping is a growing $3.7B market. The proposed Microcavitation Resist Remover and wafer cleaner succesfully overcomes a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industy, the Microcavitation Resist Remover will be critical in all areas where thin film removal is critical e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. More broadly, it will be an enabling technology for use in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.