SBIR Phase I: An Innovative Method for Removing Resist from Wafers

这项小型企业创新研究（SBIR）第一阶段项目旨在开发一种从半导体晶圆上去除抗蚀剂的创新方法。微空化抗蚀去除器将有助于实现对下一代更快芯片至关重要的低k集成。微空化将是一个受断裂力学性能影响的机械去除过程，而不是受抗蚀剂化学成分的影响。抵制剥离是一个不断增长的37亿美元市场。提出的微空化抗蚀剂和晶圆清洗剂成功克服了当今IC制造业面临的关键技术障碍。除集成电路制造行业外，Microcavitation Resist Remover将在薄膜去除至关重要的所有领域发挥关键作用，例如MEMS， PCB，光学，汽车（除漆）和航空航天。更广泛地说，它将是一种用于薄膜加工的使能技术。微空化是一种无化学物质、环保的技术。

This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a mechanical removal process influenced by the mechanical properties of fracture rather than the chemical constitution of the resist.Resist stripping is a growing $3.7B market. The proposed Microcavitation Resist Remover and wafer cleaner succesfully overcomes a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industy, the Microcavitation Resist Remover will be critical in all areas where thin film removal is critical e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. More broadly, it will be an enabling technology for use in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.