Micro Laser Assisted Machining of Semiconductors and Ceramics

该奖项的研究目标是通过测量切削力和刀具磨损来确定在微观尺度上使用激光来改善脆性半导体和陶瓷材料的加工过程的物理效益，并辅以数值模拟进行比较。该方法将设计和构建微激光辅助加工工具和系统，并评估其在硅和碳化硅等材料的实际切割测试中的性能。包括力和磨损测量在内的工艺参数将用于评估激光系统的有效性，并优化其性能，作为改进制造过程的工具。如果成功，这项研究将导致一种新的成本有效的工艺能力，用于生产从难加工材料到机械材料的先进组件，这将降低半导体和工程陶瓷的组件成本，并为将这些材料的使用扩展到新产品和市场提供机会。高性能半导体和工程陶瓷的降低制造成本和扩展使用在先进的运输市场中至关重要，特别是对于下一代燃油效率高的汽油，混合动力和电动汽车的开发。

The research objective of this award is to determine the physical benefit of using lasers at the micro scale to improve the machining process of brittle semiconductors and ceramic materials through measurements of cutting forces and tool wear, complemented with numerical simulations for comparison. The approach will be to design and build the micro laser assisted machining tools and system and to evaluate their performance in actual cutting tests on materials such as silicon and silicon carbide. Process parameters including forces and wear measurements will be used to evaluate the effectiveness of the laser system and optimize its performance as a tool for improving the manufacturing process. If successful this research will lead to a new cost effective process capability for producing advanced components from difficult to machine materials that will result in reduced component cost for semiconductors and engineered ceramics and provide an opportunity for extending the use of these materials to new products and markets. Reduced cost manufacturing and extended use of high performance semiconductors and engineered ceramics are vitally important in the advanced transportation market, especially for the development of the next generation of fuel efficient gas, hybrid and electric vehicles.