I-Corps: Micro Laser Assisted Machining Technologies

I-Corps：微型激光辅助加工技术

• 批准号: 1237113
• 负责人: John Patten
• 金额: $ 5万
• 依托单位: Western Michigan University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-03-15 至 2012-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1237113&HistoricalAwards=false
• 关键词: Corps; Micro; Laser; Assisted; Machining

This Innovation Corps project proposes a technology that will focus on reducing the time, cost and effort, and on extending the capability, associated with machining of primarily but not limited to semiconductors and ceramics such as silicon, silicon carbide, sapphire, and others. The proposed technology (Micro Laser Assisted Machining) benefits the manufacture of challenging materials that are hard and brittle. The 50% decrease in material hardness during the Micro Laser Assisted Machining process can be directly correlated to the improved tool life and doubling of machining productivity.If successful, this innovation will eventually result in entirely new capabilities relative to production of materials and products currently not viable or achievable due to processing or use-limitations. Potential applications to emerging technologies, such as turbines and plug-in electric vehicles, where advanced high power and high temperature operation of devices is required, such as IGBTs, may prove to be compatible with the micro laser assisted machining processing technology, possibly resulting in reduced overall manufacturing costs and improved quality.

该创新团队项目提出了一项技术，该技术将专注于减少时间，成本和精力，并扩展与主要但不限于半导体和陶瓷（如硅，碳化硅，蓝宝石等）加工相关的能力。所提出的技术（微激光辅助加工）有利于制造具有挑战性的硬脆材料。在微激光辅助加工过程中，材料硬度降低50%，这与刀具寿命的提高和加工生产率的翻倍直接相关。如果成功，这一创新最终将带来全新的能力，相对于目前由于加工或使用限制而不可行或无法实现的材料和产品的生产。对新兴技术的潜在应用，例如涡轮机和插电式电动汽车，其中需要先进的高功率和高温操作的设备，例如IGBT，可能被证明与微激光辅助加工处理技术兼容，可能导致整体制造成本降低和质量提高。