Collaborative Research: Embedding of Thin Film Sensors in Advanced Ceramic Tools for Micro/Nano Scale Thermomechanical Measurements in and Near Tool-Workpiece Interface

合作研究：在先进陶瓷工具中嵌入薄膜传感器，用于工具-工件界面及其附近的微/纳米级热机械测量

• 批准号: 0824713
• 负责人: Xiaochun Li
• 金额: $ 24.59万
• 依托单位: University of Wisconsin-Madison
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-09-01 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0824713&HistoricalAwards=false
• 关键词: Collaborative; Research; Embedding; Thin; Film

The objective of this award is to embed micro- and nano-scale high temperature thermocouples and strain gauges in polycrystalline cubic boron nitride materials, and to provide thermomechanical sensing with unprecedented spatial and temporal resolution at and near the ceramic tool-work interface for manufacturing process studies. It will first focus on the design, fabrication, and embedding through diffusion bonding of thin film sensor arrays into polycrystalline cubic boron nitride. The performance of the embedded sensors will be characterized, and the interaction between the embedded sensors and ceramic inserts under simulated harsh conditions will be studied. Hard turning will be used as the vehicle for testing embedded thin film sensor arrays and for the measurement of temperature and stress distributions in ceramic cutting tools to advance the understanding of machining physics.If successful, the embedded sensors will offer a capability of providing, for the first time, sets of simultaneous measurements over a finely spaced grid for mechanical and thermal distributions at the ceramic tool-chip interface. This will enable manufacturing engineers to better understand the processes, optimize ceramic tool design, and to effectively control the process. Advanced ceramic tooling with embedded thin film sensors will have significant implications on the national economy by markedly enhancing the competitiveness of US industries. Undergraduate and graduate students will be able to obtain hands-on experience in a range of advanced manufacturing concepts in addition to enhancements in related curricula. Interdisciplinary research will foster a new generation of engineers and scientists with broad and deep knowledge in the arena of thin film sensor and manufacturing technologies. Outreach science modules will be developed for high-school students. The program will also engage students from under-represented groups.

该奖项的目标是将微米和纳米尺度的高温热电偶和应变计嵌入多晶立方氮化硼材料中，并在陶瓷工装界面及其附近提供前所未有的空间和时间分辨率的热机械传感，用于制造工艺研究。它将首先关注薄膜传感器阵列的设计、制造和通过扩散连接嵌入到多晶立方氮化硼中。将对嵌入式传感器的性能进行表征，并研究在模拟恶劣条件下嵌入式传感器与陶瓷镶嵌体之间的相互作用。硬车削将被用作测试嵌入式薄膜传感器阵列和测量陶瓷刀具中的温度和应力分布的工具，以促进对加工物理的理解。如果成功，嵌入式传感器将首次提供一组在精细间隔的网格上同时测量陶瓷刀具-芯片界面上的机械和热分布的能力。这将使制造工程师能够更好地了解工艺，优化陶瓷刀具设计，并有效控制工艺。具有嵌入式薄膜传感器的先进陶瓷工具将显著增强美国产业的竞争力，对国民经济产生重大影响。本科生和研究生将能够获得一系列先进制造概念的实践经验，以及相关课程的增强。跨学科研究将培养在薄膜传感器和制造技术领域具有广泛和深厚知识的新一代工程师和科学家。将为高中生开发外展科学模块。该项目还将吸引来自代表性不足群体的学生。