Collaborative Research: Embedding of Thin Film Sensors in Advanced Ceramic Tools for Micro/Nano Scale Thermomechanical Measurements in and Near Tool-Workpiece Interface

该奖项的目的是在多晶立方氮化硼材料中嵌入微米和纳米级高温热电偶和应变计，并在陶瓷工具-工作界面处和附近提供具有前所未有的空间和时间分辨率的热机械传感，用于制造过程研究。它将首先集中在设计，制造，并通过扩散键合的薄膜传感器阵列嵌入到多晶立方氮化硼。将表征嵌入式传感器的性能，并研究模拟恶劣条件下嵌入式传感器与陶瓷插入件之间的相互作用。硬车削将被用作测试嵌入式薄膜传感器阵列和测量陶瓷刀具中的温度和应力分布的工具，以促进对加工物理的理解。如果成功的话，嵌入式传感器将首次提供在陶瓷工具-芯片界面的机械和热分布的精细间隔网格上同时测量的能力。这将使制造工程师能够更好地了解工艺，优化陶瓷刀具设计，并有效地控制工艺。嵌入薄膜传感器的先进陶瓷模具将通过显着提高美国工业的竞争力对国民经济产生重大影响。本科生和研究生将能够获得一系列先进制造概念的实践经验，以及相关课程的增强。跨学科研究将培养新一代的工程师和科学家，他们在薄膜传感器和制造技术的竞技场中拥有广泛而深入的知识。将为高中学生开发推广科学单元。该计划还将吸引来自代表性不足群体的学生。

The objective of this award is to embed micro- and nano-scale high temperature thermocouples and strain gauges in polycrystalline cubic boron nitride materials, and to provide thermomechanical sensing with unprecedented spatial and temporal resolution at and near the ceramic tool-work interface for manufacturing process studies. It will first focus on the design, fabrication, and embedding through diffusion bonding of thin film sensor arrays into polycrystalline cubic boron nitride. The performance of the embedded sensors will be characterized, and the interaction between the embedded sensors and ceramic inserts under simulated harsh conditions will be studied. Hard turning will be used as the vehicle for testing embedded thin film sensor arrays and for the measurement of temperature and stress distributions in ceramic cutting tools to advance the understanding of machining physics. If successful, the embedded sensors will offer a capability of providing, for the first time, sets of simultaneous measurements over a finely spaced grid for mechanical and thermal distributions at the ceramic tool-chip interface. This will enable manufacturing engineers to better understand the processes, optimize ceramic tool design, and to effectively control the process. Advanced ceramic tooling with embedded thin film sensors will have significant implications on the national economy by markedly enhancing the competitiveness of US industries. Undergraduate and graduate students will be able to obtain hands-on experience in a range of advanced manufacturing concepts in addition to enhancements in related curricula. Interdisciplinary research will foster a new generation of engineers and scientists with broad and deep knowledge in the arena of thin film sensor and manufacturing technologies. Outreach science modules will be developed for high-school students. The program will also engage students from under-represented groups.