课题基金 / 基金详情

Collaborative Research: Embedding of Thin Film Sensors in Advanced Ceramic Tools for Micro/Nano Scale Thermomechanical Measurements in and Near Tool-Workpiece Interface

Collaborative Research: Embedding of Thin Film Sensors in Advanced Ceramic Tools for Micro/Nano Scale Thermomechanical Measurements in and Near Tool-Workpiece Interface
合作研究:在先进陶瓷工具中嵌入薄膜传感器,用于工具-工件界面及其附近的微/纳米级热机械测量
批准号:
0824849
负责人:
Kornel Ehmann
金额:
$17.93万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2008
资助国家:
美国
项目状态:
已结题
起止时间:
2008-09-01 至 2012-08-31

项目摘要

项目成果

Kornel Ehmann的其他基金

相似基金

相关文献

中文摘要
翻译
点击翻译按钮获取中文摘要
英文摘要
The objective of this award is to embed micro- and nano-scale high temperature thermocouples and strain gauges in polycrystalline cubic boron nitride materials, and to provide thermomechanical sensing with unprecedented spatial and temporal resolution at and near the ceramic tool-work interface for manufacturing process studies. It will first focus on the design, fabrication, and embedding through diffusion bonding of thin film sensor arrays into polycrystalline cubic boron nitride. The performance of the embedded sensors will be characterized, and the interaction between the embedded sensors and ceramic inserts under simulated harsh conditions will be studied. Hard turning will be used as the vehicle for testing embedded thin film sensor arrays and for the measurement of temperature and stress distributions in ceramic cutting tools to advance the understanding of machining physics. If successful, the embedded sensors will offer a capability of providing, for the first time, sets of simultaneous measurements over a finely spaced grid for mechanical and thermal distributions at the ceramic tool-chip interface. This will enable manufacturing engineers to better understand the processes, optimize ceramic tool design, and to effectively control the process. Advanced ceramic tooling with embedded thin film sensors will have significant implications on the national economy by markedly enhancing the competitiveness of US industries. Undergraduate and graduate students will be able to obtain hands-on experience in a range of advanced manufacturing concepts in addition to enhancements in related curricula. Interdisciplinary research will foster a new generation of engineers and scientists with broad and deep knowledge in the arena of thin film sensor and manufacturing technologies. Outreach science modules will be developed for high-school students. The program will also engage students from under-represented groups.
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
Multi-Scale Multi-Material Printing of 3D Bead Arrays via Self-Focused Electrohydrodynamic Jets
  • 批准号:
    1934350
  • 项目类别:
    Standard Grant
  • 资助金额:
    $44.47万
  • 财政年份:
    2020
  • 负责人:
    Kornel Ehmann
  • 依托单位:
Magnetically-Assisted Laser-Induced Plasma Micro-Machining for Flexible and Fast Texturing of Functional Surfaces
  • 批准号:
    1563244
  • 项目类别:
    Standard Grant
  • 资助金额:
    $30.0万
  • 财政年份:
    2016
  • 负责人:
    Kornel Ehmann
  • 依托单位:
CPS: Synergy: An Integrated Simulation and Process Control Platform for Distributed Manufacturing Process Chains
  • 批准号:
    1646592
  • 项目类别:
    Standard Grant
  • 资助金额:
    $70.13万
  • 财政年份:
    2016
  • 负责人:
    Kornel Ehmann
  • 依托单位:
Collaborative Research: Fundamental Study and Pragmatic Enhancement of Rock Cutting/Drilling for Oil Exploration through Embedded Thin Film Sensor Arrays in PCD Inserts
  • 批准号:
    1301127
  • 项目类别:
    Standard Grant
  • 资助金额:
    $12.5万
  • 财政年份:
    2013
  • 负责人:
    Kornel Ehmann
  • 依托单位:
国内基金
海外基金
Research on Quantum Field Theory without a Lagrangian Description
  • 批准号:
    24ZR1403900
  • 项目类别:
    省市级项目
  • 资助金额:
    --
  • 批准年份:
    2024
  • 负责人:
    SATOSHI NAWATA
  • 依托单位:
Cell Research
Cell Research
Cell Research (细胞研究)