Collaborative Research: Embedding of Thin Film Sensors in Advanced Ceramic Tools for Micro/Nano Scale Thermomechanical Measurements in and Near Tool-Workpiece Interface

合作研究：在先进陶瓷工具中嵌入薄膜传感器，用于工具-工件界面及其附近的微/纳米级热机械测量

• 批准号: 0824849
• 负责人: Kornel Ehmann
• 金额: $ 17.93万
• 依托单位: Northwestern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-09-01 至 2012-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0824849&HistoricalAwards=false
• 关键词: Collaborative; Research; Embedding; Thin; Film

The objective of this award is to embed micro- and nano-scale high temperature thermocouples and strain gauges in polycrystalline cubic boron nitride materials, and to provide thermomechanical sensing with unprecedented spatial and temporal resolution at and near the ceramic tool-work interface for manufacturing process studies. It will first focus on the design, fabrication, and embedding through diffusion bonding of thin film sensor arrays into polycrystalline cubic boron nitride. The performance of the embedded sensors will be characterized, and the interaction between the embedded sensors and ceramic inserts under simulated harsh conditions will be studied. Hard turning will be used as the vehicle for testing embedded thin film sensor arrays and for the measurement of temperature and stress distributions in ceramic cutting tools to advance the understanding of machining physics. If successful, the embedded sensors will offer a capability of providing, for the first time, sets of simultaneous measurements over a finely spaced grid for mechanical and thermal distributions at the ceramic tool-chip interface. This will enable manufacturing engineers to better understand the processes, optimize ceramic tool design, and to effectively control the process. Advanced ceramic tooling with embedded thin film sensors will have significant implications on the national economy by markedly enhancing the competitiveness of US industries. Undergraduate and graduate students will be able to obtain hands-on experience in a range of advanced manufacturing concepts in addition to enhancements in related curricula. Interdisciplinary research will foster a new generation of engineers and scientists with broad and deep knowledge in the arena of thin film sensor and manufacturing technologies. Outreach science modules will be developed for high-school students. The program will also engage students from under-represented groups.

该奖项的目的是嵌入多晶立方硝酸盐材料中的微型和纳米尺度的高温热电偶和应变仪，并在用于制造工艺研究的陶瓷工具界面和附近，提供前所未有的空间和时间分辨率的热机械感测。首先，它将通过将薄膜传感器阵列扩散键合到多晶立方硼中，将其集中在设计，制造和嵌入。将表征嵌入式传感器的性能，并将研究嵌入式传感器与模拟恶劣条件下的陶瓷插入物之间的相互作用。硬转动将用作测试嵌入式薄膜传感器阵列的车辆，并在陶瓷切割工具中测量温度和应力分布，以提高对加工物理的理解。如果成功的话，嵌入式传感器将首次提供在陶瓷工具芯片界面上的机械和热分布的细节上，首次提供一组同时测量。这将使制造工程师能够更好地理解这些过程，优化陶瓷工具设计并有效地控制该过程。带有嵌入式薄膜传感器的先进陶瓷工具将通过显着增强美国行业的竞争力来对国民经济产生重大影响。除了增强相关课程的增强外，本科生和研究生将能够在一系列高级制造概念中获得动手体验。跨学科的研究将培养新一代的工程师和科学家，在薄膜传感器和制造技术领域具有广泛而深刻的知识。外展科学模块将为高中生开发。该计划还将吸引来自代表性不足的小组的学生。