Collaborative Research: Improvement of MEMS Performance by Structural Vibrations - Theory and Practical Implementations

合作研究：通过结构振动提高 MEMS 性能 - 理论和实际实现

• 批准号: 0826580
• 负责人: Zayd Leseman
• 金额: $ 24万
• 依托单位: University of New Mexico
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-08-15 至 2012-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0826580&HistoricalAwards=false
• 关键词: Collaborative; Research; Improvement; MEMS; Performance

Sticking contact (adhesion) between moving components in Micro-ElectroMechanical Systems (MEMS) is a major problem limiting reliability. Sticking contact, referred to as ?stiction failure,? is fatal to the component; stiction prevents the individual component from operating properly and, hence, jeopardizes the reliability of the overall device. Preliminary experiments, performed by the investigators, indicate that electrically induced structural vibrations can lead to the initiation of stick-release. The purpose of this research endeavor is to create a theoretical foundation, validated by experiments on real MEMS devices, for using electrical excitation to drive MEMS components in order (i) to prevent adhesion (through mechanical dithering) and (ii) to repair stiction failures. This non-contacting (noninvasive) approach will enable stick-prevention and stick-release of a component without causing damage to the component or its neighbors. Moreover, the electrical actuation may be built into the MEMS chip, using the existing functionality of the chip to overcome adhesion. This is a cost effective, easy-to-implement approach that may be used in-situ. Also note that the framework developed here will also be applicable on nano-scale devices (NEMS). This work is broken into an experimental and theoretical component. The experimental portion of this project involves using simplified geometries (micro-cantilevers) and real MEMS components (gear systems, mirrors, etc.) to validate the model results and to demonstrate the utility of electrically induced vibrations in both stiction prevention and stiction repair. Theoretical models will be created to develop a more complete understanding of the fundamental mechanics involved in the dithering and stick-release processes.Currently there are no commercially available MEMS or Nano-Electro MechanicalSystems (NEMS) with contacting/sliding parts due to the reliability issue caused by adhesion failures. To enable their commercial introduction, practical techniques for the prevention of stiction and repair of failed devices under normal service conditions are required. The proposed methodology is a viable approach, enabling commercialization. The general framework developed here may be extended to nano-devices. The educational portion of this project integrates MEMS vibrations testing into a required undergraduate lab course. This will give students hands-on experience with MEMS and will demonstrate that near field forces (negligible in macro-scale tests) may not be ignored in all micro-scale tests. Outstanding undergraduates and particularly those from under-represented groups (note that the UNM is a Hispanic Serving Institution (HSI)), will be involved in the research.

在微机电系统（MEMS）中，运动部件之间的粘接是影响系统可靠性的主要问题。粘接，简称？静摩擦失败?对组件是致命的；粘滞会影响单个部件的正常工作，从而影响整个设备的可靠性。研究人员进行的初步实验表明，电诱导的结构振动可以导致棍子释放的开始。本研究的目的是创建一个理论基础，并通过在实际MEMS器件上的实验验证，使用电激励来驱动MEMS元件，以便(i)防止粘附（通过机械抖动）和（ii）修复粘附故障。这种非接触式（非侵入式）方法可以防止和释放组件的粘着，而不会对组件或其相邻部件造成损坏。此外，电驱动可以内置到MEMS芯片中，利用芯片的现有功能来克服粘附。这是一种成本效益高、易于实施的方法，可以在现场使用。还要注意，这里开发的框架也将适用于纳米级设备（NEMS）。这项工作分为实验部分和理论部分。该项目的实验部分包括使用简化的几何形状（微悬臂）和真实的MEMS组件（齿轮系统、反射镜等）来验证模型结果，并展示电诱发振动在预防和修复粘滞方面的实用性。将建立理论模型，以更全面地了解涉及抖动和释放杆过程的基本力学。目前还没有商用MEMS或纳米机电系统（NEMS）与接触/滑动部件，由于粘连故障引起的可靠性问题。为了使其商业化，需要在正常使用条件下防止粘滞和修复故障设备的实用技术。所提出的方法是一种可行的方法，可以实现商业化。这里发展的一般框架可以扩展到纳米器件。该项目的教育部分将MEMS振动测试整合到必修的本科实验课程中。这将为学生提供MEMS的实践经验，并将证明近场力（在宏观尺度测试中可以忽略不计）在所有微观尺度测试中都不能忽略。优秀的本科生，特别是那些来自代表性不足的群体（注意，新墨西哥大学是一所西班牙裔服务机构（HSI）），将参与研究。