SBIR Phase I: Nanomaterial-Based Room Temperature Conductive Paste
SBIR Phase I: Nanomaterial-Based Room Temperature Conductive Paste
批准号:
0839504
负责人:
David Schultz
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2009
资助国家:
美国
项目状态:
已结题
起止时间:
2009-01-01 至 2009-11-30
中文摘要
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英文摘要
This Small Business Innovative Research Phase I project will enable the development of a lead free electrical conductive adhesive(ECA) with improved mechanical and electrical properties. For the ECA to be electrically conductive, the conducting constituents need to reach a percolation threshold value, such that there is sufficient contact to form a conductive network path.Due to the human health and environmental concerns from the use of tin-lead alloy solders, electrically conductive adhesives (ECAs) are gaining use as an alternative to solder technology in micro-electrical packaging. The successful commercialization of this technology will allow the development of environmentally friendly electronics.
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