TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware

TC：大型：协作研究：3Dsec：通过 3D 集成硬件实现值得信赖的系统安全

• 批准号: 0910581
• 负责人: Ryan Kastner
• 金额: $ 45万
• 依托单位: University of California-San Diego
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-03-01 至 2014-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0910581&HistoricalAwards=false
• 关键词: TC; Large; Collaborative; Research; 3Dsec

While hardware resources for computation and data storage are now abundant,economic factors prevent specialized hardware security mechanisms from beingintegrated into commodity parts. System owners are caught between the need to exploitcheap, fast, commodity microprocessors and the need to ensure that critical securityproperties hold.This research will explore a novel way to augment commodity hardware after fabricationto enhance secure operation. The basic approach is to add a separate silicon layer,housing select security features, onto an existing integrated circuit. This 3-D Integrationdecouples the function and economics of security policy enforcement from theunderlying computing hardware. As a result, security enhancements are manufacturingoptions applicable only to those systems that require them, which resolves theeconomic quandary. We plan to identify a minimal and realizable set of circuit-levelsecurity capabilities enabled by this approach, which can be judiciously controlled bythe software layers. This will significantly assist in reducing both the software complexityoften associated with security mechanisms and system vulnerabilities.This research introduces a fundamentally new method to incorporate securitymechanisms into hardware and has the potential to significantly shift the economics oftrustworthy systems. A broader impact will result through collaborative and educationalactivities. Graduate and undergraduate student research associates will transferknowledge to future teachers, researchers and Information Assurance professionals;and project publications will provide direct technical transfer to the embedded-systemsand hardware-design communities.

尽管用于计算和数据存储的硬件资源现在大量，但经济因素阻止了专门的硬件安全机制融入商品部件。系统所有者在利用速度，快速，商品微处理器的需求与确保关键安全性持有的需求之间被抓住。这项研究将探索一种新颖的方法来增强商品硬件的新方法，以增强安全操作。基本方法是将单独的硅层（外壳选择的安全功能）添加到现有的集成电路中。这个3-D集成decou将安全策略执法的功能和经济性从计算硬件中实施。结果，安全性增强功能仅适用于需要它们的系统，这些系统可以解决经济困难。我们计划确定这种方法启用的最低限度和可实现的电路级安全性功能，该方法可以由软件层明智地控制。这将大大有助于降低与安全机制和系统漏洞相关的软件复杂性。这项研究从根本上引入了一种将安全机构纳入硬件中的新方法，并有可能显着转移TrustWorthy Systems的经济学。通过协作和教育活动将产生更广泛的影响。研究生和本科生研究伙伴将把知识转移到未来的教师，研究人员和信息保证专业人员中；项目出版物将直接向嵌入式系统和硬件设计社区提供直接的技术转移。