Ultra-Low-Power Complementary Logic with On-Chip Directly Assembled, Highly Adaptive 2-D Graphitic Platform

超低功耗互补逻辑，具有片上直接组装、高度自适应的 2D 图形平台

• 批准号: 1002228
• 负责人: Bin Yu
• 金额: $ 36万
• 依托单位: SUNY at Albany
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-05-15 至 2014-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1002228&HistoricalAwards=false
• 关键词: Ultra; Low; Power; Complementary; Logic

Ultra-Low-Power Complementary Logic with On-Chip Directly Assembled, Highly Adaptive 2-D Graphitic Platform (NSF # 1002228)The objective of this research is to demonstrate ultra-low-power-dissipating complementary logic prototype built upon on-chip directly assembled 2-D graphitic platform, towards achieving all-carbon electronics without involvement of scientific handyman methods. The approach is to use highly-adaptive material and device scheme to implement complementary logic configuration, combined with an innovative strategy to integrate chemical assembly into carbon circuit fabrication.Intellectual Merits: The proposed research is the first effort to demonstrate graphene complementary logic, addressing challenges towards carbon-based information processing. The research is based on innovations at several levels: (1) on-chip direct assembly and monolithic integration of patterned graphene platform, (2) employing electronically flexible, highly adaptive bilayer graphene for both switch and interconnect, (3) graphene CVD growth on ultra-thin metal catalyst, (3) implementation of complementary-channel logic switches, and (4) a versatile, seamlessly integrated carbon fabrication strategy.Broader Impacts: If successful, the research would breakthrough key identified barriers towards manufacturing-worthy carbon integrated circuits, challenging the silicon dominance. The research would make far-reaching ideas in electronics, directing the field toward a new transformative technology. From a broader view, the proposed integrated carbon fabrication platform may have impacts on a spectrum of potential applications, as well as heterogeneous integration of multiple functionalities. The research opens opportunities for students to acquire multidisciplinary experience in devices, circuits, materials, and nanofabrication. Outreach efforts will broaden participation of under-represented groups in research programs. The dissemination of research discoveries by publications and its inclusion in new curriculum development will ensure broad impacts to scientific, educational, and general public community.

超低功耗互补逻辑与片上直接组装，高度自适应二维石墨平台（nsf# 1002228）本研究的目的是展示建立在片上直接组装的二维石墨平台上的超低功耗互补逻辑原型，实现无科学手工方法参与的全碳电子。方法是使用高度自适应的材料和器件方案来实现互补的逻辑配置，并结合创新策略将化学组装集成到碳电路制造中。智力优势：拟议的研究是证明石墨烯互补逻辑的第一次努力，解决了碳基信息处理的挑战。该研究基于几个层面的创新：(1)片上直接组装和单片集成的图图化石墨烯平台，(2)采用电子柔性，高度自适应的双层石墨烯用于开关和互连，(3)石墨烯CVD生长在超薄金属催化剂上，(3)互补通道逻辑开关的实现，以及(4)通用的，无缝集成的碳制造策略。更广泛的影响：如果成功，该研究将突破制造有价值的碳集成电路的关键障碍，挑战硅的主导地位。这项研究将在电子领域产生深远的想法，将该领域引向一种新的变革性技术。从更广泛的角度来看，所提出的集成碳制造平台可能会对一系列潜在的应用以及多种功能的异构集成产生影响。该研究为学生提供了在器件、电路、材料和纳米制造方面获得多学科经验的机会。外展工作将扩大代表性不足的群体在研究项目中的参与。通过出版物传播研究发现并将其纳入新课程开发将确保对科学、教育和一般公众产生广泛影响。