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Micromechanical removal processes during material processing technologies with fluid-coupled particle systems

使用流体耦合颗粒系统的材料加工技术中的微机械去除过程

基本信息

批准号：
199949330
负责人：
Professor Dr.-Ing. Christoph Brücker
金额：
--
依托单位：
Institut für Mechanik und Fluiddynamik
依托单位国家：
德国
项目类别：
Research Grants
财政年份：
2011
资助国家：
德国
起止时间：
2010-12-31 至 2018-12-31
项目状态：
已结题

来源：
https://gepris.dfg.de/gepris/projekt/199949330?language=en
关键词：
Micromechanical removal processes during material

项目摘要

In this project, the interaction of solid particle systems and fluid flow is investigated on the micromechanical scale for wet material processing technologies with free movable abrasive particles as wire sawing, lapping or polishing. The interaction of sharp-edged three-dimensional particles among each other and with the deformable tools or workpiece are modeled by means of the discrete element method. The actual material removal mechanism caused by microscopic fracture processes is simulated and quantified. The phenomena in the shear gap and sawing kerf are experimentally investigated in special purpose built experimental devices by means of stereo-microscopy using high-speed cameras. The aim of the project is to understand the contact dynamics of particle systems in shear flows interacting with the surfaces at high velocities and rotations, which is affected by the roughness profiles and the material properties of particles and walls.In the second phase of the project we focus our experimental and numerical studies on the feedback of the particle motion onto the fluid flow. This will be achieved in the simulations by a complete coupling of the discrete element method and a fluid solver. In this way, such effects are captured like fluid interference by resting particles or particle clusters, local pressure variations in the fluid as well as separation of particles. Based on the planned fundamental research using a shear flow model with well-defined boundary conditions, we will apply the developed methods to the wire-sawing technique for silicon wafers to establish a correlation with the macroscopic technological parameters as removal rate and surface quality. Since these methods are widely distributed in materials processing technologies, a remarkable enhancement of efficiency and product quality are expected.

在本项目中，固体颗粒系统和流体流动的相互作用在微观尺度上进行了研究，用于具有自由移动磨料颗粒的湿材料加工技术，如线锯，研磨或抛光。用离散元法模拟了三维尖棱颗粒相互间以及与变形刀具或工件的相互作用。模拟和量化了微观断裂过程引起的实际材料去除机理。在专用实验装置上，利用高速摄影机，用体视显微镜对剪切间隙和锯切缝现象进行了实验研究。该项目的目的是了解剪切流中颗粒系统与高速旋转表面相互作用的接触动力学，这是由粗糙度轮廓和颗粒和壁的材料属性的影响。在该项目的第二阶段，我们专注于我们的实验和数值研究的颗粒运动到流体流动的反馈。这将在模拟中通过离散单元法和流体求解器的完全耦合来实现。以这种方式，这样的效果被捕获，如静止颗粒或颗粒簇的流体干扰、流体中的局部压力变化以及颗粒的分离。基于计划的基础研究，使用剪切流模型与明确的边界条件，我们将开发的方法应用于硅晶片的线锯技术，以建立与宏观工艺参数的相关性，如去除率和表面质量。由于这些方法广泛分布在材料加工技术中，因此可以显著提高效率和产品质量。