EAGER/Collaborative Research: Exploratory Study of Nano Ultrasonic Machining Process

协同研究：EAGER：纳米超声加工工艺的探索性研究本合作研究工作将研究振动辅助脆性材料特定目标纳米加工的可行性。研究的目标是通过严格的分析和实验研究，了解材料去除机制，可加工特征尺寸范围，加工参数对加工特征生产率的影响，以及纳米超声加工过程的不确定性和可持续性，从而获得纳米超声加工过程的基础知识。本探索性研究将使用商用原子力显微镜（AFM）作为实验平台，进行超声纳米磨料加工和纳米测量。研究的范围包括一个过程模型公式来预测材料的去除，基于一组适当的过程参数。科学障碍（如缺乏纳米尺度模型的韧性和脆性模式侵蚀知识基础）和技术障碍（如磨料粉在超声频率和纳米尺度下的行为）是本研究的主要风险。然而，如果成功的话，这个项目将为电子、医疗、汽车和航空工业中使用的脆性材料的精确纳米加工带来一种新的、非常有效的工艺。这项研究的成功有望对各种导电和非导电材料的目标特异性纳米可加工性产生变革性影响。潜在的应用包括高精度DNA检测设备、互连纳米封装和电子制造的低成本掩模校正。这项研究的结果可以作为磨料基微精加工技术的前奏。该项目的成果将与我们的其他纳米加工活动协同作用，为辛辛那提大学和内布拉斯加大学林肯分校的研究生和本科生提供制造课程的教育。这一经验将用于在代表性不足的少数民族中培养培训和学习，并加强与地区学校社区的持续伙伴关系。这项研究的结果将通过同行评审的出版物、报告和大学？美国国家科学基金会网站、专业协会会议上的短期课程以及向NSF提交的报告。

Collaborative research: EAGER: Exploratory Study of Nano Ultrasonic Machining ProcessAbstract. This collaborative research work will study the feasibility of vibration assisted target specific nanoscale machining of brittle material. The goal of the research is to generate fundamental knowledge of nano ultrasonic machining process by conducting rigorous analytical and experimental investigations to understand the mechanism of material removal, the range of machinable feature sizes, effect of machining parameters on the productivity of the machined feature, and the uncertainty and sustainability of the nano ultrasonic machining process. A commercial atomic force microscope (AFM) will be used in this exploratory research as an experimental platform to perform ultrasonic nano abrasive machining, as well as nano measurement. The scope of the research includes a process model formulation to predict the material removal, based on appropriate set of process parameters. The scientific barriers such as lack of knowledge base of ductile and brittle mode erosion at nano scale models, and technical barriers such as behavior of abrasive powder at ultrasonic frequency and nanoscale, form the main risks of this study. However, if successful, this project will lead to a new and very effective process for the accurate nano scale machining of brittle materials used in electronic, medical, automotive and aviation industries.Success of this research is expected to have a transformative effect on the target specific nanomachinability of a wide variety of both conductive and nonconductive materials. Potential applications include high precision DNA detection devices, interconnects nano packaging, and low cost mask correction for electronics manufacturing. Results of this study may serve as prelude to abrasive based picofinishing technology. Outcome of this project will be synergized with our other nano machining activities to educate graduate and undergraduate students in manufacturing courses offered at University of Cincinnati and University of Nebraska-Lincoln. This experience will be used to nurture training and learning within underrepresented minorities and to augment the ongoing partnership with area school community. The results of this research will be disseminated through peer-reviewed publications, presentations and university?s websites, short courses at professional society meetings and reports to NSF.