Modeling and Analysis of Material Removal and Tool Wear in Micro Ultrasonic Machining

微超声加工中材料去除和刀具磨损的建模与分析

• 批准号: 0728294
• 负责人: Kamlakar Rajurkar
• 金额: --
• 依托单位: University of Nebraska-Lincoln
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2010-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0728294&HistoricalAwards=false
• 关键词: Modeling; Analysis; Material; Removal; Tool

The research objective of this award is to establish a fundamental knowledge base of the micro ultrasonic machining process thorough rigorous analytical and experimental investigations aimed at an understanding of the mechanism of material removal, the range of machinable feature sizes, effect of machining parameters on the productivity and surface integrity of the machined process and the reliability of the process. Specifically, this work will result in a mechanistic model of the micro ultrasonic machining process based on abrasive-workpiece interaction; an extensive data base for material removal rates, tool wear rates, and surface damage, and software and hardware for static load monitoring.This research will enable economic micromachining of a wide variety of electrically nonconductive and chemically inert, hard and brittle materials used in electronic, medical and automotive industries. Besides providing input to the ultrasonic machining process machine tool industry and its application, this research will enhance the undergraduate and graduate manufcaturing course content. This project will be used to nurture training and learning with in the underrepresented minorities. The project results will be shared with academia and industry though publications and presentations.

该奖项的研究目标是通过严格的分析和实验研究建立微超声加工过程的基本知识库，旨在了解材料去除机制，可加工特征尺寸范围，加工参数对生产率和加工过程的表面完整性以及过程的可靠性的影响。具体而言，这项工作将导致一个基于磨料-工件相互作用的微超声加工过程的机理模型;一个广泛的数据库，用于材料去除率，刀具磨损率，表面损伤，软件和硬件的静态载荷监测。这项研究将使经济的微加工的各种不导电和化学惰性，硬和脆性材料用于电子，医疗和汽车行业。本研究除了可提供超音波加工制程与工具机产业应用之参考外，也可充实本科生与研究生之课程内容。该项目将用于促进代表性不足的少数民族的培训和学习。项目成果将通过出版物和演示文稿与学术界和工业界分享。