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SBIR Phase I: Chemically Vapor Deposited Hydrophobic Dielectric Polymer Thin Films

SBIR Phase I: Chemically Vapor Deposited Hydrophobic Dielectric Polymer Thin Films
SBIR 第一阶段:化学气相沉积疏水性介电聚合物薄膜
批准号:
1143160
负责人:
Aleksandr White
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2012
资助国家:
美国
项目状态:
已结题
起止时间:
2012-01-01 至 2012-12-31

项目摘要

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中文摘要
翻译
这个小型企业创新研究第一阶段项目将探索用于电子纸(E纸)显示器的疏水介质涂层的失效机制。具体地说,电润湿(E纸)显示器需要这样的涂层来调节有色流体的接触角并产生视觉图像。为了提供足够的电绝缘,传统的介质涂层必须在需要高电压操作的厚度下沉积。沉积在这些电介质上的传统疏水涂层受到电解液缠绕(这会随着时间的推移削弱电润湿效应)和较差的基板一致性的阻碍。我们将设计改进的疏水介电材料,以解决传统产品的缺点。具体地说,我们将开发新型疏水介电聚合物涂料,展示所需的薄度、均匀性和性能的组合。第一阶段的工作将基于介电故障测试和电润湿调制测试来确定有前景的涂层配方。在第二阶段,将制定战略,将介质涂层缺陷减少到制造水平,着眼于商业化。该项目的更广泛影响/商业潜力体现在该项目在薄介质涂层方面的预期进展,这种涂层应用广泛。这些涂层同时暴露在离子溶液和电势中的应用尤其具有挑战性。这些应用包括电子纸(电湿)显示器、植入式医疗设备(例如神经假体、心脏起搏器)和军用电子产品。在这些应用中,迫切需要防止水和离子进入,以避免封装电子设备的短路和腐蚀。薄介质涂层越来越多地被视为更笨重、更昂贵的密封包装的可行替代品。虽然薄的无机涂层经常被用于类似的情况,但随之而来的与这些材料相关的高成本和高加工温度可能是令人望而却步的。有机聚合物密封剂通常不被认为是密封性的,但要求电子设备密封性的假设往往是错误的。预计该项目将促进涂层性能和实际设备需求之间的更好匹配,以及制造可靠、低成本的电子产品。
英文摘要
This Small Business Innovation Research Phase I project will explore the failure mechanisms associated with hydrophobic dielectric coatings used in electronic paper (E paper) displays. Specifically, electrowetting (E paper) displays require such coatings in order to modulate the contact angle of colored fluids and produce visual images. In order to provide adequate electrical insulation, conventional dielectric coatings must be deposited at thicknesses that require high voltage operation. Conventional hydrophobic coatings deposited on top of these dielectrics are encumbered by electrolyte entrapment (which diminishes the electrowetting effect over time) and poor substrate conformality. We will design improved hydrophobic dielectrics that address the shortcomings of conventional offerings. Specifically, we will develop novel hydrophobic dielectric polymer coatings that exhibit the required combination of thinness, uniformity, and performance. The Phase I effort will identify promising coating recipes based on dielectric failure testing and electrowetting modulation testing. In Phase II, strategies will be developed for reducing dielectric coating defects to manufacturing levels, with an eye towards commercialization.The broader impact/commercial potential of this project is embodied in the project's anticipated advance of the state-of-the-art in thin dielectric coatings, which are used in a wide range of applications. Applications in which these coatings are simultaneously exposed to ionic solutions and electrical potentials are particularly challenging. Such applications include E paper (electrowetting) displays, implanted medical devices (e.g. neuroprosthetics, cardiac pacemakers), and military electronics. The need to prevent ingress of water and ions is acute in these applications, avoiding the short circuiting and corrosion of encapsulated electronics. Thin dielectric coatings are increasingly being viewed as viable alternatives to bulkier, more expensive hermetic packaging. While thin inorganic coatings have often been employed in similar cases, the attendant high cost and high processing temperatures associated with these materials may be prohibitive. Organic polymer encapsulants are generally not considered to be hermetic, but the assumption that electronic device hermeticity is required is often erroneous. It is anticipated that this project will facilitate both a better match between coating performance and actual device needs, and the manufacturing of reliable, lower cost electronics.
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