Workshop on Emerging Technologies for Interconnects

随着处理核心数量的不断增加，无论是在消费类设备的单个插槽中，还是在多个插槽插入器之间，互连都成为计算行业面临的最前沿挑战。虽然有证据表明，传统的金属互连的替代品将需要满足未来的性能需求和功率限制，在这些领域的研究已在很大程度上限制在范围内的特定领域的计算堆栈，并取得了很小的进展，跨问题的子域。 因此，迫切需要进行从物理到系统的全面研究，并生产出比今天更复杂的原型和开发工具，以实现商业应用。互联新兴技术研讨会将汇集关键研究人员，行业开发人员，和项目经理，以便为新兴互连技术的研究和商业应用确定一个议程。 在关于互连新兴技术的“最新发展水平”的演讲和讨论之后，将举行分组会议和讨论。这些会议将确定和阐明关键的研究挑战，以及潜在的最有前途的解决方案/方向，并制定建议的大规模国家战略和研究议程。 更广泛的影响将是消除关键

The shift to an ever-increasing number of processing cores--within asingle socket in consumer devices and across multiple sockets inservers--has brought interconnects to the forefront of the challengesfacing the computing industry. While evidence suggests thatalternatives to conventional metal interconnects will be needed tomeet future performance demands and power constraints, research inthese areas has been largely limited in scope to specific areas of thecomputing stack, and little progress has been made across problemsub-domains. Thus, there is a dire need for holistic research effortsspanning the stack from physics to systems, and that produceprototypes and development tools that are of much greatersophistication than exist today in order to enable commercialadoption.The Workshop on Emerging Technologies for Interconnects will bringtogether key researchers, industry developers, and program managers inorder to define an agenda for the research and commercial adoption ofemerging interconnect technologies. Presentations and discussions onthe "state of the state-of-the-art" of emerging technologies forinterconnects will be followed by break-out sessions and discussions.These sessions will identify and articulate the key researchchallenges, and potentially most promising solutions/directions, andchart the recommended larger-scale national strategy and researchagenda. The broader impact will be the elimination of the key