Combining Large-area Electronics with High-performance Computation for Scalable Ambient Intelligence

将大面积电子器件与高性能计算相结合，实现可扩展的环境智能

• 批准号: 1202168
• 负责人: Naveen Verma
• 金额: $ 36万
• 依托单位: Princeton University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-07-01 至 2016-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1202168&HistoricalAwards=false
• 关键词: Combining; Large; area; Electronics; performance

Intellectual merit. The objective of this research is to investigate how high-performance silicon integrated circuits can work synergistically with a technology known as large-area electronics to increase the scope of functionality that electronic systems can provide. The proliferation of integrated circuits into our environments means that electronics has the potential to acquire a large number of signals that can be of high importance to us. It also means that electronics must exist unobtrusively in this space. This raises the need for systems that are (1) capable of large-scale physical interfacing through many sensing channels and (2) able to power themselves through embedded energy-harvesting devices, all in a compliant form factor. Large-area electronics is based on low-temperature processing of thin films. This enables diverse materials to be integrated to form a broad range of transducers. It also enables the use of plastic substrates, which can be conformal and physically large. Although transistors are also possible, these have orders of magnitude lower performance and energy efficiency than high-performance silicon integrated circuits. To enable extensive physical interfaces while also retaining high-performance signal-acquisition and computation capabilities, the two technologies must be combined. Such an approach, however, poses substantial scalability challenges. This study investigates methodologies and architectures that leverage devices from both technology domains to achieve highly-scalable and efficient means of exchanging data and power signals across the technology boundaries. Broader impacts. Electronics has demonstrated tremendous value in a wide range of applications. This research lays the ground work for electronics to interface with physical systems on a very large scale. This could lead to transformational systems for applications such as high-resolution sensing skins for monitoring structural health, interactive surfaces for visual computing, etc. In addition to important societal implications, such applications, due to their scale, could become a key driver for the electronics industry. This research develops specific design methodologies that will enable directed technical efforts in conjunction with the increased application scope, helping to focus industry efforts. This research will engage a new generation of engineers, particularly from underrepresented groups, by developing systematic principles for system design, from devices to applications. Both in outreach activities and in university education, the new forms possible for electronic systems will serve to illustrate the diverse applications that engineering has the potential to impact.

智力上的优点。这项研究的目的是调查高性能硅集成电路如何与一种称为大面积电子技术的技术协同工作，以增加电子系统可以提供的功能范围。集成电路进入我们的环境意味着电子学有可能获取大量对我们来说非常重要的信号。这也意味着电子产品必须悄悄地存在于这个领域。这增加了对以下系统的需求：(1)能够通过多个传感通道进行大规模物理连接；(2)能够通过嵌入式能量收集设备为自身供电，所有这些都在符合要求的外形中。大面积电子学的基础是薄膜的低温加工。这使得不同的材料可以集成在一起，形成广泛的换能器。它还允许使用塑料衬底，塑料衬底可以是保形的，物理上也很大。虽然晶体管也是可能的，但它们的性能和能效比高性能硅集成电路低几个数量级。要实现广泛的物理接口，同时保持高性能的信号采集和计算能力，必须将这两种技术结合起来。然而，这种方法带来了巨大的可伸缩性挑战。本研究调查了利用这两个技术领域的设备实现跨技术边界交换数据和电源信号的高度可扩展且高效的手段的方法和架构。更广泛的影响。电子学在广泛的应用中显示出巨大的价值。这项研究为电子学与物理系统的大规模接口奠定了基础。这可能导致应用程序的变革性系统，如用于监测结构健康的高分辨率传感皮肤、用于视觉计算的交互表面等。除了重要的社会影响外，由于其规模，此类应用程序可能成为电子行业的关键驱动力。这项研究开发了特定的设计方法，将使定向的技术工作与扩大的应用范围相结合，有助于集中行业努力。这项研究将通过制定从设备到应用的系统设计系统原则，吸引新一代工程师，特别是来自代表不足的群体的工程师。无论是在外联活动中还是在大学教育中，电子系统可能出现的新形式都将有助于说明工程学可能产生影响的各种应用。