SHF: SMALL: Embedded Cooling of High-Performance ICs Using Novel Nanostructured Thermoelectrics: Multiscale Software Development and Device Optimization

SHF：小型：使用新型纳米结构热电材料的高性能 IC 嵌入式冷却：多尺度软件开发和设备优化

• 批准号: 1218839
• 负责人: Shaikh Ahmed
• 金额: $ 14.99万
• 依托单位: Southern Illinois University at Carbondale
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-07-01 至 2017-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1218839&HistoricalAwards=false
• 关键词: SHF; SMALL; Embedded; Cooling; Performance

Recently, nano-enabled thermoelectric devices have attracted much attention for cost-effective embedded (hot spot) and portable cooling applications such as in high-performance integrated circuits, lasers, and medical and food chillers. However, efficiency of this novel technology, to a large extent, relies on: (i) Fine-tuning the basic material parameters (Seebeck coefficient, electrical conductivity, and thermal conductivity) that are strong function of coupled structural-electronic processes at the nanoscale; and ii) System-level optimization considering the geometry, substrates, and contacts. These critical and challenging tasks have not yet been fully addressed and assessed experimentally and, therefore, demand a careful numerical investigation. As a response to this need, the goal of this research is to design nano-enabled embedded thermoelectric cooling modules offering improved efficiency and the ability to be operated at high temperature. For this purpose, a multiscale simulator will be integrated, where the material and device parameters will be obtained atomistically using first-principles and molecular dynamics simulations and will eventually be used in the system level design and optimization. The multiscale simulation platform will expose new degrees-of-freedom available at nanoscale (such as engineering density-of-states, effective mass, structural relaxation, localized disorder, surface-to-volume ratio, internal polarization, and non-degeneracy) and create transformative design routes for boosting efficiency and reliability of thermoelectric systems.Thermoelectric technology offers high power density and fast response, is vibration and noise free, small and lightweight, and environmentally safe. Besides applications in embedded and potable coolers, thermoelectric devices are used as power sources for remote telecommunication, navigation, and radioisotope generator for space vehicles, and has potential promise in heat scavenging in vehicle exhaust system. Solid-state thermoelectrics will thus diversify and help sustain the growth in the global semiconductor market. The project also encompasses significant education and outreach activities. Graduate students will be engaged in software development, integration, and data analysis. In addition, senior design projects will be developed for undergraduate students. The simulator, along with the documentation, tutorials, case studies, will be freely distributed under the GNU public use license and an educational version (with a graphical user interface) will be deployed on NSF?s nanoHUB.org for the broader community for use in research and class-room teaching activities.

最近，支持纳米的热电设备引起了人们对具有成本效益的嵌入式（热点）和便携式冷却应用的关注，例如在高性能集成电路，激光器以及医疗和食品冷却器中。但是，这项新技术在很大程度上取决于：（i）对基本材料参数（Seebeck系数，电导率和导热率）进行微调，它们是纳米级耦合结构电子过程的强大功能； ii）考虑几何形状，底物和触点，系统级优化。这些批判性和挑战性的任务尚未通过实验进行充分解决和评估，因此需要仔细的数值研究。作为对这种需求的响应，这项研究的目的是设计启用纳米的嵌入式热电冷却模块，以提高效率和在高温下操作的能力。为此，将集成一个多尺度模拟器，其中将使用第一原理和分子动力学仿真来原子能获得材料和设备参数，并最终将用于系统级别的设计和优化。多尺度仿真平台将揭露纳米级可用的新的繁殖程度（例如工程密度，有效的质量，结构性放松，局部疾病，表面体积比率，内部两极化和非分数），并创建用于增强热效率和快速效率的效率的变革性设计的变革性设计途径。轻巧，环境安全。除了在嵌入式和饮用的冷却器中的应用外，热电设备还用作用于太空车辆的远程电信，导航和放射性同位素生成器的电源，并在车辆排气系统中进行热清除的潜在希望。因此，固态热电学将使全球半导体市场的增长多样化并帮助维持增长。该项目还包括重要的教育和外展活动。研究生将从事软件开发，集成和数据分析。此外，还将为本科生开发高级设计项目。模拟器以及文档，教程，案例研究将在GNU公共使用许可下自由分发，并且将在NSF？s nanohub.org上部署教育版本（具有图形用户界面），以供更广泛的社区用于研究和课堂教学活动。