Planning Grant: I/UCRC for Novel High Voltage Transmission Materials and Structures

规划补助金：I/UCRC 用于新型高压输电材料和结构

• 批准号: 1238331
• 负责人: Iwona Jasiuk
• 金额: $ 1.15万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-07-15 至 2013-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1238331&HistoricalAwards=false
• 关键词: Planning; Grant; UCRC; Novel; Voltage

Program Director' Recommendation Planning Grant: I/UCRC for Novel High Voltage Transmission Materials 1238139 University of Denver; Maciej Kumosa 1238275 Michigan Technological University; Gregory Odegard 1238331 University of Illinois at Urbana-Champaign; Iwona Jasiuk The proposed Center, comprised of the University of Denver (UD as the lead institution), Michigan Technological University (MTU) and the University of Illinois at Urbana-Champaign (UIUC), will focus on improving the design of the next generation High Voltage transmission (HV/T) conductors. The current designs of high voltage conductors based on steel (for strength) and aluminum (for conduction) strands used in regional grids exhibit several limitations. Primarily, they are limited by their propensity to sag at elevated temperatures. Through extensive collaborations amongst the sites of the proposed Center and with several leading US industries and national laboratories, entirely new classes of HV/T materials systems and structures will be designed for a variety of high energy applications. The interdisciplinary fundamental and applied research performed in the Center will make a major impact on the understanding of the combined effects of mechanical, electrical and environmental high energy fields on traditional metallic materials, novel polymer, metallic and ceramic matrix composites, highly advanced next generation nanocomposites, coatings, and others. The PIs intend to explore new manufacturing technologies in order to improve the aging resistance of traditional low cost materials for HV/T long term applications. Finally,new monitoring, self-repair and self-healing techniques for HV/T structures will be designed as a result of the proposed research activities of the Center. The proposed research will increase the fundamental knowledge of the effects of HV/T fields on the materials leading to major advances in (1) HV transmission engineering, (2) high energy generation and distribution systems, and (3) many other fields of engineering requiring the application of HV/T material systems. It will also create a diverse and interdisciplinary educational, research and business environment for (1) numerous undergraduate and graduate students, including those from underrepresented groups, funded by the research projects of the Center, (2) faculty members from a variety of disciplines, including junior faculty starting their academic careers, (3) utility, aerospace and national lab engineers and designers developing various types of HV/T materials and structures, (4) utility managers supervising HV transmission lines across the country, and many others. The Center will enhance the reputation of the American HV/T manufacturing around the world and, in particular, will improve the level of confidence among the potential users of novel HV/T structures in this country and around the world.

项目主任推荐计划资助：I/UCRC新型高压传输材料1238139丹佛大学；密歇根理工大学；Gregory Odegard 1238331伊利诺伊大学厄巴纳-香槟分校；该中心由丹佛大学（UD）、密歇根理工大学（MTU）和伊利诺伊大学厄巴纳-香槟分校（UIUC）组成，将专注于改进下一代高压传输（HV/T）导体的设计。目前在区域电网中使用的基于钢（用于强度）和铝（用于传导）股的高压导体的设计存在一些局限性。首先，它们受限于在高温下容易下垂的倾向。通过该中心各基地之间的广泛合作，以及与几家领先的美国工业和国家实验室的广泛合作，将为各种高能应用设计全新的HV/T材料系统和结构。该中心开展的跨学科基础和应用研究将对理解机械、电气和环境高能场对传统金属材料、新型聚合物、金属和陶瓷基复合材料、高度先进的下一代纳米复合材料、涂层等的综合影响产生重大影响。ppi打算探索新的制造技术，以提高传统低成本材料的耐老化性，用于HV/T的长期应用。最后，将根据中心拟议的研究活动，为高压/高压结构设计新的监测、自我修复和自我修复技术。所提出的研究将增加对高压/T场对材料影响的基础知识，从而在(1)高压传输工程，(2)高能发电和配电系统，以及(3)许多其他需要应用高压/T材料系统的工程领域取得重大进展。它还将为以下方面创造一个多样化和跨学科的教育、研究和商业环境：(1)由中心研究项目资助的众多本科生和研究生，包括那些来自代表性不足群体的学生；(2)来自不同学科的教师，包括开始学术生涯的初级教师；(3)开发各种HV/T材料和结构的公用事业、航空航天和国家实验室工程师和设计师。(4)监督全国高压输电线路的公用事业经理，以及其他许多人。该中心将提高美国HV/T制造业在全球的声誉，特别是将提高美国和世界各地新型HV/T结构潜在用户的信心水平。