EAGER: Novel Imaging Approaches for the Detection of Counterfeit ICs

典型地，电子元件经历了设计、制造、组装、分配、在系统中的使用，最后是生命周期结束的过程。过时的集成电路(IC)通常是造假者通过回收、评论和克隆的方式瞄准的目标。如果假冒零部件最终出现在国防、航空航天、汽车或医疗系统等关键应用中，后果可能是灾难性的。这项研究将提高人们对假冒、盗版和电子元器件回收利用问题的认识，这些问题将对电子元器件的创新和增长、权利人和消费者产生积极的社会经济影响。由于假冒IC的种类、部件类型以及与假冒部件相关的缺陷和异常，检测这些假冒IC是一项极其困难的任务。在这个项目中，我们开发了用于检测外部物理缺陷的创新2D/3D光学成像，用于内部物理缺陷检测和消除IC拆封的新型3D X射线成像技术，以及用于外部和内部物理缺陷检测的太赫兹成像技术。

Typically, an electronic component goes through process of design, fabrication, assembly, distribution, usage in the system, and finally end of life. Obsolete integrated circuits (ICs) are commonly targeted by counterfeiters through recycling, remarking, and cloning. If counterfeit components end up in critical applications such as defense, aerospace, automotive, or medical systems, the results could be catastrophic. This research will raise awareness of counterfeiting, piracy, and electronic components recycling and remarking issues which will have positive socioeconomic effects on electronic components innovation and growth, rights' holders and consumers.Detecting these counterfeit ICs is an extremely difficult task because of the large number of counterfeit types, part types, and defects and anomalies associated with the counterfeit parts. In this project, we develop innovative 2D/3D optical imaging for detecting exterior physical defects, novel 3D X-ray imaging technologies for interior physical defects detection and to eliminate the need for decapping of ICs, and a Tera-Hertz imaging technology for exterior and interior physical defects detection.