EAGER: Novel Imaging Approaches for the Detection of Counterfeit ICs

EAGER：检测假冒 IC 的新颖成像方法

• 批准号: 1344271
• 负责人: Mark Tehranipoor
• 金额: $ 15万
• 依托单位: University of Connecticut
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-10-01 至 2015-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1344271&HistoricalAwards=false
• 关键词: EAGER; Novel; Imaging; Approaches; Detection

Typically, an electronic component goes through process of design, fabrication, assembly, distribution, usage in the system, and finally end of life. Obsolete integrated circuits (ICs) are commonly targeted by counterfeiters through recycling, remarking, and cloning. If counterfeit components end up in critical applications such as defense, aerospace, automotive, or medical systems, the results could be catastrophic. This research will raise awareness of counterfeiting, piracy, and electronic components recycling and remarking issues which will have positive socioeconomic effects on electronic components innovation and growth, rights' holders and consumers.Detecting these counterfeit ICs is an extremely difficult task because of the large number of counterfeit types, part types, and defects and anomalies associated with the counterfeit parts. In this project, we develop innovative 2D/3D optical imaging for detecting exterior physical defects, novel 3D X-ray imaging technologies for interior physical defects detection and to eliminate the need for decapping of ICs, and a Tera-Hertz imaging technology for exterior and interior physical defects detection.

通常，电子元件经历设计、制造、组装、分配、在系统中使用以及最终寿命结束的过程。假冒集成电路（IC）通常是通过回收，重新标记和克隆的伪造者的目标。如果假冒组件最终出现在国防、航空航天、汽车或医疗系统等关键应用中，后果可能是灾难性的。 本研究将提高人们对假冒、盗版、电子元器件回收和再标记问题的认识，这将对电子元器件的创新和增长、权利人和消费者产生积极的社会经济影响。由于大量的假冒类型、部件类型以及与假冒部件相关的缺陷和异常，检测这些假冒IC是一项极其困难的任务。在这个项目中，我们开发了用于检测外部物理缺陷的创新2D/3D光学成像，用于内部物理缺陷检测的新型3D X射线成像技术，以消除对IC的开盖需求，以及用于外部和内部物理缺陷检测的太赫兹成像技术。