EAGER: Novel Imaging Approaches for the Detection of Counterfeit ICs

一般来说，一个电子元件要经历设计、制造、装配、分销、在系统中使用，最后使用寿命结束的过程。过时的集成电路（ic）通常是仿冒者通过回收，评论和克隆的目标。如果假冒元件最终出现在国防、航空航天、汽车或医疗系统等关键应用中，后果可能是灾难性的。这项研究将提高人们对假冒、盗版和电子元件回收和评论问题的认识，这将对电子元件的创新和增长、权利持有人和消费者产生积极的社会经济影响。检测这些假冒ic是一项极其困难的任务，因为大量的假冒类型、部件类型以及与假冒部件相关的缺陷和异常。在本项目中，我们开发了用于检测外部物理缺陷的创新2D/3D光学成像技术，用于检测内部物理缺陷的新型3D x射线成像技术，并消除了对ic的脱盖需求，以及用于检测外部和内部物理缺陷的太赫兹成像技术。

Typically, an electronic component goes through process of design, fabrication, assembly, distribution, usage in the system, and finally end of life. Obsolete integrated circuits (ICs) are commonly targeted by counterfeiters through recycling, remarking, and cloning. If counterfeit components end up in critical applications such as defense, aerospace, automotive, or medical systems, the results could be catastrophic. This research will raise awareness of counterfeiting, piracy, and electronic components recycling and remarking issues which will have positive socioeconomic effects on electronic components innovation and growth, rights' holders and consumers.Detecting these counterfeit ICs is an extremely difficult task because of the large number of counterfeit types, part types, and defects and anomalies associated with the counterfeit parts. In this project, we develop innovative 2D/3D optical imaging for detecting exterior physical defects, novel 3D X-ray imaging technologies for interior physical defects detection and to eliminate the need for decapping of ICs, and a Tera-Hertz imaging technology for exterior and interior physical defects detection.