EAGER: Novel Imaging Approaches for the Detection of Counterfeit ICs

EAGER：检测假冒 IC 的新颖成像方法

• 批准号: 1344271
• 负责人: Mark Tehranipoor
• 金额: $ 15万
• 依托单位: University of Connecticut
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-10-01 至 2015-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1344271&HistoricalAwards=false
• 关键词: EAGER; Novel; Imaging; Approaches; Detection

Typically, an electronic component goes through process of design, fabrication, assembly, distribution, usage in the system, and finally end of life. Obsolete integrated circuits (ICs) are commonly targeted by counterfeiters through recycling, remarking, and cloning. If counterfeit components end up in critical applications such as defense, aerospace, automotive, or medical systems, the results could be catastrophic. This research will raise awareness of counterfeiting, piracy, and electronic components recycling and remarking issues which will have positive socioeconomic effects on electronic components innovation and growth, rights' holders and consumers.Detecting these counterfeit ICs is an extremely difficult task because of the large number of counterfeit types, part types, and defects and anomalies associated with the counterfeit parts. In this project, we develop innovative 2D/3D optical imaging for detecting exterior physical defects, novel 3D X-ray imaging technologies for interior physical defects detection and to eliminate the need for decapping of ICs, and a Tera-Hertz imaging technology for exterior and interior physical defects detection.

通常，电子元件要经历设计、制造、组装、分销、在系统中使用以及最终寿命结束的过程。造假者通常通过回收、重新标记和克隆来瞄准过时的集成电路 (IC)。如果假冒组件最终出现在国防、航空航天、汽车或医疗系统等关键应用中，结果可能是灾难性的。 这项研究将提高人们对假冒、盗版以及电子元件回收和标记问题的认识，这将对电子元件的创新和增长、权利人和消费者产生积极的社会经济影响。由于存在大量的假冒类型、零件类型以及与假冒零件相关的缺陷和异常，检测这些假冒 IC 是一项极其困难的任务。在该项目中，我们开发了用于检测外部物理缺陷的创新 2D/3D 光学成像、用于内部物理缺陷检测并消除 IC 开盖需求的新型 3D X 射线成像技术，以及用于外部和内部物理缺陷检测的太赫兹成像技术。