System Simulation and Integration Analysis of Non-ideal RF MEMS

A1部分的主要重点在于创建用于设计和模拟异类组合整体系统以及通信系统层的子系统的概念。因此，重点研究了传输特性处的MEM官能团的非理想特性，特别是非线性电子特性和温度依赖特性对所考虑的多物理收发信机的影响；非线性特别是对于相关的发射机路径。系统概念、模拟和优化基于第一阶段开发的RFMEMS元件库，该库将被扩展并用于实现新概念和功能(例如MEMS混频器)。另一个相关的研究主题包括不同的仿真环境(Keysight ADS和Cadence Virtuoso)的组合、实施模型的性质(行为模型、网络有限元或测量模型)，以及通过X参数对实施的MEMS元件和功能组进行表征。通过这种方式，不属于行为模型一部分的谐波和互调产物可以被合并。目标是将X参数模型直接集成到系统仿真(ADS)中，并分析其在通信系统层的影响的可能性。第三个重点是分析单个模块与传统非MEMS设备的互换性，从而在模拟层实现与基于RF MEMS系统的基准测试。

The main focus of Part A1 lies in the creation of the concepts for the design and simulation of the heterogeneous built-up overall system, as well as of the sub-systems at the communication system layer. Thereby, the focus is on the investigation of the influence of non-ideal, especially non-linear electronic and temperature dependent characteristics of the MEM-functional groups at the transmission characteristics on the considered multiphysical-transceiver; nonlinearities are particularly for the transmitter path of relevance. The system concept, simulation and optimization are based on the library of RF MEMS components developed in Phase 1, which will be extended and employed for the implementation of new concepts and functionalities (e.g. MEMS Mixler). Another relevant research topic constitutes the combination of the different simulation environments (Keysight ADS and Cadence Virtuoso), the nature of the implemented models (behavioral models, network- finite Elements or Measurement model), as well as the characterization through X-parameters of the implemented MEMS components and functional groups. In this way, the harmonics and intermodulation products that were not part of the behavioral model can be incorporated. The direct integration of the XParameter models in the system simulation (ADS), and the possibility of analyzing their influence at the communication system layer will be targeted. The third focus is the analysis of the exchangeability of the single modules with conventional, non-MEMS based devices, enabling the benchmark with RF MEMS based systems at the simulation layer.