I-Corps: Nanomaterials for Thermal Management of Power Electronics

I-Corps:用于电力电子热管理的纳米材料

基本信息

  • 批准号:
    1455067
  • 负责人:
  • 金额:
    $ 5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2014
  • 资助国家:
    美国
  • 起止时间:
    2014-09-01 至 2015-02-28
  • 项目状态:
    已结题

项目摘要

High power electronics is playing a vital role in rapid advancements in energy generation, storage and transmission, hybrid automobile vehicles, defense, and aerospace technologies. Wide bandgap semiconductor (WBGS) devices are the leading contenders for high power electronics, but they operate at high current densities requiring the rapid dissemination of heat. Current strategies for thermal management of power electronics have limited efficacy due to their reliance on bulky, multicomponent heat extraction strategies via multiple interfaces with high thermal interface resistances. Therefore, there is a critical need for a simplified commercial thermal management technology which will enable direct extraction of heat from operating power electronics devices. The lack of such a technology limits the operating conditions, reliability, and efficiency of WBGS power electronic systems. This team proposes to address this technological gap by commercializing a novel thermal management strategy based on nanocrystalline diamond (NCD), which is an excellent thermal conductor.The rationale behind the proposed technology is that: NCD possess high thermal conductivity and electrical resistivity making it well-suited for thermal management of WBGS power electronics, extraction of heat directly from a device (as opposed to heat extraction through a substrate) will result in significant enhancements in efficiency, and higher heat extraction efficiency leads to longer operating lifetimes, enables higher device density, and reduced operating costs. The preliminary research consisting of experimental and simulation studies has demonstrated proof-of-principle for the proposed technology.
在能源生产、储存和传输、混合动力汽车、国防和航空航天技术的快速发展中,大功率电子设备发挥着至关重要的作用。宽禁带半导体(WBGS)器件是高功率电子器件的主要竞争者,但它们工作在高电流密度下,需要快速散热。当前电力电子设备的热管理策略的有效性有限,因为它们依赖于通过具有高热界面阻的多个接口的大型、多组分的热提取策略。因此,迫切需要一种简化的商用热管理技术,能够直接从运行中的电力电子器件中提取热量。这种技术的缺乏限制了WBGS电力电子系统的运行条件、可靠性和效率。该团队建议通过将基于纳米晶金刚石(NCD)的新型热管理策略商业化来解决这一技术差距。NCD是一种优秀的热导体。该技术背后的基本原理是:NCD具有高导热性和电阻率,使其非常适合于WBGS电力电子设备的热管理,直接从器件中提取热量(与通过衬底提取热量相反)将显著提高效率,并且更高的热提取效率会导致更长的运行寿命,实现更高的器件密度,并降低运营成本。由实验和模拟研究组成的初步研究已经证明了所提出的技术的原理证明。

项目成果

期刊论文数量(0)
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会议论文数量(0)
专利数量(0)

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Raj Singh其他文献

Repeat stereotactic radiosurgery for locally recurrent brain metastases previously treated with stereotactic radiosurgery: A systematic review and meta-analysis of efficacy and safety.
对先前接受过立体定向放射外科治疗的局部复发性脑转移重复进行立体定向放射外科治疗:有效性和安全性的系统评价和荟萃分析。
  • DOI:
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
    1.2
  • 作者:
    Raj Singh;Prabhanjan Didwania;E. Lehrer;J. Palmer;D. Trifiletti;J. Sheehan
  • 通讯作者:
    J. Sheehan
A High-Performance VLSI Architecture of the Present Cipher and its Implementations for SoCs
当前密码的高性能 VLSI 架构及其 SoC 实现
  • DOI:
    10.1109/socc.2018.8618487
  • 发表时间:
    2018
  • 期刊:
  • 影响因子:
    0
  • 作者:
    J. Pandey;Tarun Goel;Mausam Nayak;Chhavi Mitharwal;A. Karmakar;Raj Singh
  • 通讯作者:
    Raj Singh
Clinical and Biochemical Characteristics of Exertional Heat Stroke among Paratroopers in Agra, India.
印度阿格拉伞兵劳力性中暑的临床和生化特征。
The interplay between external residue addition, and soil organic carbon dynamics and mineralization kinetics: Experiences from a 12-year old conservation agriculture
外部残留物添加与土壤有机碳动态和矿化动力学之间的相互作用:一项 12 年保护性农业的经验
  • DOI:
    10.1016/j.jenvman.2024.122998
  • 发表时间:
    2024-12-01
  • 期刊:
  • 影响因子:
    8.400
  • 作者:
    Priyanka Saha;T.K. Das;Suman Sen;Prabhu Govindasamy;Raj Singh;Rishi Raj;Dibakar Mahanta;M.C. Meena;Arti Bhatia;Livleen Shukla;Abir Dey;Bappa Paramanik;Arkaprava Roy;Alekhya Gunturi;Tarun Sharma
  • 通讯作者:
    Tarun Sharma
Online impedance matching system for ICRH-RF experiments on SST-1 tokamak
  • DOI:
    10.1016/j.fusengdes.2015.06.095
  • 发表时间:
    2015-11-01
  • 期刊:
  • 影响因子:
  • 作者:
    R. Joshi;M. Singh;H.M. Jadav;K. Mishra;Raj Singh;S.V. Kulkarni;D. Bora; ICRH-RF Group
  • 通讯作者:
    ICRH-RF Group

Raj Singh的其他文献

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{{ truncateString('Raj Singh', 18)}}的其他基金

Distributed Nanocrystal Arrays for Quantum Electronics and Sensing
用于量子电子和传感的分布式纳米晶体阵列
  • 批准号:
    2126275
  • 财政年份:
    2021
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
EAGER: Manufacturing of Diamond Nanocrystals for Quantum Applications
EAGER:用于量子应用的金刚石纳米晶体的制造
  • 批准号:
    2103058
  • 财政年份:
    2021
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
PFI-TT: Thermal Management of Power Semiconductor Electronics
PFI-TT:功率半导体电子器件的热管理
  • 批准号:
    2122495
  • 财政年份:
    2021
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
High Temperature Electronic Devices Based on Wide Bandgap Thin Films
基于宽带隙薄膜的高温电子器件
  • 批准号:
    1237959
  • 财政年份:
    2012
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
EAGER: Self-Repairable Glass-Ceramic Composites for Solid Oxide Fuel Cells
EAGER:用于固体氧化物燃料电池的自修复玻璃陶瓷复合材料
  • 批准号:
    1227789
  • 财政年份:
    2012
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Thermal Transport in Diamond Thin Films: Roles of the Nanostructure and Interfaces
金刚石薄膜中的热传输:纳米结构和界面的作用
  • 批准号:
    1227788
  • 财政年份:
    2012
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Self Repairable Seals by Crack Healing of Glass and Glass-Ceramic Composites for Solid Oxide Fuel Cells
用于固体氧化物燃料电池的玻璃和玻璃陶瓷复合材料的裂纹修复自修复密封
  • 批准号:
    1233126
  • 财政年份:
    2012
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Thermal Transport in Diamond Thin Films: Roles of the Nanostructure and Interfaces
金刚石薄膜中的热传输:纳米结构和界面的作用
  • 批准号:
    1133516
  • 财政年份:
    2011
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
EAGER: Self-Repairable Glass-Ceramic Composites for Solid Oxide Fuel Cells
EAGER:用于固体氧化物燃料电池的自修复玻璃陶瓷复合材料
  • 批准号:
    1147812
  • 财政年份:
    2011
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
High Temperature Electronic Devices Based on Wide Bandgap Thin Films
基于宽带隙薄膜的高温电子器件
  • 批准号:
    0853789
  • 财政年份:
    2009
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant

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生物质DNA热处理制备碳纳米材料的制备及表征
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  • 批准号:
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    261696-2012
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    2014
  • 资助金额:
    $ 5万
  • 项目类别:
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