PFI-TT: Thermal Management of Power Semiconductor Electronics

PFI-TT：功率半导体电子器件的热管理

• 批准号: 2122495
• 负责人: Raj Singh
• 金额: $ 25万
• 依托单位: Oklahoma State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-08-01 至 2024-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2122495&HistoricalAwards=false
• 关键词: PFI; TT; Thermal; Management; Power

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to pursue research and development that focuses on the more efficient removal of generated heat from electronic devices leading to commercialization of a new thermal management technology for power semiconductor electronics. Demand for power electronics is expected to be high and continues to grow especially in the defense, transportation, and alternative energy sectors, as well as the energy generation and distribution, hybrid/electric vehicles, and ultra-high efficiency lighting systems. There will be direct benefits of the project towards the development of new compact, lightweight, and higher reliability power electronic devices. In addition, successful completion of this project may result in an associated reduction in cost of operation, lower energy consumption, increased efficiency, and a lower carbon footprint. Finally, successful commercialization of the technology through the establishment of a start-up company or tech-transfer agreement and the training of students and a postdoctoral fellow in innovation and entrepreneurship will contribute to global leadership in power electronics for high-technology products.The current approach to thermal management for power electronics is limited due to heat extraction from the back or substrate side of the device using heat spreader/interface materials of poor thermal conductivity. This project addresses this technological problem by commercializing a novel diamond material-based technology to extract heat directly from the top of the power electronics where heat is generated. The approach is based on using a diamond film because it is well-suited for thermal management because of its high thermal conductivity and electrical resistivity. The extraction of heat directly from the top of a device can enhance efficiency by 40% and reduce package size and weight. The extraction of heat from the top also offers higher efficiency and reduced operating costs, while increasing device lifetimes and density. Another objective of the project is to train the work force in technology commercialization and entrepreneurship through NSF’s I-Corps Team Training in which the faculty (technical lead), a mentor and an entrepreneur lead (post doc and/or student) working on the project are taken through intensive training on how to successfully commercialize this promising technology. The new technology may lead to more efficient power electronics, lower operating costs, enhanced device lifetimes and density, and successful technology commercialization and entrepreneurship.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这种创新合作伙伴关系的更广泛的影响/商业潜力 - 技术翻译（PFI -TT）项目是购买研究和开发，重点是从电子设备中更有效地去除产生的热量，从而为电力半导体电子电子产品提供新的热管理技术的商业化。对电力电子产品的需求预计会很高，并且会继续增长，尤其是在防御，运输和替代能源领域，以及能源发电和分销，混合/电动汽车以及超高效率照明系统。该项目将在开发新的紧凑型，轻质和更高的可靠性电力电子设备方面有直接的好处。此外，该项目的成功完成可能会导致降低运营成本，降低能耗，提高效率和较低的碳足迹。 Finally, successful commercialization of the technology Through the establishment of a start-up company or technology-transfer agreement and the training of students and a postdoctoral fellow in innovation and entrepreneurship will contribute to global leadership in power electronics for high-technology products.The current approach to thermal management for power electronics is limited due to heat extraction from the back or substrate side of the device using heat spreader/interface materials of poor thermal conductivity.该项目通过将一种新型的基于钻石材料的技术商业化来解决该技术问题，该技术可以直接从产生热量的电力电子产品的顶部提取热量。该方法是基于使用钻石膜的，因为它非常适合热电学管理，因为它具有较高的导热性和电阻。直接从设备顶部提取热量可以提高效率40％，并降低包装尺寸和重量。从顶部提取热量还提供了更高的效率和降低的运营成本，同时增加了设备寿命和密度。该项目的另一个目的是通过NSF的I-Corps团队培训来培训技术商业化和企业家精神的劳动力，在该团队中，教师（技术负责人），精神和企业家负责人（DOC和/或学生）从事该项目的工作是通过深入的培训，涉及如何成功地将这种有前途的技术商业化。这项新技术可能会导致更有效的电力电子设备，降低的运营成本，增强的设备寿命和密度以及成功的技术商业化和企业家精神。该奖项反映了NSF的法定任务，并被认为是通过基金会的知识分子优点和更广泛的影响审查标准来评估来获得的支持。

项目成果

Influence of processing conditions on the titanium–aluminum contact metallization on a silicon wafer for thermal management

加工条件对硅片上钛铝接触金属化热管理的影响

• 发表时间: 2023
• 期刊: Journal of vacuum science technology B Microelectronics and nanometer structures
• 作者: Manish Singh, Manish;Ramasubramanian, Lakshmi Narayanan;Singh, Raj N
• 通讯作者: Singh, Raj N