I-Corps: Metallic Glue in Ambient

这个i-Corps团队已经确定，将金属以及塑料和玻璃以及任何其他类型的金属粘合在一起是可行的。能够在低温下将物体与金属连接在一起，可以安全地连接无法在高温下生存的组件，如精致的电子组件或塑料。I-Corps团队打算商业化的技术是两个表面之间的金属粘合(胶水)或焊接，可以在室温、空气和低压下生产。建议的产品可以用于计算机，使其运行更快、寿命更长，或者在不焊接的情况下将组件连接到电路板上。此外，不需要焊接技能，所以普通人可以在家里安全地进行金属修复。这个团队的目标是生产一种产品，改变某些东西如何连接在一起的格局。该团队设想了一种粘合解决方案，它将取代焊料，使部件更安全、更简单，并通过消除许多问题(如干燥、抽出和低导热系数)来取代热接口材料，例如用于将CPU热连接到计算机中的散热器的材料。虽然金属胶将应用于许多不同的应用，但该团队计划挑选出这一两个最容易采用拟议技术的领域，并瞄准那些有兴趣使用这种产品生产高质量产品的公司。拟议中的金属胶将使CPU具有显著的市场份额优势，这些CPU的使用时间明显更长，或者能够在不改变硅工艺本身的情况下更快地运行。该团队对市场的贡献将帮助计算克服目前高功率组件散热的瓶颈。

This I-Corps team has determined that it is feasible to attach metals together as well as plastics and glass and any one to any other type. Being able to attach things together with metal at low temperature allows for safe attachment of components that cannot survive high temperatures, such as delicate electronic components or plastic. The technology this I-Corps team intends to commercialize is a metal bond ("glue"), or weld, between two surfaces, that can be produced at room temperature, in air, and under low pressure. The proposed product can be used in computers to make them run faster and last longer or to attach components to circuit boards without soldering. Additionally, no welding skill is needed, so the average person can make metal repairs at home, safely. This team's goal is to produce a product that changes the landscape of how certain things are attached together. The team envisions a bonding solution that will replace solder, by being safer for components and simpler, and thermal interface materials, such as those used to thermally connect CPUs to heat sinks in computers, by eliminating many of the problems like drying out, pumping out, and low thermal conductivity. While metal glue will apply to many diverse applications, the team plans to single out these one or two fields where the proposed technology will be most easily adopted, and target companies who would be interested in using this product to produce goods with superior qualities. The proposed metal glue would give the significant market share advantage of CPUs that last significantly longer or are able to operate faster without any change to the silicon processing itself. This team's contribution to the marketplace will help computing overcome the current bottleneck of heat dissipation for high power components.