I-Corps: Metallic Glue in Ambient

这个I-Corps团队已经确定，将金属、塑料和玻璃以及任何一种金属与任何其他类型的金属连接在一起是可行的。能够在低温下与金属连接在一起，可以安全地连接无法在高温下存活的组件，例如精密的电子元件或塑料。I-Corps团队打算商业化的技术是在两个表面之间建立金属粘合（“胶水”）或焊接，这种技术可以在室温、空气和低压下生产。该提议的产品可用于电脑，使其运行速度更快，寿命更长，或将组件连接到电路板上而无需焊接。此外，不需要焊接技能，所以一般人可以在家里安全地进行金属修理。这个团队的目标是生产一种产品，可以改变某些东西连接在一起的方式。该团队设想了一种键合解决方案，它将取代焊料，因为它对组件更安全，更简单，以及热界面材料，比如那些用于将cpu热连接到计算机散热器的材料，通过消除许多问题，如干燥、泵出和低导热性。虽然金属胶将适用于许多不同的应用，但该团队计划挑选出一两个最容易采用该技术的领域，并瞄准那些有兴趣使用该产品生产高质量产品的公司。拟议的金属胶将给cpu带来显著的市场份额优势，这些cpu使用寿命更长，运行速度更快，而无需改变硅处理本身。该团队对市场的贡献将有助于计算克服当前高功率组件的散热瓶颈。

This I-Corps team has determined that it is feasible to attach metals together as well as plastics and glass and any one to any other type. Being able to attach things together with metal at low temperature allows for safe attachment of components that cannot survive high temperatures, such as delicate electronic components or plastic. The technology this I-Corps team intends to commercialize is a metal bond ("glue"), or weld, between two surfaces, that can be produced at room temperature, in air, and under low pressure. The proposed product can be used in computers to make them run faster and last longer or to attach components to circuit boards without soldering. Additionally, no welding skill is needed, so the average person can make metal repairs at home, safely. This team's goal is to produce a product that changes the landscape of how certain things are attached together. The team envisions a bonding solution that will replace solder, by being safer for components and simpler, and thermal interface materials, such as those used to thermally connect CPUs to heat sinks in computers, by eliminating many of the problems like drying out, pumping out, and low thermal conductivity. While metal glue will apply to many diverse applications, the team plans to single out these one or two fields where the proposed technology will be most easily adopted, and target companies who would be interested in using this product to produce goods with superior qualities. The proposed metal glue would give the significant market share advantage of CPUs that last significantly longer or are able to operate faster without any change to the silicon processing itself. This team's contribution to the marketplace will help computing overcome the current bottleneck of heat dissipation for high power components.