I-Corps: Metallic Glue in Ambient

I-Corps：环境中的金属胶

• 批准号: 1608461
• 负责人: Hanchen Huang
• 金额: $ 5万
• 依托单位: Northeastern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2016
• 资助国家: 美国
• 起止时间: 2016-02-01 至 2016-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1608461&HistoricalAwards=false
• 关键词: Corps; Metallic; Glue; Ambient

This I-Corps team has determined that it is feasible to attach metals together as well as plastics and glass and any one to any other type. Being able to attach things together with metal at low temperature allows for safe attachment of components that cannot survive high temperatures, such as delicate electronic components or plastic. The technology this I-Corps team intends to commercialize is a metal bond ("glue"), or weld, between two surfaces, that can be produced at room temperature, in air, and under low pressure. The proposed product can be used in computers to make them run faster and last longer or to attach components to circuit boards without soldering. Additionally, no welding skill is needed, so the average person can make metal repairs at home, safely. This team's goal is to produce a product that changes the landscape of how certain things are attached together. The team envisions a bonding solution that will replace solder, by being safer for components and simpler, and thermal interface materials, such as those used to thermally connect CPUs to heat sinks in computers, by eliminating many of the problems like drying out, pumping out, and low thermal conductivity. While metal glue will apply to many diverse applications, the team plans to single out these one or two fields where the proposed technology will be most easily adopted, and target companies who would be interested in using this product to produce goods with superior qualities. The proposed metal glue would give the significant market share advantage of CPUs that last significantly longer or are able to operate faster without any change to the silicon processing itself. This team's contribution to the marketplace will help computing overcome the current bottleneck of heat dissipation for high power components.

这个I-Corps团队已经确定，将金属连接在一起以及塑料和玻璃以及任何一种连接到任何其他类型都是可行的。能够在低温下将物品与金属连接在一起，可以安全地连接无法承受高温的组件，例如精密的电子元件或塑料。这个I-Corps团队打算商业化的技术是两个表面之间的金属粘合（“胶水”）或焊接，可以在室温下，在空气中和低压下生产。 拟议的产品可用于计算机，使其运行更快，寿命更长，或将组件连接到电路板上而无需焊接。此外，不需要焊接技能，所以一般人可以在家里安全地进行金属维修。这个团队的目标是生产一种产品，改变某些东西如何连接在一起的格局。 该团队设想了一种粘合解决方案，该解决方案将取代焊料，对组件更安全，更简单，以及热界面材料，例如用于将CPU热连接到计算机散热器的材料，通过消除干燥，泵出和低导热率等许多问题。虽然金属胶将适用于许多不同的应用，但该团队计划挑选出最容易采用拟议技术的一两个领域，并瞄准有兴趣使用该产品生产上级产品的公司。拟议中的金属胶将为CPU带来显著的市场份额优势，这些CPU的寿命将显著延长，或者能够在不改变硅处理本身的情况下更快地运行。该团队对市场的贡献将帮助计算克服当前高功率组件散热的瓶颈。