SHF: Small: MultiSpot - Closing the power-delivery/heat-removal cycle for heterogeneous multiscale systems

半导体行业有望延续摩尔定律的历史性趋势，即每18个月集成水平翻一番，尽管登纳德缩放的良性循环优势正在迅速消失。一旦设备不再横向扩展，继续增加面密度的一种方法是使用3D集成。当前项目称为MultiSpot项目，其主要目标是为3D-IC电源墙问题提供基本解决方案。这些解决方案可能会对半导体行业产生深远的影响，从而为摩尔定律利用第三维度提供了一条前进的道路，从而对整个社会产生影响。该项目还将带来新的研究基础设施，例如由pi先前开发的几个高影响力的功率和热架构建模工具，如HotSpot， hotleaks volspot和ArchFP，这些工具过去在学术机构和行业中进行了广泛的研究。一种方法是提供从体积内部到外部的极低阻抗路径，以提供电源和散热。微通道的另一种双重用途是修改其壁以创建超级电容器，可以用于存储额外的电荷，以对抗电力不足或增强操作。解决功率输送体积/面积不匹配的另一种方法是电压堆叠，其中3D-IC堆叠中的不同层是串联电连接的，而不是像传统方法那样并联。MultiSpot提出了实用的方法来补充和辅助电压叠加的隐式调节与多输出开关电容器梯级网络的显式调节。该项目还考虑了跨层方面，例如嵌入式电容器技术的细节，同质与异质3D-IC解决方案的架构含义，架构级别的功率传输和散热建模，以及通过建模和仿真进行验证。

The semiconductor industry is poised to continue the historic Moore's law trend of doubling the level of integration every 18 months, even as the virtuous cycle benefits of Dennard scaling are quickly vanishing. Once devices no longer scale laterally, one way to continue to increase areal density is to use 3D integration. The main objective of the current project, called the MultiSpot project, is to provide fundamental solutions to the problem of 3D-IC power wall. These solutions could have a deep impact on the semiconductor industry, and thus the society as a whole by providing a path forward for Moore's law to take advantage of the third dimension. The project will also lead to new research infrastructure exemplified by the several high-impact architecture modeling tools for power and thermals previously developed by the PIs, such as HotSpot, HotLeakage VoltSpot, and ArchFP that have enabled extensive research at academic institutions and industry in the past. One approach is to provide very low impedance paths from the interior of the volume to the outside for power in addition to heat removal. A different dual use for microchannels is to modify their walls to create supercapacitors that can be useful to store extra charge to combat power brownouts or boost operations. An alternative method to address the power delivery volumetric/areal mismatch is voltage stacking, in which the different layers in a 3D-IC stack are electrically connected in series, instead of in parallel as in a conventional approach. MultiSpot proposes practical methods to complement and assist the implicit regulation of voltage stacking with the explicit regulation of multi-output switched-capacitor ladder networks. The project also considers cross-layer aspects, such as details of embedded capacitor technologies, the architectural implications of homogeneous vs. heterogeneous 3D-IC solutions, the modeling of power delivery and heat removal at the architecture level, and validation through modeling and simulations.