II-NEW: Experimental Characterization and CAD Development Testbed for Nanoscale Integrated Circuits

这个NSF CRI-II-NEW项目的目的是开发一个用于计算机辅助设计（CAD）模拟，实验计量以及软件和硬件校准的测试平台，以支持CMOS和后CMOS技术的新型纳米级3D异构集成的跨层评估。拟议的工具和设备采购和维护将允许自下而上的评估，从材料，基础物理和实验计量到设备和电路到大规模系统。拟议的基础设施是独一无二的，将使新的三维异构集成概念的准确性，只有平行于全面的实验原型进行彻底的评估。它将直接影响纳米电磁学，纳米器件，电路，3D IC和制造研究方向，并将对密苏里大学堪萨斯城分校（UMKC）计算机科学与电气工程（CSEE）系的大数据分析，可再生能源，智能城市，RF和电磁学研究计划产生重大影响。该试验平台不仅将促进变革性研究，而且还将允许广泛的教育和推广活动，如新的本科生和研究生课程开发与实验室模块，研究生的培训和指导，通过论坛和研讨会进行研究传播，开发在线知识库和在线实验室，并通过夏季研讨会提高K-12学生的纳米技术意识。这项合作计划的更广泛影响是，建议的基础设施将为纳米材料、纳米器件、纳米电路、生物传感、异质集成和纳米制造等领域的研究、教育和社区外展提供独特的机会。这项合作计划的研究重点是利用新型材料、器件、电路和集成方案。 3D集成提供了实现具有异构层的系统的机会，例如可以垂直堆叠并通过密集通孔电连接的生物分析设备和混合信号信息处理层。然而，这种实施与CMOS是具有挑战性的，由于CMOS？的缩放限制、不同模拟和数字电路元件之间的噪声耦合以及管芯-管芯或层-层堆叠的限制。我们提出了一种新的3-D异质集成方法，该方法通过利用碳纳米管、MoS 2和纳米级几何结构等新材料来克服挑战，以实现用于生物分子检测的高灵敏度生物传感器，可扩展的基于2-D材料的超低功耗器件，其表现出FET般的开关和负微分电阻（NDR），用于信号处理和逻辑组件的无缝集成，以及具有密集通孔的单片3-D集成技术。初步预测显示，这种异构集成在传统的2-D CMOS基于多芯片的方法显着的好处。如果实现，这可能会改变混合信号ASIC的游戏规则，也可能会改变医疗点和芯片实验室等生物医学应用。

The aim of this NSF CRI-II-NEW project is to develop a testbed for computer aided design (CAD) simulations, experimental metrology, and software and hardware calibrations to support cross-layer evaluation of novel nanoscale 3D heterogeneous integration of CMOS and post-CMOS technologies. Proposed tools and equipment acquisitions and sustainment will allow bottom-up evaluations from materials, fundamental physics, and experimental metrology to device and circuits to large-scale systems. The proposed infrastructure is unique and will enable thorough evaluation of new 3D heterogeneous integration concepts with accuracy only parallel to full-scale experimental prototyping. It will directly impact the nano-electromagnetics, nano-device, circuits, 3D IC and manufacturing research directions, and will also have significant impact on the big data analytics, renewable energy, smart-city, RF and electromagnetics research initiatives in Computer Science and Electrical Engineering (CSEE) department at University of Missouri-Kansas City (UMKC). The testbed will not only facilitate transformative research, but will also allow broad ranging educational and outreach activities such as new undergraduate and graduate curriculum development with lab modules, training and mentoring of research students, research dissemination thorough forums and seminars, development of online repositories and online labs, and nanotechnology awareness for K-12 students through summer workshops. The boarder impact of this project is that the proposed infrastructure will provide unique opportunities for research, education and community outreach in the fields of nanomaterials, nanodevice, nanocircuit, biosensing, heterogonous integration, and nanomanufacturing.The research focus of this collaborative project will be to develop nanoscale heterogeneous 3D integration and testing framework for bio-sensing and computing applications leveraging novel materials, devices, circuits and integration schemes. 3D integration provides opportunities to realize systems with heterogeneous layers, such as bio-analytical device and mixed-signal information processing layers that can be vertically stacked and electrically connected through dense vias. However, such implementation with CMOS is challenging due to CMOS?s scaling limits, noise coupling between dissimilar analog and digital circuit components and limitations of die-die or layer-layer stacking. We propose a new 3-D heterogeneous integration approach that overcomes challenges by utilizing new materials such as Carbon Nanotube, MoS2, and nanoscale geometry to realize highly sensitive bio-sensors for bio-molecule detections, scalable 2-D material based ultra-low power devices that exhibit FET like switching and Negative Differential Resistance (NDR) for seamless integration of signal processing and logic components, and monolithic 3-D integration techniques with dense vias. Initial projections reveal significant benefits for such heterogeneous integration over conventional 2-D CMOS based multi-chip based approaches. If realized, this can be game-changing for mixed-signal ASICs, and as well for bio-medical applications such as point-of-care and lab-on-a-chips.