II-NEW: Experimental Characterization and CAD Development Testbed for Nanoscale Integrated Circuits

NSF CRI-II这一新项目的目标是开发一个用于计算机辅助设计(CAD)模拟、实验计量以及软件和硬件校准的试验台，以支持对新型纳米级3D异质集成的跨层评估。拟议的工具和设备采购和维持将允许从材料、基础物理和实验计量学到器件和电路再到大型系统的自下而上的评估。拟议的基础设施是独一无二的，将能够以仅与全尺寸实验原型平行的精度对新的3D异质集成概念进行彻底评估。它将直接影响纳米电磁学、纳米器件、电路、3D IC和制造的研究方向，也将对密苏里大学堪萨斯城分校(UMKC)计算机科学与电气工程(CSEE)系的大数据分析、可再生能源、智慧城市、射频和电磁学研究计划产生重大影响。试验台不仅将促进变革性研究，还将允许广泛的教育和外展活动，例如通过实验室单元开发新的本科生和研究生课程，培训和指导研究型学生，通过论坛和研讨会传播研究成果，开发在线知识库和在线实验室，以及通过暑期工作坊为K-12学生提高纳米技术意识。该项目的更大影响是，拟议的基础设施将为纳米材料、纳米器件、纳米电路、生物传感、异质集成和纳米制造领域的研究、教育和社区推广提供独特的机会。这一合作项目的研究重点将是利用新材料、器件、电路和集成方案为生物传感和计算应用开发纳米级的异质3D集成和测试框架。3D集成为实现具有异构层的系统提供了机会，例如生物分析设备和混合信号信息处理层，这些层可以垂直堆叠，并通过密集的通孔进行电连接。然而，由于CMOS·S的比例限制、不同模拟和数字电路元件之间的噪声耦合以及芯片-芯片或层-层堆叠的限制，这样的CMOS化实现是具有挑战性的。我们提出了一种新的三维异质集成方法，该方法利用碳纳米管、二硫化钼和纳米几何结构等新材料来实现用于生物分子检测的高灵敏度生物传感器，基于可扩展的二维材料的超低功耗器件表现出类似FET的开关和负差分电阻(NDR)以实现信号处理和逻辑元件的无缝集成，以及具有密集通孔的单片三维集成技术。初步预测显示，与传统的基于2-D CMOS多芯片的方法相比，这种异质集成具有显著的优势。如果实现，这可能会改变混合信号ASIC的游戏规则，也可以改变生物医学应用，如护理点和芯片实验室。

The aim of this NSF CRI-II-NEW project is to develop a testbed for computer aided design (CAD) simulations, experimental metrology, and software and hardware calibrations to support cross-layer evaluation of novel nanoscale 3D heterogeneous integration of CMOS and post-CMOS technologies. Proposed tools and equipment acquisitions and sustainment will allow bottom-up evaluations from materials, fundamental physics, and experimental metrology to device and circuits to large-scale systems. The proposed infrastructure is unique and will enable thorough evaluation of new 3D heterogeneous integration concepts with accuracy only parallel to full-scale experimental prototyping. It will directly impact the nano-electromagnetics, nano-device, circuits, 3D IC and manufacturing research directions, and will also have significant impact on the big data analytics, renewable energy, smart-city, RF and electromagnetics research initiatives in Computer Science and Electrical Engineering (CSEE) department at University of Missouri-Kansas City (UMKC). The testbed will not only facilitate transformative research, but will also allow broad ranging educational and outreach activities such as new undergraduate and graduate curriculum development with lab modules, training and mentoring of research students, research dissemination thorough forums and seminars, development of online repositories and online labs, and nanotechnology awareness for K-12 students through summer workshops. The boarder impact of this project is that the proposed infrastructure will provide unique opportunities for research, education and community outreach in the fields of nanomaterials, nanodevice, nanocircuit, biosensing, heterogonous integration, and nanomanufacturing.The research focus of this collaborative project will be to develop nanoscale heterogeneous 3D integration and testing framework for bio-sensing and computing applications leveraging novel materials, devices, circuits and integration schemes. 3D integration provides opportunities to realize systems with heterogeneous layers, such as bio-analytical device and mixed-signal information processing layers that can be vertically stacked and electrically connected through dense vias. However, such implementation with CMOS is challenging due to CMOS?s scaling limits, noise coupling between dissimilar analog and digital circuit components and limitations of die-die or layer-layer stacking. We propose a new 3-D heterogeneous integration approach that overcomes challenges by utilizing new materials such as Carbon Nanotube, MoS2, and nanoscale geometry to realize highly sensitive bio-sensors for bio-molecule detections, scalable 2-D material based ultra-low power devices that exhibit FET like switching and Negative Differential Resistance (NDR) for seamless integration of signal processing and logic components, and monolithic 3-D integration techniques with dense vias. Initial projections reveal significant benefits for such heterogeneous integration over conventional 2-D CMOS based multi-chip based approaches. If realized, this can be game-changing for mixed-signal ASICs, and as well for bio-medical applications such as point-of-care and lab-on-a-chips.