Advancing Education in Magnetics: Support for Graduate Students to Attend Summer School 2016 in Tohoku University, Japan

磁性材料在我们的日常生活中无处不在：电脑硬盘、扬声器、吊扇、微波炉等许多物品。此外，在纳米医学和信息技术等重要领域的进步，如果没有强大的研究活动在磁性领域不能继续下去。磁学研究必然是多学科的，因此在该领域的培训是很难实现任何单一的传统大学学位课程。为了给研究生提供更好更有效的磁学培训，IEEE磁学学会于2008年发起了一年一度的暑期学校。在为期一周的时间里，在磁学和相关领域工作的研究生有机会向世界专家学习磁学的基本和高级主题。该奖项将资助10名美国研究生参加将于2016年7月10日至16日在日本仙台东北大学举办的2016 IEEE Summer School in Magnetics。暑期学校旨在推进三个目标：1）丰富学生对磁性材料的磁学理论，技术，应用和表征的知识; 2）为学生提供一个平台，向包括同行和领先的国际专家在内的观众展示自己的研究;以及3）鼓励网络，帮助参与者建立专业关系，以促进未来的合作。该奖项由电气，通信和网络系统工程司理事会共同资助。

Magnetic materials are everywhere in our daily lives: computer hard drives, loudspeakers, ceiling fans, microwave ovens and many other items. Moreover, the advancement in important areas as nanomedicine and information technology cannot continue without strong research activity in the field of magnetism. Magnetism research is necessarily multidisciplinary so training in the field is difficult to achieve under any single traditional college degree program. In order to provide a better and more efficient training in magnetism for graduate students, the IEEE Magnetics Society initiated in 2008 an annual Summer School. During one week, graduate students working in magnetism and related areas have the opportunity to learn from world experts about fundamental and advanced topics in magnetism. Bringing together students from all geographical regions will enable collaborations of future scientists working in this important field.This award supports participation of a diverse group of ten U.S. graduate students in the 2016 IEEE Summer School in Magnetics, to be held at Tohoku University in Sendai, Japan from July 10-16, 2016. The Summer School aims to advance three objects: 1) enrich students' knowledge of the theory of magnetism, technology, applications and characterization of magnetic materials; 2) provide a platform for students to present their own research to an audience including both peers and leading international experts; and 3) encourage networking, helping to build professional relationships among participants to further future collaborations. This award is cofunded by the Directorate for Engineering Division of Electrical, Communications and Cyber Systems.