SBIR Phase II: A Novel Heat Dissipation Product for Chip Testing and Internet of Things

SBIR第二期：用于芯片测试和物联网的新型散热产品

• 批准号: 1660259
• 负责人: Craig Green
• 金额: $ 74.7万
• 依托单位: CARBICE CORPORATION
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-04-01 至 2020-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1660259&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Novel; Heat

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project comes from addressing the thermal challenges brought about by the significant increase in transistor density that semiconductors have experienced over the past few decades. This trend has enabled many advancements ranging from high performance servers to Internet of Things devices. Still, with every advance in chip technology, the difficulty of chip cooling continues to increase. Three major thermal interface material (TIM) market segments exist: polymer composites, metallic materials and phase-change materials. Commercial carbon nanotubes (CNTs) will create a fourth market segment that will supplant existing TIMs, initially in the chip testing market and eventually extending into servers, high performance computing and Internet of Things devices. CNT researchers and small businesses have made little progress towards a commercial TIM product. Among other factors, this failure is driven by poor positioning in the crowded low-cost TIM space, which is currently dominated by thermal greases and pads. Progress towards a viable solution lies in the strategic alignment of product features with industry pain points. This Phase II SBIR aims to develop a means to scale the ability to produce CNT based TIMs as well as to further improve their performance.The technical objectives of this SBIR Phase II project are to: 1) scale up of the CNT TIM manufacturing process to achieve a production capacity of 200,000 sq. in of product annually and to 2) enhance the conductivity of the CNT array by a factor of 3x or more to facilitate entry into the TIM1 and TIM2 market. This project will ultimately develop processes that will translate into achieving production scale CNT based thermal interface materials for the first time in the world. Scale up will be achieved through a combination of physical vapor deposition and chemical vapor deposition processes developed on tools designed specifically for CNT production. In Phase I of this research effort, two commercial products aimed at the semiconductor chip testing market were developed and validated through collaboration with leading chip manufacturers. In addition to the chip testing market segment, in Phase II products will be developed for entry into the TIM1 and Internet of Things markets.

这个小企业创新研究（SBIR）第二阶段项目的更广泛的影响/商业潜力来自于解决半导体在过去几十年中经历的晶体管密度显著增加所带来的热挑战。这一趋势推动了从高性能服务器到物联网设备的许多进步。尽管如此，随着芯片技术的每一次进步，芯片冷却的难度也在不断增加。热界面材料（TIM）有三大细分市场：聚合物复合材料、金属材料和相变材料。商用碳纳米管（CNTs）将创造第四个细分市场，取代现有的TIMs，最初是在芯片测试市场，最终扩展到服务器、高性能计算和物联网设备。碳纳米管研究人员和小型企业在商业化TIM产品方面进展甚微。除其他因素外，这种失败是由于在拥挤的低成本TIM领域定位不佳造成的，目前该领域主要由热润滑脂和垫片主导。实现可行解决方案的过程取决于产品特性与行业痛点的战略一致性。第二阶段SBIR旨在开发一种方法，以扩大生产基于碳纳米管的TIMs的能力，并进一步提高其性能。SBIR二期项目的技术目标是：1)扩大碳纳米管TIM制造工艺的规模，达到20万平方英尺的生产能力。2)将碳纳米管阵列的导电性提高3倍或更多，以促进进入TIM1和TIM2市场。该项目最终将在世界上首次实现碳纳米管热界面材料的生产规模。扩大规模将通过物理气相沉积和化学气相沉积工艺开发的工具，专门为碳纳米管生产。在这项研究的第一阶段，通过与领先的芯片制造商合作，开发和验证了两种针对半导体芯片测试市场的商业产品。除了芯片测试细分市场，二期产品将开发进入TIM1和物联网市场。

项目成果

Numerical and Experimental Investigation of Vertically Aligned Carbon Nanotube-Phase Change Material Composites for Thermal Management of Electronics

用于电子热管理的垂直排列碳纳米管-相变材料复合材料的数值和实验研究

• DOI: 10.1109/itherm.2018.8419561
• 发表时间: 2018
• 期刊: ITHERM 2018
• 作者: Phillips, Makita R.;Green, Craig E.;Cola, Baratunde A.
• 通讯作者: Cola, Baratunde A.

Investigation of the mechanical compliance of highly conductive and durable carbon nanotube-polymer composite thermal interface materials

高导电耐用碳纳米管-聚合物复合热界面材料的机械顺应性研究

• DOI: 10.1109/itherm.2017.7992480
• 发表时间: 2017
• 期刊: ITHERM 2017
• 作者: Prinzi, Leonardo F.;Green, Craig E.;Cola, Baratunde A.
• 通讯作者: Cola, Baratunde A.