SHF: Small: Reclaiming Dark Silicon via 2.5D Integrated Systems with Silicon Photonic Networks

SHF：小型：通过具有硅光子网络的 2.5D 集成系统回收暗硅

• 批准号: 1716352
• 负责人: Ayse Coskun
• 金额: $ 45万
• 依托单位: Trustees of Boston University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-09-01 至 2021-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1716352&HistoricalAwards=false
• 关键词: SHF; Small; Reclaiming; Dark; Silicon

Emerging applications in the growing domains of cloud, internet-of-things, and high-performance computing require higher levels of parallelism and much larger data transfers compared to applications of the past. In tandem, power and thermal constraints limit the number of transistors that can be used simultaneously on a chip and this limit has led to the ?Dark Silicon? problem. These difficulties in harnessing the full potential of computer chips exacerbate the challenge of building efficient high-performance systems. This project proposes to use 2.5D integration technology with silicon-photonic networks-on-chip (NOCs) to build heterogeneous computing systems that provide the desired parallelism, heterogeneity, and network bandwidth to handle the demands of the next-generation applications. A major outcome of the project will be a set of optimization methods that will enable efficient and robust design and operation of 2.5D systems with silicon-photonic NOCs. The project seeks to accelerate the design of high-performance, energy-efficient systems that are able to cater to growing bandwidth and performance needs and, in this way, enable a wider spectrum of cognitive data-intensive applications. Planned educational and outreach activities include the design of tutorials and workshops focused on training future engineers on cross-layer design problems, involvement of undergraduate, under-represented minority, and women students in various aspects of the research, and interactions with research centers and industry to accelerate technology transfer.The research goal of the proposal is to design novel cross-layer design automation methods for 2.5D-integrated heterogeneous systems with silicon-photonic NOCs, and to quantitatively demonstrate the benefits of these 2.5D systems with respect to energy efficiency, robustness, and performance. The proposed work bridges the gap among device, physical design, architecture, and application layers when designing systems with silicon-photonic NOCs to dramatically improve system efficiency and robustness. Specific project thrusts include designing: (1) a modeling stack to quantify cross-layer interactions (from devices to applications) in a 2.5D system and inform optimizers to enable energy-efficient silicon-photonic NOC design and management; (2) design-time methods that orchestrate architecture design, chiplet placement, NOC design/routing, laser placement, and cooling design to maximize system performance under power and temperature constraints; (3) thermally-aware design/runtime optimization techniques that are aware of silicon-photonic device properties and their sensitivity to thermal variations; and (4) cross-layer optimization methods that help navigate a complex space of design choices and runtime knobs.

与过去的应用程序相比，云、物联网和高性能计算等不断发展的领域中的新兴应用程序需要更高水平的并行性和更大的数据传输。同时，功率和热约束限制了可以同时在芯片上使用的晶体管数量，这一限制导致了？黑硅?问题。在利用计算机芯片的全部潜力方面的这些困难加剧了构建高效高性能系统的挑战。该项目建议使用2.5D集成技术与硅光子片上网络（noc）来构建异构计算系统，提供所需的并行性、异构性和网络带宽，以处理下一代应用的需求。该项目的一个主要成果将是一套优化方法，这些方法将实现具有硅光子noc的2.5D系统的高效和稳健的设计和运行。该项目旨在加速高性能、节能系统的设计，以满足不断增长的带宽和性能需求，并以这种方式实现更广泛的认知数据密集型应用。计划的教育和推广活动包括设计教程和讲习班，重点是培训未来的工程师解决跨层设计问题，让本科生、少数族裔和女学生参与研究的各个方面，并与研究中心和工业界进行互动，以加速技术转让。该提案的研究目标是为具有硅光子noc的2.5D集成异质系统设计新颖的跨层设计自动化方法，并定量证明这些2.5D系统在能效、鲁棒性和性能方面的优势。在设计具有硅光子noc的系统时，提出的工作弥合了器件，物理设计，架构和应用层之间的差距，以显着提高系统效率和鲁棒性。具体的项目重点包括设计：(1)一个建模堆栈，用于量化2.5D系统中的跨层交互（从设备到应用程序），并通知优化器，以实现节能硅光子NOC设计和管理；(2)协调架构设计、芯片放置、NOC设计/路由、激光放置和冷却设计的设计时间方法，以在功率和温度限制下最大化系统性能；(3)热感知设计/运行时优化技术，了解硅光子器件的特性及其对热变化的敏感性；(4)跨层优化方法，帮助导航复杂的设计选择空间和运行时旋角。

项目成果

TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

• DOI: 10.23919/date51398.2021.9474011
• 发表时间: 2021-02
• 期刊: 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE)
• 作者: Yenai Ma;Leila Delshadtehrani;Cansu Demirkıran;José L. Abellán;A. Joshi

WAVES: Wavelength Selection for Power-Efficient 2.5D-Integrated Photonic NoCs

WAVES：高能效 2.5D 集成光子 NoC 的波长选择

• DOI: 10.23919/date.2019.8715036
• 发表时间: 2019
• 期刊: Design Automation and Test in Europe
• 作者: Narayan, Aditya;Thonnart, Yvain;Vivet, Pascal;Tortolero, Cesar Fuguet;Coskun, Ayse K.
• 通讯作者: Coskun, Ayse K.

System-level Evaluation of Chip-Scale Silicon Photonic Networks for Emerging Data-Intensive Applications

• DOI: 10.23919/date48585.2020.9116496
• 发表时间: 2020-03
• 期刊: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)
• 作者: A. Narayan;Y. Thonnart;P. Vivet;A. Joshi;A. Coskun

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

POPSTAR：用于基于 Chiplet 的 3D 集成系统的稳健模块化光学 NoC 架构

• DOI: 10.23919/date48585.2020.9116214
• 发表时间: 2020
• 期刊: Design Automation and Test in Europe
• 作者: Thonnart, Yvain;Bernabe, Stephane;Charbonnier, Jean;Bernard, Christian;Coriat, David;Fuguet, Cesar;Tissier, Pierre;Charbonnier, Benoit;Malhouitre, Stephane;Saint-Patrice, Damien
• 通讯作者: Saint-Patrice, Damien