CAREER: Enabling Brian-like Computing through 3D Neuromorphic Circuits and Systems

职业：通过 3D 神经形态电路和系统实现类 Brian 计算

• 批准号: 1750450
• 负责人: Yang Yi
• 金额: $ 43.05万
• 依托单位: Virginia Polytechnic Institute and State University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2018
• 资助国家: 美国
• 起止时间: 2018-03-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1750450&HistoricalAwards=false
• 关键词: CAREER; Enabling; Brian; like; Computing

This project addresses design challenges in building a brain-like computing system through three-dimensional (3D) neuromorphic circuits, and using Through Silicon Via (TSV) - based 3D Integrated Circuits. The approach is expected to reduce the design area occupied by conventional capacitors, resulting in chip design-area reduction and improvement in chip performance and efficiency. A Computer Aided Design framework will be developed to optimize the use of these reconfigured TSVs. The resulting devices, circuits, and framework will be validated using silicon tape outs and emerging applications, e.g., advanced wireless broadband communications. In addition to enabling educational and outreach programs, the project provides industrial experience for underrepresented students, thus contributing to the development of workforce in this area of technology.The project undertakes a systematic attempt to explore the alternative use of TSVs as capacitors in 3D Neuromorphic Computing (NC) circuits. The NC chips require membrane capacitors to power the process of "neuron firing", and, depending on specifications, these capacitors can occupy from 25-75% of state-of-the-art electronic neuron's design area. This project entails the design of a NC chip in which idle TSVs are co-opted to function as capacitors. Three specific thrusts are proposed: reconfiguration and adaption of idle TSVs as capacitors; scalable, robust, and energy-efficient 3D NC circuit design; and system prototype and emerging applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该项目解决了通过三维（3D）神经形态电路构建类脑计算系统的设计挑战，并使用基于硅通孔（TSV）的3D集成电路。该方法有望减少传统电容器所占用的设计面积，从而减少芯片设计面积，提高芯片性能和效率。将开发计算机辅助设计框架来优化这些重新配置的TSV的使用。由此产生的器件、电路和框架将使用硅流片和新兴应用进行验证，例如，先进的无线宽带通信。除了教育和推广计划，该项目还为代表性不足的学生提供工业经验，从而促进该技术领域的劳动力发展。该项目进行了系统的尝试，探索TSV作为电容器在3D神经形态计算（NC）电路中的替代用途。NC芯片需要膜电容器来为“神经元放电”过程提供动力，并且根据规格，这些电容器可以占据最先进的电子神经元设计面积的25-75%。本计画设计一个NC晶片，利用闲置的TSV做为电容器。该奖项提出了三个具体目标：将闲置TSV重新配置和调整为电容器;可扩展、稳健和节能的3D NC电路设计;系统原型和新兴应用。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Low-power Analog and Mixed-signal IC Design of Multiplexing Neural Encoder in Neuromorphic Computing

神经形态计算中多路复用神经编码器的低功耗模拟和混合信号 IC 设计

• DOI: 10.1109/isqed51717.2021.9424267
• 发表时间: 2021
• 期刊: 2021 22nd International Symposium on Quality Electronic Design (ISQED
• 作者: Zheng, Honghao;Mohammadi, Nima;Bai, Kangjun;Yi, Yang
• 通讯作者: Yi, Yang

Memristor-based Deep Spiking Neural Network with a Computing-In-Memory Architecture

• DOI: 10.1109/isqed54688.2022.9806206
• 发表时间: 2022-04
• 期刊: 2022 23rd International Symposium on Quality Electronic Design (ISQED)
• 作者: Fabiha Nowshin;Y. Yi

FPGA-based Reservoir Computing with Optimized Reservoir Node Architecture

基于FPGA的油藏计算，优化油藏节点架构

• DOI: 10.1109/isqed54688.2022.9806247
• 发表时间: 2022
• 期刊: 2022 23rd International Symposium on Quality Electronic Design (ISQED
• 作者: Lin, Chunxiao;Liang, Yibin;Yi, Yang
• 通讯作者: Yi, Yang

A Hybrid FPGA-ASIC Delayed Feedback Reservoir System to Enable Spectrum Sensing/Sharing for Low Power IoT Devices ICCAD Special Session Paper

一种混合 FPGA-ASIC 延迟反馈存储系统，可实现低功耗物联网设备的频谱感知/共享 ICCAD 特别会议论文

• DOI: 10.1109/iccad51958.2021.9643536
• 发表时间: 2020
• 期刊: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD
• 作者: Shears, Osaze;Bai, Kangjun;Liu, Lingjia;Yi, Yang
• 通讯作者: Yi, Yang

Moving Toward Intelligence: Detecting Symbols on 5G Systems Through Deep Echo State Network

迈向智能化：通过深度回声状态网络检测 5G 系统上的符号

• DOI: 10.1109/jetcas.2020.2992238
• 发表时间: 2020
• 期刊: IEEE Journal on Emerging and Selected Topics in Circuits and Systems
• 影响因子: 4.6
• 作者: Bai, Kangjun;Yi, Yang;Zhou, Zhou;Jere, Shashank;Liu, Lingjia
• 通讯作者: Liu, Lingjia