CRII:SHF: Enabling Technologies for Three Dimensional (3D) Millimeter-Wave Integrated Circuits: Through Silicon Via (TSV) Modeling and Design

毫米波通信被认为是解决移动数据业务指数级增长导致的频谱短缺问题的一项新兴技术。该项目解决了三维(3D)毫米波集成电路(IC)的基本科学问题和高级设计挑战，这些集成电路能够处理新兴通信系统所需的非常宽的系统带宽。该项目将通过为超高频(UHF)频段无线通信提供电路设计方面的基本理解，促进3D集成的进一步发展，并在半导体制造和电子设计领域更广泛地采用这一新兴技术。除了技术影响外，国际和平协会还将制定一项扩大参与计划和一项教育计划，使代表人数不足的群体的学生沉浸在电子电路领域。本研究开发的工具和技术将用于开发和教授新课程。外展活动将从高中到研究生阶段，充分利用大学多样性计划以及密苏里州-爱荷华州-内布拉斯加州-堪萨斯州妇女计算机计划。此外，PI将利用与几家领先的半导体公司的合作，为本科生和研究生设立技术研讨会和实习计划。将直通硅通孔(TSV)应用于毫米波移动宽带无线通信的三维集成可以提供小型化机会、性能改进和功耗降低。3DIC中最关键的部件和挑战之一是TSV的建模和设计。鉴于3D毫米波集成电路的巨大前景和设计挑战，该项目旨在引入新的想法，开发系统原型，以及一个新的、变革性的方向，以促进TSV设计在所有级别--电路、系统和计算机辅助设计(CAD)--的发展。建议的TSV建模和分析方法可以与现有的电子设计和自动化(EDA)工具相结合。本项目通过对毫米波集成电路的关键部件之一的研究，试图为具有更高可靠性、更低功耗、更小延迟和更高系统小型化的毫米波系统的实用设计方法奠定基础。

Millimeter-wave (mmW) communications is regarded as an emerging technology to resolve the spectrum shortage issues resulting from the exponential growth of mobile data traffic. This project addresses the fundamental scientific issues and advanced design challenges of the three-dimensional (3D) mmW integrated circuits (ICs) capable of handling very wide system bandwidth required for emerging communication systems. The project will facilitate further advances in 3D integration and broader adoption of this emerging technology in semiconductor manufacturing and electronic design community by offering fundamental understandings in circuit design for beyond ultra-high frequency (UHF) band wireless communications. In addition to technological impact, the PI will develop a broadening participation plan and an educational plan that will immerse students from the underrepresented groups in the field of electronic circuits. Tools and techniques developed in this research will be used for developing and teaching new courses. Outreach activities will span from the high school level up through the graduate level making full use of University Diversity Programs as well as Missouri-Iowa-Nebraska-Kansas Women in Computing Program. Furthermore, the PI will leverage the collaboration with several leading semiconductor companies to set up technical seminars and internship programs for both undergraduate and graduate students.Three dimensional integration with Through Silicon Vias (TSVs) applied to the mmW mobile broadband wireless communications could offer miniaturization opportunities, performance improvement, and power consumption reduction. One of the most critical components and challenges in 3D ICs is the modeling and design of TSVs. In light of the great promise and design challenges of 3D mmW ICs, this project targets to introducing new ideas, developing system prototypes, as well as a new and transformative direction for the advancement of TSV design at all levels - circuits, systems, and computer-aided design (CAD). The proposed TSV modeling and analysis methodologies could be integrated with existing Electronics Design and Automation (EDA) tools. By investigating one of the key components of mmW ICs, this project attempts to lay a foundation for a practical design methodology for the mmW systems with higher reliability, lower power consumption, reduced delay, and increased system miniaturization.