SBIR Phase II: Novel Semiconductor Warpage Measurement Device
SBIR Phase II: Novel Semiconductor Warpage Measurement Device
批准号:
1758583
负责人:
Tong Cui
金额:
$75.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2018
资助国家:
美国
项目状态:
已结题
起止时间:
2018-03-01 至 2020-10-31
中文摘要
这个小企业创新研究(SBIR)第二阶段项目的更广泛的影响/商业潜力是实现更薄、更灵活和异构半导体器件的先进集成。它将加速下一代集成电路芯片的采用,并通过高性能电子产品的发展为社会带来重大利益。在移动互联网行业便携式设备和物联网(IOT)降低成本要求的推动下,集成电路芯片变得越来越薄,越来越灵活,而工作环境则使其暴露在更加极端的条件下。这一趋势带来了越来越多的挑战,并降低了可靠性,因为它们更容易发生故障。这种提出的新型光机械系统能够识别潜在问题的早期迹象。它可以通过显着缩短开发周期和工程劳动力,加速最近向物联网和自动驾驶汽车发展的工业趋势。这些新兴的工业趋势引发了许多机械可靠性问题,并且使半导体器件难以满足所需的质量和可靠性。在集成电路设计和生产线上使用能够测量微米级灵敏度的仪器时,可以预见到许多这些问题。本项目的目标是开发一种非接触检测过早失效的系统。成像方法和立体摄像机用于测量和跟踪样品。预期的结果是开发出一种比现有仪器性能提高十倍的仪器。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is the enablement of advanced integration of thinner, more flexible and heterogeneous semiconductor devices. It will accelerate the adoption of next generation integrated circuit chips and bring significant benefit to society through the development of high performance electronics. Driven by portable devices in the mobile internet industry and the cost reduction requirements in Internet of Things (IOT), integrated circuit chips are becoming thinner and more flexible, whereas the working environments expose them to more extreme conditions. This trend creates increasing challenges and reducing reliability due to their higher inclination to failure. This proposed novel opto-mechanical system is able to identify early indications of potential problems. It can accelerate the recent industrial trends moving toward IOT and autonomous vehicle by significantly reducing development cycle time and engineering labor. These emerging industrial trends have induced many mechanical reliability issues, and are making it difficult to meet required quality and reliability of semiconductor devices. Many of these issues could be anticipated in integrated circuit design and on production lines with an instrument capable of measuring the sensitivity at the micron level. The objective of this proposed project is to develop a system for noncontact detection of premature failure. An imaging approach and stereo cameras are used to measure and track the sample. The anticipated result is to develop an instrument with ten-fold performance improvement over instruments currently available.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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SBIR Phase I: Novel Semiconductor Warpage Measurement Device
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批准号:1647636
-
项目类别:Standard Grant
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资助金额:$22.5万
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财政年份:2016
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负责人:Tong Cui
-
依托单位:
国内基金
海外基金
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