SBIR Phase II: Novel Semiconductor Warpage Measurement Device

SBIR 第二阶段：新型半导体翘曲测量装置

• 批准号: 1758583
• 负责人: Tong Cui
• 金额: $ 75万
• 依托单位: C&B Tech
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2018
• 资助国家: 美国
• 起止时间: 2018-03-01 至 2020-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1758583&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Novel; Semiconductor

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is the enablement of advanced integration of thinner, more flexible and heterogeneous semiconductor devices. It will accelerate the adoption of next generation integrated circuit chips and bring significant benefit to society through the development of high performance electronics. Driven by portable devices in the mobile internet industry and the cost reduction requirements in Internet of Things (IOT), integrated circuit chips are becoming thinner and more flexible, whereas the working environments expose them to more extreme conditions. This trend creates increasing challenges and reducing reliability due to their higher inclination to failure. This proposed novel opto-mechanical system is able to identify early indications of potential problems. It can accelerate the recent industrial trends moving toward IOT and autonomous vehicle by significantly reducing development cycle time and engineering labor. These emerging industrial trends have induced many mechanical reliability issues, and are making it difficult to meet required quality and reliability of semiconductor devices. Many of these issues could be anticipated in integrated circuit design and on production lines with an instrument capable of measuring the sensitivity at the micron level. The objective of this proposed project is to develop a system for noncontact detection of premature failure. An imaging approach and stereo cameras are used to measure and track the sample. The anticipated result is to develop an instrument with ten-fold performance improvement over instruments currently available.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小型企业创新研究（SBIR）第二阶段项目的更广泛的影响/商业潜力是实现更薄，更灵活和异构半导体器件的高级集成。它将加速下一代集成电路芯片的采用，并通过开发高性能电子产品为社会带来重大利益。在移动的互联网行业中的便携式设备和物联网（IOT）中的成本降低要求的驱动下，集成电路芯片变得更薄和更灵活，而工作环境使它们暴露于更极端的条件下。这种趋势带来了越来越多的挑战，并由于其更高的故障倾向而降低了可靠性。这种新型的光机系统能够识别潜在问题的早期迹象。它可以通过显着减少开发周期和工程劳动力来加速最近的工业趋势，转向物联网和自动驾驶汽车。 这些新兴的工业趋势已经引发了许多机械可靠性问题，并且使得难以满足半导体器件所需的质量和可靠性。这些问题中的许多问题可以在集成电路设计和生产线上使用能够在微米级测量灵敏度的仪器进行预期。本项目的目标是开发一种非接触式过早失效检测系统。使用成像方法和立体相机来测量和跟踪样品。预期的结果是开发一种性能比现有仪器提高十倍的仪器。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。