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Fundamental Study and Pragmatic Enhancement of Single Point Diamond Turning through Embedded Thin Film Sensor Arrays

Fundamental Study and Pragmatic Enhancement of Single Point Diamond Turning through Embedded Thin Film Sensor Arrays
通过嵌入式薄膜传感器阵列进行单点金刚石车削的基础研究和实用增强
批准号:
233422078
负责人:
Professor Dr.-Ing. Eckart Uhlmann
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2013
资助国家:
德国
项目状态:
已结题
起止时间:
2012-12-31 至 2017-12-31

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中文摘要
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英文摘要
Ultra-precision machining with diamond tools is increasingly being used for various manufacturing operations over a wide spectrum of applications with mainly optical background ranging from semiconductor devices, medical components to laser technology. This international collaborative research project will introduce new temperature and force measurement technology to ultra-precision operations. These sensors will be embedded into diamond tools and produced by thin film technologies; they will be only a few microns in size and located in the direct vicinity of the cutting edge zone. Providing response times in the sub-millisecond range, the sensors will allow new insights into the thermo-chemical and thermo-mechanical process of ultra-precision cutting. Applying these new embedded sensors, the IWF will focus on the investigation of the thermo-chemical wear behavior of three different diamond materials and the introduction of new monitoring and control schemes to avoid wear based on measurements with micro embedded thin film temperature and force sensors.
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