Fundamental Study and Pragmatic Enhancement of Single Point Diamond Turning through Embedded Thin Film Sensor Arrays

通过嵌入式薄膜传感器阵列进行单点金刚石车削的基础研究和实用增强

• 批准号: 233422078
• 负责人: Professor Dr.-Ing. Eckart Uhlmann
• 金额: --
• 依托单位: Fachgebiet Werkzeugmaschinen und Fertigungstechnik
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2013
• 资助国家: 德国
• 起止时间: 2012-12-31 至 2017-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/233422078?language=en
• 关键词: Fundamental; Study; Pragmatic; Enhancement; Single

Ultra-precision machining with diamond tools is increasingly being used for various manufacturing operations over a wide spectrum of applications with mainly optical background ranging from semiconductor devices, medical components to laser technology. This international collaborative research project will introduce new temperature and force measurement technology to ultra-precision operations. These sensors will be embedded into diamond tools and produced by thin film technologies; they will be only a few microns in size and located in the direct vicinity of the cutting edge zone. Providing response times in the sub-millisecond range, the sensors will allow new insights into the thermo-chemical and thermo-mechanical process of ultra-precision cutting. Applying these new embedded sensors, the IWF will focus on the investigation of the thermo-chemical wear behavior of three different diamond materials and the introduction of new monitoring and control schemes to avoid wear based on measurements with micro embedded thin film temperature and force sensors.

使用金刚石工具的超精密加工越来越多地被用于各种制造操作，应用范围广泛，主要是光学背景，从半导体设备、医疗部件到激光技术。这一国际合作研究项目将把新的温度和力测量技术引入超精密操作。这些传感器将嵌入到钻石工具中，并由薄膜技术生产；它们的大小只有几个微米，位于切削区的直接附近。传感器提供亚毫秒级的响应时间，将允许对超精密切割的热化学和热机械过程进行新的洞察。应用这些新的嵌入式传感器，IWF将重点研究三种不同金刚石材料的热化学磨损行为，并引入新的监测和控制方案，以避免基于微型嵌入式薄膜温度和力传感器测量的磨损。