SBIR Phase I: Manufacturable Implementation of Thin Glass for Next Generation Electronics Packaging

SBIR 第一阶段：下一代电子封装薄玻璃的可制造实施

• 批准号: 1843230
• 负责人: Shelby Nelson
• 金额: $ 22.5万
• 依托单位: MOSAIC MICROSYSTEMS LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-02-01 至 2020-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1843230&HistoricalAwards=false
• 关键词: SBIR; Phase; Manufacturable; Implementation; Thin

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is that enabling processing thin glass substrates for next generation communications and packaging needs will mean faster communications with improved power efficiency. Society has an ever-expanding need for data, due to technologies such as mobile communications, cloud computing, the Internet of Things (IoT), and the shift of communication to higher frequencies (1s-10s of GHz). As the frequency increases, traditional material choices, such as silicon, can experience very high losses and therefore there is increasing interest in using insulating materials, such as glass, to improve power efficiency. Similarly, as device size is also important, ability to process thin materials is also critical. Successful completion of this work will enable cost-effective processing of thin glass substrates and enable next generation communication initiatives impacting commercial, military and industrial markets.This Small Business Innovation Research (SBIR) Phase I project is proposed to enable processing thin glass substrates in high volume environments. There has been substantial interest in using glass for next generation RF and packaging solutions for many years due to its advantageous material properties, and scalability. Of particular interest is the dielectric properties, which provide low electrical loss solutions relative to incumbent materials such as silicon. Furthermore, the smoothness, hermetic properties and scalability of glass provides additional advantages over materials such as ceramics and organic laminates. There has been a lot of progress in establishing processes to form thin glass and make precision through glass vias (TGV), as well as demonstrating advantaged functional performance in a lab environment. There has been a challenge to establish the ability to scale to high volume for thin glass solutions due to gaps in the supply chain. This SBIR project will establish a process that enables a carrier solution using a silicon carrier that will allow processing of glass in existing infrastructure making thin glass solutions available to the current well established and capable supply chain.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该小型企业创新研究（SBIR）第一阶段项目的更广泛影响/商业潜力在于，能够处理下一代通信和封装需求的薄玻璃基板将意味着更快的通信和更高的功率效率。 由于移动的通信、云计算、物联网（IoT）等技术以及通信向更高频率（1 - 10 GHz）的转变，社会对数据的需求不断扩大。 随着频率的增加，传统的材料选择，如硅，可能会经历非常高的损耗，因此越来越多的人对使用绝缘材料，如玻璃，以提高功率效率感兴趣。 类似地，由于器件尺寸也很重要，因此处理薄材料的能力也很关键。 这项工作的成功完成将使薄玻璃基板的加工具有成本效益，并使下一代通信计划能够影响商业，军事和工业市场。这个小企业创新研究（SBIR）第一阶段项目旨在实现在大批量环境中加工薄玻璃基板。 多年来，由于玻璃具有优越的材料特性和可扩展性，人们对将其用于下一代RF和封装解决方案产生了浓厚的兴趣。 特别感兴趣的是介电性质，其提供相对于诸如硅的现有材料的低电损耗解决方案。 此外，玻璃的光滑度、气密性和可缩放性提供了优于诸如陶瓷和有机层压材料的额外优点。 在建立形成薄玻璃和制造精密玻璃通孔（TGV）的工艺以及在实验室环境中展示可编程功能性能方面取得了很大进展。 由于供应链中的缺口，建立大批量生产薄玻璃解决方案的能力一直是一个挑战。 该SBIR项目将建立一种工艺，使使用硅载体的载体解决方案能够在现有基础设施中加工玻璃，使薄玻璃解决方案可用于当前完善和有能力的供应链。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。