SBIR Phase II: Manufacturable Implementation of Thin Glass for Next Generation Electronics Packaging

SBIR 第二阶段：下一代电子封装薄玻璃的可制造实施

• 批准号: 1951114
• 负责人: Shelby Nelson
• 金额: $ 74.8万
• 依托单位: MOSAIC MICROSYSTEMS LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2020
• 资助国家: 美国
• 起止时间: 2020-04-01 至 2022-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1951114&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Manufacturable; Implementation

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is to develop a packaging platform for the next generation communications electronics, particularly for 5G applications for defense and commercial use. Enabling the processing of thin glass substrates for next-generation communications and packaging needs will mean faster communications with improved power efficiency. The wide range of applications and end markets include mobile devices and infrastructure, automotive radar, internet of things, and other uses. This Small Business Innovation Research (SBIR) Phase II project enables thin glass packaging solutions to be processed in existing semiconductor factories. As the need for data volume drives wireless technology towards frequency bands in the 30-100 GHz range, commonly used packaging substrates begin to fail. Glass is an attractive alternative due to its dimensional stability, smooth surfaces, low RF absorption up to 100 GHz, limited dielectric constant variation with temperature, and moisture insensitivity. Reduced thickness also decreases interconnect length (yielding low loss and low latency) and reduces overall product thickness. Thin glass can be difficult to handle in a free-standing state. In this project, thin glass using a novel handling solution will be fully metallized and patterned on both sides, creating test structures verifying through-glass via integrity, reliability, and robustness. Optimized metallization approaches will be explored, along with improvements to second-side processing, for commercially relevant wafer substrates.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小型企业创新研究(SBIR)第二阶段项目的更广泛影响/商业潜力是为下一代通信电子产品开发包装平台，特别是用于国防和商业用途的5G应用。为下一代通信和封装需求实现薄玻璃基板的加工将意味着更快的通信和更高的电源效率。广泛的应用和终端市场包括移动设备和基础设施、汽车雷达、物联网和其他用途。这个小型企业创新研究(SBIR)第二阶段项目使薄玻璃封装解决方案能够在现有的半导体工厂中进行加工。随着对数据量的需求推动无线技术向30-100 GHz范围的频段发展，常用的封装基板开始失效。玻璃因其尺寸稳定、表面光滑、100 GHz以下的低射频吸收、有限的介电常数随温度变化以及对湿度不敏感而成为一种有吸引力的选择。减小厚度还会缩短互连长度(产生低损耗和低延迟)，并减少整体产品厚度。薄玻璃在独立状态下可能很难处理。在这个项目中，使用新型处理解决方案的薄玻璃将在两侧完全金属化和图案化，创建测试结构，通过完整性、可靠性和坚固性来验证透过玻璃。对于商业相关的晶片基板，将探索优化的金属化方法以及第二方工艺的改进。该奖项反映了NSF的法定使命，通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。