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Formal verification of firmware-based System-on-Chip modules

Formal verification of firmware-based System-on-Chip modules
基于固件的片上系统模块的形式验证
批准号:
238346861
负责人:
Professor Dr.-Ing. Wolfgang Kunz
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2013
资助国家:
德国
项目状态:
已结题
起止时间:
2012-12-31 至 2016-12-31

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中文摘要
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英文摘要
In modern design practices for System-on-Chip (SoC) modules a strong trend towards a firmware-based design style can be observed. Certain control functions of an SoC module are no longer implemented in hardware but as firmware running on processors instantiated particularly for this purpose. Firmware is a special software that is not accessible to the user of this module and that is stored, e.g., in a ROM (read-only-memory) already during manufacturing of the chip. This design style enjoys particular popularity especially with FPGA (field programmable gate array) designs and offers several advantages with respect to area consumption and maintainability. However, the tight coupling of hardware and software at a low level of granularity raises substantial verification challenges since the conventional practice of verifying hardware and software independently is no longer sufficient. In this project, formal verification techniques for firmware-based SoC modules shall be explored. The starting point of this project is a comprehensive case study in collaboration with Xilinx Inc. to assess the special characteristics of a firmware-based design style and the resulting implications for verification. The objective of this project is to do research in and to develop fully automatic techniques for generating joint computational models for hardware and software. The new models will allow us to apply standard methods of hardware verification also to firmware-based SoC designs. The project benefits from the proposer's long experience in the field of System-on-Chip verification as well as from active collaborations with industrial providers as well as users of formal verification technology.
期刊论文(5)
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会议论文
A HW-dependent software model for cross-layer fault analysis in embedded systems
用于嵌入式系统跨层故障分析的硬件相关软件模型
DOI: 10.1109/latw.2016.7483356
发表时间: 2016
期刊: 2016 17th Latin-American Test Symposium (LATS)
影响因子: --
作者: [C. Bartsch, C. Villarraga, D. Stoffel, W. Kunz]
通讯作者: W. Kunz
DOI: 10.1145/2968455.2968505
发表时间: 2016-10
期刊: 2016 International Conference on Compliers, Architectures, and Sythesis of Embedded Systems (CASES)
影响因子: --
作者: [M. Ammar;Benguettache Khadra;D. Stoffel;W. Kunz]
通讯作者: M. Ammar;Benguettache Khadra;D. Stoffel;W. Kunz
Software in a hardware view: New models for HW-dependent software in SoC verification and test
硬件视图中的软件:SoC 验证和测试中依赖于硬件的软件的新模型
DOI: 10.1109/test.2014.7035308
发表时间: 2014
期刊: 2014 International Test Conference
影响因子: --
作者: [C. Villarraga, B. Schmidt, B. Bao, C. Bartsch, T. Fehmel, D. Stoffel, W. Kunz]
通讯作者: W. Kunz
Cycle-accurate software modeling for RTL verification of embedded systems
用于嵌入式系统 RTL 验证的周期精确软件建模
DOI: 10.1109/ddecs.2017.7934571
发表时间: 2017
期刊: 2017 IEEE 20th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)
影响因子: --
作者: [M. Schwarz, C. Villarraga, D. Stoffel, W. Kunz]
通讯作者: W. Kunz
Hardware/Software Cross-Layer Fault Analysis for Safe Embedded System Design
Property First Hardware Design - A Correct-by-Construction Methodology for RTL Design from System Level Models
Formale Verifikation sequentieller und arithmetischer Schaltungsblöcke durch strukturelle Methoden
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