Hardware/Software Cross-Layer Fault Analysis for Safe Embedded System Design
Hardware/Software Cross-Layer Fault Analysis for Safe Embedded System Design
批准号:
360597144
负责人:
Professor Dr.-Ing. Wolfgang Kunz
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2017
资助国家:
德国
项目状态:
已结题
起止时间:
2016-12-31 至 2022-12-31
中文摘要
点击翻译按钮获取中文摘要
英文摘要
Throughout today's industrial world Embedded System technology is taking over more and more tasks in safety-critical applications. Autonomous driving is a prominent example. As a result, the requirement of functional safety has become a key concern and, not rarely, defines the economic operating point of a new technology. At the same time, as a result of new microelectronic fabrication technologies, new hardware devices are emerging which suffer from an intrinsically higher susceptibility to faults than previous devices. This leads to a substantially lower degree of reliability and demands further improvements of methods for error protection. However, any attempt to cover all errors for all theoretically possible scenarios that a system might be used in can easily lead to excessive costs. There is consensus within the testing community that new application-dependent approaches are needed to meet these challenges. This means that strategies for test and error resilience must target only those errors that can really have an effect in the applications in which the hardware is actually used. These applications are defined by the software. The proposed project pursues the goal of developing a HW/SW cross-layer approach to assess the effect of hardware faults at the software level. The focus of the proposed analysis will lie on low-level software. Methods will be researched that allow for a formal analysis tracing the propagation of hardware faults when executing the system's software. A particular goal of our research is to provide techniques and a tool to identify hardware faults that do not have any effect on the software or on selected, possibly safety-critical, software components. Moreover, the envisioned approach will allow us to classify faults with respect to their fault effects. For example, faults can be identified that may affect the data of a program but it is guaranteed that they do not change its control flow.The proposed approach does not only give hints on what faults are particularly critical. In contrast to previous simulation-based approaches it can certify that certain faults do not affect the system behavior at all, or that the effect is limited to certain sub-functions. This information is highly valuable when evaluating the safety of a system and when taking possible measures for fault protection. The project will give a first demonstration for the usefulness of the proposed analysis by applying it to design measures that improve the fault resilience of the system.
期刊论文(4)
专著(0)
科研奖励(0)
会议论文
登录
查看更多内容
A HW/SW Cross-Layer Approach for Determining Application-Redundant Hardware Faults in Embedded Systems
用于确定嵌入式系统中应用冗余硬件故障的硬件/软件跨层方法
DOI:
10.1007/s10836-017-5643-3
发表时间:
2017
期刊:
Journal of Electronic Testing
影响因子:
--
作者:
[C. Bartsch, C. Villarraga, D. Stoffel, W. Kunz]
通讯作者:
W. Kunz
DOI:
10.1145/3368089.3409694
发表时间:
2020-04
期刊:
Proceedings of the 28th ACM Joint Meeting on European Software Engineering Conference and Symposium on the Foundations of Software Engineering
影响因子:
--
作者:
[M. Ammar Ben Khadra;D. Stoffel;W. Kunz]
通讯作者:
M. Ammar Ben Khadra;D. Stoffel;W. Kunz
Compositional Fault Propagation Analysis in Embedded Systems using Abstract Interpretation
使用抽象解释的嵌入式系统中的组合故障传播分析
DOI:
10.1109/itc50571.2021.00057
发表时间:
2021
期刊:
2021 IEEE International Test Conference (ITC)
影响因子:
--
作者:
[Daniel Kästner, Stephan Wilhelm, Christian Bartsch, Dominik Stoffel, Wolfgang Kunz]
通讯作者:
Wolfgang Kunz
Generation of Formal CPU Profiles for Embedded Systems
生成嵌入式系统的正式 CPU 配置文件
DOI:
10.1109/vlsi-soc54400.2022.9939572
发表时间:
2022
期刊:
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC)
影响因子:
--
作者:
[Stian Sørensen, Christian Bartsch, Dominik Stoffel, Wolfgang Kunz]
通讯作者:
Wolfgang Kunz
Property First Hardware Design - A Correct-by-Construction Methodology for RTL Design from System Level Models
-
批准号:328724410
-
项目类别:Research Grants
-
资助金额:$0.0万
-
财政年份:2016
-
负责人:Professor Dr.-Ing. Wolfgang Kunz
-
依托单位:
Formal verification of firmware-based System-on-Chip modules
-
批准号:238346861
-
项目类别:Research Grants
-
资助金额:$0.0万
-
财政年份:2013
-
负责人:Professor Dr.-Ing. Wolfgang Kunz
-
依托单位:
Formale Verifikation sequentieller und arithmetischer Schaltungsblöcke durch strukturelle Methoden
-
批准号:5198506
-
项目类别:Research Grants
-
资助金额:$0.0万
-
财政年份:1999
-
负责人:Professor Dr.-Ing. Wolfgang Kunz
-
依托单位:
海外基金