Fundamental Understanding of Residual Stress in Binary and Ternary Nitride Thin Films: Measurements and Modeling
对二元和三元氮化物薄膜中残余应力的基本理解:测量和建模
基本信息
- 批准号:2006422
- 负责人:
- 金额:$ 62万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2020
- 资助国家:美国
- 起止时间:2020-07-01 至 2025-06-30
- 项目状态:未结题
- 来源:
- 关键词:
项目摘要
NON-TECHNICAL DESCRIPTION: Nitride thin films are widely used in applications such as protective tool coatings and microelectronic interconnects. However, the deposited films often have large amounts of residual stress that can reduce their performance or lead to failure. A more fundamental understanding of the connection between the film deposition conditions and the resulting stress is needed in order to control and predict the stress. This understanding is achieved by performing comprehensive measurements and using them to develop a model that can predict the stress under different conditions. This provides a science-based method to choose the processing parameters instead of trial-and-error. Sharing this model with others impacts the broad community of thin film users by providing a tool to analyze and optimize their growth processes. The students who are trained on this project develop a deep understanding of the kinetic processes controlling thin film growth that are valuable in industries such as automotive components and semiconductor processing. TECHNICAL DETAILS: The research on stress in nitride thin films integrates measurements with the development of a quantitative model. The measurements are performed in real-time during the deposition of the films using an optical technique. The different processing parameters (growth rate, pressure, nitrogen flow rate) are systematically varied so that a comprehensive set of data is generated. The measurements are done on both binary nitrides (nitride with a single transition metal species) and ternary nitrides (nitride with two transition metal species) with different compositions. The data is used to develop a set of rate equations based on the underlying kinetic mechanisms that can calculate the stress for different processing conditions. Applying the model equations to the experiments allows a set of kinetic parameters to be extracted for each material. This is important for interpreting the data and understanding the processes controlling the stress. It also transforms the method of choosing processing conditions by predicting parameters that can produce the desired stress. A user-friendly web-based version of the model can be used by others to analyze their own results and select the best processing conditions for their needs.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
非技术描述:氮化物薄膜广泛用于保护工具涂层和微电子互连等应用。然而,沉积的薄膜往往存在大量的残余应力,这可能会降低其性能或导致失效。为了控制和预测应力,需要对薄膜沉积条件和所产生的应力之间的关系有更基本的了解。这种理解是通过执行全面的测量并使用它们来开发一个可以预测不同条件下的应力的模型来实现的。这为选择加工参数提供了一种科学的方法,而不是反复试验。通过提供分析和优化薄膜用户生长过程的工具,与其他人共享此模型会对广大薄膜用户社区产生影响。接受该项目培训的学生对控制薄膜生长的动力学过程有深入的了解,这些过程在汽车零部件和半导体加工等行业中很有价值。技术细节:氮化物薄膜中的应力研究将测量与开发定量模型结合在一起。使用光学技术在薄膜沉积期间实时执行测量。系统地改变不同的工艺参数(生长速度、压力、氮气流量),以生成一组全面的数据。对具有不同组成的二元氮化物(含单一过渡金属物种的氮化物)和三元氮化物(含两种过渡金属物种的氮化物)进行了测量。这些数据被用来根据基本的动力学机制开发一组速率方程,这些方程可以计算不同加工条件下的应力。将模型方程应用到实验中,可以为每种材料提取一组动力学参数。这对于解释数据和理解控制压力的过程是重要的。它还通过预测能够产生所需应力的参数来改变选择加工条件的方法。该模型的一个用户友好的基于网络的版本可以被其他人用来分析他们自己的结果并选择符合他们需求的最佳处理条件。该奖项反映了NSF的法定使命,并通过使用基金会的智力优势和更广泛的影响审查标准进行评估,被认为值得支持。
项目成果
期刊论文数量(7)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Effect of grain size on thin film stress and morphology using kinetic Monte Carlo simulations
使用动力学蒙特卡罗模拟晶粒尺寸对薄膜应力和形态的影响
- DOI:10.1063/5.0023081
- 发表时间:2020
- 期刊:
- 影响因子:3.2
- 作者:Chason, Eric;Jagtap, Piyush
- 通讯作者:Jagtap, Piyush
Inter-relationship of stress and microstructure in BCC and ‘beta’ tungsten films
BCC 和 β 钨薄膜中应力与微观结构的相互关系
- DOI:10.1016/j.surfcoat.2023.129336
- 发表时间:2023
- 期刊:
- 影响因子:5.4
- 作者:Johnson, Jonathan A.;Su, Tong;Chason, Eric;Thompson, Gregory B.
- 通讯作者:Thompson, Gregory B.
Effect of processing conditions on residual stress in sputtered transition metal nitrides (TiN, ZrN and TaN): Experiments and modeling
加工条件对溅射过渡金属氮化物(TiN、ZrN 和 TaN)残余应力的影响:实验和建模
- DOI:10.1016/j.surfcoat.2022.128880
- 发表时间:2022
- 期刊:
- 影响因子:5.4
- 作者:Rao, Zhaoxia;Su, Tong;Koenig, Thomas;Thompson, Gregory B.;Depla, Diederik;Chason, Eric
- 通讯作者:Chason, Eric
The microstructural and stress evolution in sputter deposited Ni thin films
- DOI:10.1016/j.surfcoat.2021.126973
- 发表时间:2021-02
- 期刊:
- 影响因子:5.4
- 作者:T. Koenig;Z. Rao;E. Chason;G. Tucker;G. Thompson
- 通讯作者:T. Koenig;Z. Rao;E. Chason;G. Tucker;G. Thompson
Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W
使用 Cu、Ni、Co、Cr、Mo、W 动力学模型分析溅射沉积薄膜中的应力
- DOI:10.1016/j.apsusc.2022.156000
- 发表时间:2023
- 期刊:
- 影响因子:6.7
- 作者:Su, Tong;Rao, Zhaoxia;Berman, Sarah;Depla, Diederik;Chason, Eric
- 通讯作者:Chason, Eric
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Eric Chason其他文献
Separating Nucleation from Growth Kinetics of Sn Whiskers using Thermal Pretreatment Followed by Mechanical Loading
- DOI:
10.1007/s11664-024-11522-x - 发表时间:
2024-10-26 - 期刊:
- 影响因子:2.500
- 作者:
Nupur Jain;Piyush Jagtap;Allan Bower;Eric Chason - 通讯作者:
Eric Chason
Computational tool for analyzing stress in thin films
用于分析薄膜应力的计算工具
- DOI:
- 发表时间:
2023 - 期刊:
- 影响因子:5.4
- 作者:
Eric Chason;Tong Su;Z. Rao - 通讯作者:
Z. Rao
Morphology of ion sputtered Cu(0 0 1) surface: Transition from unidirectional roughening to bidirectional roughening
- DOI:
10.1016/j.nimb.2005.08.026 - 发表时间:
2006-01-01 - 期刊:
- 影响因子:
- 作者:
Wai Lun Chan;Eric Chason - 通讯作者:
Eric Chason
Kinetic mechanisms in ion-induced ripple formation on Cu(0 0 1) surfaces
- DOI:
10.1016/j.nimb.2005.08.027 - 发表时间:
2006-01-01 - 期刊:
- 影响因子:
- 作者:
Eric Chason;Wai Lun Chan - 通讯作者:
Wai Lun Chan
Investigation of Tin (Sn) Film Using an Aerosol Jet Additive Manufacturing Deposition Process
- DOI:
10.1007/s11664-017-5524-7 - 发表时间:
2017-04-26 - 期刊:
- 影响因子:2.500
- 作者:
Aleksandra Fortier;Yue Liu;Iman Ghamarian; Peter C. Collins;Eric Chason - 通讯作者:
Eric Chason
Eric Chason的其他文献
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{{ truncateString('Eric Chason', 18)}}的其他基金
Dependence of Sn whisker nucleation and growth on stress: real-time experiments and development of a predictive model
锡晶须成核和生长对应力的依赖性:实时实验和预测模型的开发
- 批准号:
1903071 - 财政年份:2019
- 资助金额:
$ 62万 - 项目类别:
Continuing Grant
Residual stress in nitride thin films: integrated experiments and development of a predictive model
氮化物薄膜中的残余应力:综合实验和预测模型的开发
- 批准号:
1602491 - 财政年份:2016
- 资助金额:
$ 62万 - 项目类别:
Continuing Grant
Sn whiskers: fundamental mechanisms of nucleation and growth and applications to mitigation
锡晶须:成核和生长的基本机制及其在缓解方面的应用
- 批准号:
1501411 - 财政年份:2015
- 资助金额:
$ 62万 - 项目类别:
Continuing Grant
Sn Whisker Nucleation and Growth: Fundamental Mechanisms Controlling Where, When and Why Whiskers Form on Sn Coatings
锡晶须成核和生长:控制锡涂层上晶须形成的地点、时间和原因的基本机制
- 批准号:
1206138 - 财政年份:2012
- 资助金额:
$ 62万 - 项目类别:
Continuing Grant
MRI: Acquisition of an Advanced X-ray Diffraction System for the Brown University X-Ray Facility
MRI:为布朗大学 X 射线设施购置先进的 X 射线衍射系统
- 批准号:
1125928 - 财政年份:2011
- 资助金额:
$ 62万 - 项目类别:
Standard Grant
Whisker Formation in Sn Coatings on Cu: Fundamental Mechanisms and Approaches to Mitigation
铜上锡镀层中晶须的形成:基本机制和缓解方法
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0856229 - 财政年份:2009
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$ 62万 - 项目类别:
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SGER:大面积单晶外延电沉积
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0817507 - 财政年份:2008
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$ 62万 - 项目类别:
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