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Collaborative Research: Understanding Subsurface Damage and Residual Stress during Ultra-Precision Machining of Ceramics

Collaborative Research: Understanding Subsurface Damage and Residual Stress during Ultra-Precision Machining of Ceramics
合作研究:了解陶瓷超精密加工过程中的次表面损伤和残余应力
批准号:
2008563
负责人:
Sangkee Min
金额:
$33.23万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2020
资助国家:
美国
项目状态:
已结题
起止时间:
2020-09-01 至 2024-08-31

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中文摘要
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英文摘要
Ceramic materials have found various applications, especially under harsh conditions, thanks to their superior mechanical, electrical, optical, chemical, thermal, and biocompatible properties. However, since ceramics shatter upon impact rather than deform, manufacturing ceramic components with complex structures of high-quality surfaces is a challenge. Ultra-precision machining of ceramics has found a way to overcome this challenge by cutting or removing very tiny amounts of material. However, its productivity is not satisfactory and an understanding of the material behavior under cutting, especially at atomic scale, remains elusive. This award is to find optimized machining conditions for ceramic materials based on an improved understanding of material failure. This understanding is obtained by a combined strategy of state-of-the-art experiment and atomistic simulation approaches coupled with machine learning algorithms. This approach facilitates the machining of advanced ceramics without the need for extra post-processing, which is expensive and time consuming and, thus, achieves industry-required productivity. Moreover, by improving the fabrication process and damage control of ceramic materials, high quality ceramic components such as engine blocks, camera lenses, high energy lasers, and biomedical implants are possible, which benefits U.S. industry and economy. This research engages students from historically underrepresented groups in research experiences, leveraging programs such as Graduate Engineering Research Scholar and Women in Science and Engineering.This collaborative research combines experiment and atomistic simulations to understand how residual stress and subsurface damage form during ultra-precision machining of ceramics by considering three representative ceramic materials; two hard ceramics, sapphire and zirconia, and one soft ceramic, potassium dihydrogen phosphate. Ultra-precision machining of ceramics depends on the anisotropy in their crystal structure and its influence on the critical depth-of-cut where the ductile-to-brittle transition occurs. The cutting experiments are designed to quantify changes in residual stress and subsurface damage under various cutting conditions while the atomistic simulations provide a detailed understanding of the ductile and brittle behaviors of ceramics at the atomic scale during machining. Molecular dynamics methodology is employed for atomistic simulations. In particular, the multiscale approach, based on the atomistic-continuum coupling, enables performing simulations in more realistic and near-experimental conditions. Moreover, experiments and simulations provide sampling conditions for the machine learning algorithm based on K-nearest neighbor calculations, which determine the optimal cutting conditions necessary to minimize residual stress and subsurface damage and cracking. The machine learning predictions are, in turn, verified by machining experiments and simulations. With this knowledge, aggressive rough cutting is applied to meet scalable material removal rate while controlling residual stress and subsurface damage, followed by finish ductile-mode cutting to remove cracks and smooth out the surface.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(4)
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科研奖励(0)
会议论文
DOI: 10.1007/s12541-023-00776-w
发表时间: 2023-03
期刊: International Journal of Precision Engineering and Manufacturing
影响因子: 1.9
作者: [S. Kwon;A. Nagaraj;Dalei Xi;Yiyang Du;Dae Nyoung Kim;Woo Kyun Kim;S. Min]
通讯作者: S. Kwon;A. Nagaraj;Dalei Xi;Yiyang Du;Dae Nyoung Kim;Woo Kyun Kim;S. Min
DOI: 10.1016/j.cirp.2022.04.004
发表时间: 2022-04
期刊: CIRP Annals
影响因子: --
作者: [A. Nagaraj;Sangkee Min]
通讯作者: A. Nagaraj;Sangkee Min
Understanding of Residual Stress and Subsurface Damage by 2- Step Machining of Single Crystal Sapphire
通过单晶蓝宝石两步加工了解残余应力和亚表面损伤
DOI: --
发表时间: 2022
期刊: 19th International Conference on Precision Engineering
影响因子: --
作者: [Nagaraj, Aditya, Min, Sangkee]
通讯作者: Min, Sangkee
Studying crack generation mechanism of single-crystal sapphire during ultra-precision machining by MD simulation-based slip/fracture activation model
基于MD模拟的滑移/断裂激活模型研究单晶蓝宝石超精密加工过程中裂纹产生机制
DOI: --
发表时间: 2022
期刊: International Conference on Precision Engineering and Sustainable Manufacturing (PRESM2022
影响因子: --
作者: [Kwon, Suk Bum, Nagaraj, Aditya, Xi, Dalei, Du, Yiyang, Kim, Dae Nyoung, Kim, Woo Kyun, Min, Sangkee]
通讯作者: Min, Sangkee
CAREER: Material Removal Mechanism of Ceramic Materials in Ultra-Precision Machining
  • 批准号:
    1844821
  • 项目类别:
    Standard Grant
  • 资助金额:
    $50.0万
  • 财政年份:
    2019
  • 负责人:
    Sangkee Min
  • 依托单位:
国内基金
海外基金
Research on Quantum Field Theory without a Lagrangian Description
  • 批准号:
    24ZR1403900
  • 项目类别:
    省市级项目
  • 资助金额:
    --
  • 批准年份:
    2024
  • 负责人:
    SATOSHI NAWATA
  • 依托单位:
Cell Research
Cell Research
Cell Research (细胞研究)