CAREER: Material Removal Mechanism of Ceramic Materials in Ultra-Precision Machining

职业：超精密加工中陶瓷材料的材料去除机制

• 批准号: 1844821
• 负责人: Sangkee Min
• 金额: $ 50万
• 依托单位: University of Wisconsin-Madison
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-02-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1844821&HistoricalAwards=false
• 关键词: CAREER; Material; Removal; Mechanism; Ceramic

This Faculty Early Career Development (CAREER) Program research will create a fundamental understanding of ceramic material removal during nanoscale machining. Ceramics, such as sapphire, zirconia, calcium fluoride, etc., have many superior mechanical, chemical, biomedical and optical properties, but fabricating ceramic components is very difficult due to their high hardness and brittleness. However, at a microscopic scale, ceramics can be machined like metals, although the mechanism explaining this phenomenon is not yet known. General machining creates cracks on ceramic surfaces because the crystal structure of the material is prone to fracture. Each crystal structure has multiple fracture systems; each fracture system can be initiated under some conditions, especially high pressure. This study will explore how the force generated by cutting action initiates fracture and will use this understanding so that cutting can be done without generating cracks. The research will allow the use of ceramics in various industries, including consumer electronics, biomedical and defense applications, and optical elements. Thus, the research directly and favorably affects economic welfare and national security. The knowledge generated from this project will be distributed through the advanced CNC (Computer Numerical Control) machine training program, online expert system, and public media in addition to journal publication and integration into undergraduate and graduate courses. The project goal is to understand how the microscopic crystal structure of ceramics influences material behavior during machining. The research will identify the activation mechanisms of ductile shear and brittle fracture of ceramics. This knowledge will lead to the development of machining strategies to suppress brittle fracture and to enable ductile mode machining on ceramics for a wide range of applications. The research will initially test the role of three potential parameters (resolved shear stress, fracture energy, and stress intensity factor) in activating plastic deformation or crack initiation. Specific contributions will include: (1) data generation on critical depth of cut where ductile to brittle transition occurs for all orientations for each distinctive crystal plane of sapphire and zirconia; (2) identification of triggering parameter(s) on activation of slip system or fracture system; and (3) modeling of ceramic machining.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这项学院早期职业发展(CALEAR)计划的研究将对纳米级加工过程中陶瓷材料的去除有一个基本的理解。蓝宝石、氧化锆、氟化钙等陶瓷材料具有许多优异的力学、化学、生物医学和光学性能，但由于其高硬度和脆性，陶瓷构件的制备非常困难。然而，在微观层面上，陶瓷可以像金属一样被加工，尽管解释这种现象的机制尚不清楚。普通加工会在陶瓷表面产生裂纹，因为材料的晶体结构容易断裂。每个晶体结构都有多个断裂系统，每个断裂系统都可以在一定的条件下发生断裂，特别是在高压下。这项研究将探索切割动作产生的力是如何引发断裂的，并将利用这一理解来进行切割，从而可以在不产生裂缝的情况下进行切割。这项研究将允许陶瓷在各种行业中使用，包括消费电子、生物医学和国防应用以及光学元件。因此，这项研究直接和有利地影响到经济福利和国家安全。该项目产生的知识将通过先进的数控机床培训计划、在线专家系统和公共媒体传播，此外还将出版期刊并整合到本科生和研究生课程中。该项目的目标是了解陶瓷的微观晶体结构如何影响加工过程中的材料行为。研究将确定陶瓷延性剪切和脆性断裂的激活机制。这些知识将导致加工策略的发展，以抑制脆性断裂，并在陶瓷上实现广泛应用的延性模式加工。这项研究将初步测试三个潜在参数(分解剪应力、断裂能和应力强度因子)在激活塑性变形或裂纹萌生方面的作用。具体的贡献将包括：(1)关于临界切割深度的数据生成，在该数据中，对于蓝宝石和氧化锆的每个独特的晶面，所有取向都会发生从韧性到脆性的转变；(2)确定滑动系统或断裂系统激活的触发参数(S)；以及(3)陶瓷加工的建模。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

• DOI: 10.1016/j.npe.2020.07.001
• 发表时间: 2020-09
• 期刊: Nanotechnology and Precision Engineering
• 作者: S. Kwon;A. Nagaraj;H. Yoon;S. Min

Effect of the initial-flaw on crack-propagation in two-step cutting of monocrystalline sapphire

• DOI: 10.1016/j.jmapro.2020.06.017
• 发表时间: 2020-08
• 期刊: Journal of Manufacturing Processes
• 影响因子: 6.2
• 作者: H. Yoon;S. Kwon;A. Nagaraj;S. Min

Prediction of crack initiation in single-crystal sapphire during ultra-precision machining using MD simulation-based slip/fracture activation model

• DOI: 10.1016/j.precisioneng.2023.12.007
• 发表时间: 2023-12
• 期刊: Precision Engineering
• 作者: S. Kwon;A. Nagaraj;Dae Nyoung Kim;Dalei Xi;Yiyang Du;Woo Kyun Kim;Sangkee Min

Studying Crack Generation Mechanism in Single-Crystal Sapphire During Ultra-precision Machining by MD Simulation-Based Slip/Fracture Activation Model

• DOI: 10.1007/s12541-023-00776-w
• 发表时间: 2023-03
• 期刊: International Journal of Precision Engineering and Manufacturing
• 影响因子: 1.9
• 作者: S. Kwon;A. Nagaraj;Dalei Xi;Yiyang Du;Dae Nyoung Kim;Woo Kyun Kim;S. Min

Characteristics of force generation on C-, R-, A- and M- planes of single-crystal sapphire during ultra-precision machining

单晶蓝宝石超精密加工过程中C、R、A、M平面的力产生特征

• DOI: 10.1016/j.mfglet.2022.07.042
• 发表时间: 2022
• 期刊: Manufacturing Letters
• 影响因子: 3.9
• 作者: Kwon, Suk Bum;Min, Sangkee
• 通讯作者: Min, Sangkee