GOALI/Collaborative Research: Mechanics and Dynamics of Low Frequency Vibration Assisted Machining

GOALI/合作研究:低频振动辅助加工的力学和动力学

基本信息

  • 批准号:
    2019370
  • 负责人:
  • 金额:
    $ 20.16万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2020
  • 资助国家:
    美国
  • 起止时间:
    2020-09-01 至 2024-08-31
  • 项目状态:
    已结题

项目摘要

This Grant Opportunities for Academic Liaison with Industry (GOALI) project partners two universities with industry in the fundamental research on the effect of applying slow vibrations to enhance material removal in machining processes. Vibrations have been treated as a disturbance and a source of inefficiency to many manufacturing operations including machining processes. However, this new approach attempts to use low frequency (slow) vibrations to improve the contact conditions between the cutting tool and workpiece and thereby improve machining efficiency. By applying controlled slow oscillations to cutting tools, this new cutting process can enable material removal with lower cutting effort and energy, attain longer tool-life, and improve overall stability of the machining process towards higher material removal rates. It can significantly enhance manufacturing productivity, and hence US competitiveness and prosperity, and product quality especially for components made of difficult-to-cut metal alloys employed in U.S. automotive, aerospace, defense and energy sectors. Collaboration with a partner from US automotive industry will help ensure the technology transfer and enhance student training.This project investigates the mechanisms by which low frequency vibration applied in continuous cutting process can alter and improve the cutting mechanics and dynamics. Modulating the tool at low frequency along tool feed direction transforms continuous cutting into discrete cutting. This new discrete cutting kinematics not only alters the deformation mechanics of chip formation, but also changes the thermomechanical dynamics in the cutting zone as well as the dynamic stability of the machining process. This research will analyze chip formation mechanics through in-situ digital image correlation and develop analytical models to understand the relationship between vibration kinematics, including cutting force and energy, and overall material removal effort. As the low frequency modulation periodically disengages the cutting tool from the workpiece, it interrupts continuous heating of the cutting edge and induces pre-determined cool-down periods to reduce tool temperature. Analytical models and experimental characterization will capture this transient and cyclic heat conduction regime and its thermo-mechanics. It will provide optimal cutting strategies to increase the tool-life. Finally, effect of feed modulation on the coupled dynamics of process and the machining equipment will be investigated. New knowledge will be created on how to use the controlled low frequency vibration to control and suppress high-frequency self-excited chatter instabilities during machining. It will allow machining of precision parts at significantly higher depth, feed and speed leading to greater material removal rates.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这项与工业界学术联络的资助机会(GOALI)项目将两所大学与工业界合作,对在加工过程中应用缓慢振动来提高材料去除的效果进行基础研究。振动已被视为一种干扰和低效率的来源,许多制造操作,包括加工过程。然而,这种新方法试图使用低频(慢)振动来改善刀具和工件之间的接触条件,从而提高加工效率。通过对刀具施加可控的慢振荡,这种新的切削工艺可以以更低的切削力和能量去除材料,获得更长的刀具寿命,并提高加工过程的整体稳定性,从而实现更高的材料去除率。它可以显著提高制造业生产率,从而提高美国的竞争力和繁荣,提高产品质量,特别是美国汽车、航空航天、国防和能源部门使用的由难以切割的金属合金制成的部件。与美国汽车行业合作伙伴的合作将有助于确保技术转让和加强学生培训。本项目研究了低频振动在连续切削过程中改变和改善切削力学和动力学的机制。沿刀具进给方向低频调制刀具,使连续切削变为离散切削。这种新的离散切削运动学不仅改变了切屑形成的变形力学,而且改变了切削区的热力动力学和加工过程的动态稳定性。本研究将通过原位数字图像相关分析切屑形成机理,并建立分析模型,以了解振动运动学(包括切削力和能量)与整体材料去除力之间的关系。由于低频调制周期性地将刀具与工件分离,它中断了切削刃的持续加热,并诱导了预先确定的冷却时间,以降低刀具温度。分析模型和实验表征将捕捉这种瞬态和循环热传导制度及其热力学。它将提供最佳的切削策略,以增加刀具寿命。最后,研究了进给调制对加工过程与加工设备耦合动力学的影响。如何利用可控的低频振动来控制和抑制加工过程中的高频自激颤振不稳定性将产生新的知识。它将允许加工精密零件在显着更高的深度,进给量和速度导致更大的材料去除率。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。

项目成果

期刊论文数量(2)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Generalized Mechanics and Dynamics of Modulated Turning
  • DOI:
    10.1016/j.jmatprotec.2022.117708
  • 发表时间:
    2022-07
  • 期刊:
  • 影响因子:
    6.3
  • 作者:
    Bora Eren;Soohyun Nam;B. Sencer
  • 通讯作者:
    Bora Eren;Soohyun Nam;B. Sencer
Analytical prediction of chatter stability for modulated turning
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Burak Sencer其他文献

Development of a Chip Pulling System for Efficient Turning
  • DOI:
    10.1016/j.procir.2014.03.092
  • 发表时间:
    2014-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Burak Sencer;Tomoya Aoki;Eiji Shamoto;Takumi Hasegawa;Tomio Koide
  • 通讯作者:
    Tomio Koide
Novel deconvolution based feedrate scheduling towards a new class of CAM for time-dependent processes
基于新型反卷积的进给率调度,针对时间相关过程的新型 CAM
  • DOI:
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Shuntaro Yamato;Burak Sencer;Anthony Beaucamp
  • 通讯作者:
    Anthony Beaucamp
Accurate prediction of machining cycle times by data-driven modelling of NC system's interpolation dynamics
  • DOI:
    10.1016/j.cirp.2022.04.017
  • 发表时间:
    2022-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Masafumi Endo;Burak Sencer
  • 通讯作者:
    Burak Sencer
Adaptive Torque Ripple Compensation Technique Based on the Variable Structure Control and its Applications to Gear Driven Motion Systems
基于变结构控制的自适应扭矩脉动补偿技术及其在齿轮传动运动系统中的应用
  • DOI:
  • 发表时间:
    2013
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Burak Sencer;Eiji Shamoto
  • 通讯作者:
    Eiji Shamoto
A Sliding Made Controller Design for Position Synchronization of Dual Spindle Servo Systems
双主轴伺服系统位置同步的滑动控制器设计
  • DOI:
  • 发表时间:
    2012
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Burak Sencer;Eiji Shamoto
  • 通讯作者:
    Eiji Shamoto

Burak Sencer的其他文献

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{{ truncateString('Burak Sencer', 18)}}的其他基金

GOALI: Fundamental Investigation of Constrained Cutting for High Performance Machining of Difficult-to-Cut Materials
GOALI:难切削材料高性能加工约束切削的基础研究
  • 批准号:
    2323120
  • 财政年份:
    2024
  • 资助金额:
    $ 20.16万
  • 项目类别:
    Standard Grant
GOALI: Mechanics and Dynamics of Machining with Applied Chip Tension
目标:应用切屑张力的加工力学和动力学
  • 批准号:
    1661926
  • 财政年份:
    2017
  • 资助金额:
    $ 20.16万
  • 项目类别:
    Standard Grant

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