MRI: Acquisition of a Micro-Transfer Printer for Heterogeneous Integration of Electronic/Photonic Microsystems

微转移印刷（µTP）是最近开发的一种技术，它可以集成各种微设备技术，这些技术无法在通用基板上轻松制造。例如，激光光源可以集成到硅光子学芯片上，而不是光纤耦合。该提案要求为X-Celeprint （XDC）µTP系统提供资金，该系统非常适合于研发和原型制造，具有使用更大的XDC自动化系统将技术无缝转移到中试线或大批量生产的能力。该仪器将支持显示设备、计算、能量转换、量子光子学、2D材料和生物传感器等技术领域的下一代研究活动。支持研究的结果将为相关和新兴科学领域的文献提供重要贡献。参与者将包括工程和科学几个学科的研究生和本科生研究人员，特别强调多样性和包容性。拟议的调查将促进科学知识和支持有助于改善社会的活动。这些措施包括为下一代工程师和科学家准备多样化的劳动力队伍，在纽约州罗切斯特地区与K-12项目开展推广STEM的外展活动，以及为高中教师和行业合作伙伴提供专业发展机会。异构集成涉及在预封装阶段单独制造的微器件（例如，晶体管，led，传感器）或器件组件（例如，界面层，多孔膜）的组合。µTP系统使用通常由聚二甲基硅氧烷（PDMS）制成的弹性体印章，该印章可变形，具有表面适应性，透明且具有粘性；所需的所有特性转移设备与精确对准。器件必须使用牺牲材料的下切蚀刻进行单独和释放，但仍然在外围用一条或多条系绳固定在源基板上。牺牲释放层的设计使得系索将被拾取力克服，从而允许设备接头从其原生基板上移除。冲压附着力是拉率敏感的，或动态调制的，允许它使用高拉率去除锚定或系留设备，并使用低拉率将相同的设备释放到目标基板上。混合技术设备之间的局部电/光互连的形成使它们能够在亲密的层面上相互作用，实现否则不可能实现的微系统。研究人员建议在几个研究领域利用µTP系统进行设备组件的异构集成。具体应用如下：硅CMOS和薄膜电子产品（背板平台、后端器件）；显示器件（III V和III N微型led）；光伏和功率转换（III - V多结电池）；集成光子学（激光、电光材料、调制器）；量子集成光子学（量子发射体、单光子探测器、光子腔）；混合维杂化纳米系统（二维单层上的III-V器件）；纳米多孔生物器件（电极转移，传感器阵列）。µTP系统将实现“类单片”微系统，在电子/光子系统性能方面具有相关优势。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

Micro-transfer printing (µTP) is a recently developed technique that enables the integration of various micro-device technologies that cannot be easily manufactured on a common substrate. For example, laser light sources could be integrated onto a silicon photonics chip rather than fiber coupled. This proposal requests funds for the acquisition of an X-Celeprint (XDC) µTP system well suited for research and development, and prototype fabrication, with the capability of seamless technology transfer to pilot-line or high-volume production using larger XDC automated systems. The proposed instrument will support next-generation research activities in technology areas such as display devices, computing, energy conversion, quantum photonics, 2D materials, and biosensors. Results from the supported research will provide significant contributions to the literature in relevant and emerging scientific fields. Participants will include graduate and undergraduate student researchers in several disciplines of engineering and science, with a particular emphasis on diversity and inclusion. The proposed investigations will advance scientific knowledge and support activities that contribute to the betterment of society. These include preparing a diverse workforce for next-generation engineers and scientists, outreach activities with K-12 programs in the Rochester, NY region to promote STEM, and professional development opportunities for high school teachers and industry partners. Heterogeneous integration involves the combination of separately fabricated micro-devices (e.g., transistors, LEDs, sensors) or device components (e.g., interface layer, porous membrane) at the pre-package stage. The µTP system uses an elastomer stamp typically made of polydimethylsiloxane (PDMS), which is deformable and surface-compliant, transparent, and adhesive; all characteristics needed to transfer devices with precise alignment. The devices must be singulated and released using an undercut etch of sacrificial material, yet still anchored to the source substrate with one or more tethers at the perimeter. Sacrificial release layers are engineered such that tethers will be overcome by the pickup force, which allows device coupons to be removed from their native substrate. The stamp adhesion is pull-rate sensitive, or kinetically modulated, allowing it to remove anchored or tethered devices using a high pull-rate, and release the same device onto a destination substrate using a low pull-rate. The formation of local electrical/optical interconnects between mixed-technology devices in close proximity allows them to interact at an intimate level, realizing microsystems that are otherwise not possible. The investigators propose to utilize the µTP system for the heterogeneous integration of device components in several areas of research. These are listed (with specific applications) as follows: Silicon CMOS and thin-film electronics (backplane platforms, back-end devices); display devices (III V and III N micro-LEDs); photovoltaics and power conversion (III V multi junction cells); integrated photonics (lasers, electro-optic materials, modulators); quantum integrated photonics (quantum emitters, single photon detectors, photonic cavities); mixed-dimensional hybrid nanosystems (III-V devices on 2D monolayers); nanoporous biodevices (electrode transfer, sensor arrays). The µTP system will enable the realization of “monolithic-like” microsystems, with associated advantages in electronic/photonic system performance.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.