MRI: Acquisition of a Micro-Transfer Printer for Heterogeneous Integration of Electronic/Photonic Microsystems

MRI：购买用于电子/光子微系统异构集成的微型转移打印机

• 批准号: 2117812
• 负责人: Karl Hirschman
• 金额: $ 19.95万
• 依托单位: Rochester Institute of Tech
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-08-15 至 2023-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2117812&HistoricalAwards=false
• 关键词: MRI; Acquisition; Micro; Transfer; Printer

Micro-transfer printing (µTP) is a recently developed technique that enables the integration of various micro-device technologies that cannot be easily manufactured on a common substrate. For example, laser light sources could be integrated onto a silicon photonics chip rather than fiber coupled. This proposal requests funds for the acquisition of an X-Celeprint (XDC) µTP system well suited for research and development, and prototype fabrication, with the capability of seamless technology transfer to pilot-line or high-volume production using larger XDC automated systems. The proposed instrument will support next-generation research activities in technology areas such as display devices, computing, energy conversion, quantum photonics, 2D materials, and biosensors. Results from the supported research will provide significant contributions to the literature in relevant and emerging scientific fields. Participants will include graduate and undergraduate student researchers in several disciplines of engineering and science, with a particular emphasis on diversity and inclusion. The proposed investigations will advance scientific knowledge and support activities that contribute to the betterment of society. These include preparing a diverse workforce for next-generation engineers and scientists, outreach activities with K-12 programs in the Rochester, NY region to promote STEM, and professional development opportunities for high school teachers and industry partners. Heterogeneous integration involves the combination of separately fabricated micro-devices (e.g., transistors, LEDs, sensors) or device components (e.g., interface layer, porous membrane) at the pre-package stage. The µTP system uses an elastomer stamp typically made of polydimethylsiloxane (PDMS), which is deformable and surface-compliant, transparent, and adhesive; all characteristics needed to transfer devices with precise alignment. The devices must be singulated and released using an undercut etch of sacrificial material, yet still anchored to the source substrate with one or more tethers at the perimeter. Sacrificial release layers are engineered such that tethers will be overcome by the pickup force, which allows device coupons to be removed from their native substrate. The stamp adhesion is pull-rate sensitive, or kinetically modulated, allowing it to remove anchored or tethered devices using a high pull-rate, and release the same device onto a destination substrate using a low pull-rate. The formation of local electrical/optical interconnects between mixed-technology devices in close proximity allows them to interact at an intimate level, realizing microsystems that are otherwise not possible. The investigators propose to utilize the µTP system for the heterogeneous integration of device components in several areas of research. These are listed (with specific applications) as follows: Silicon CMOS and thin-film electronics (backplane platforms, back-end devices); display devices (III V and III N micro-LEDs); photovoltaics and power conversion (III V multi junction cells); integrated photonics (lasers, electro-optic materials, modulators); quantum integrated photonics (quantum emitters, single photon detectors, photonic cavities); mixed-dimensional hybrid nanosystems (III-V devices on 2D monolayers); nanoporous biodevices (electrode transfer, sensor arrays). The µTP system will enable the realization of “monolithic-like” microsystems, with associated advantages in electronic/photonic system performance.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

微转移印刷（Micro-transfer printing，µTP）是一种最近开发的技术，它可以集成各种无法在普通基板上轻松制造的微器件技术。例如，激光光源可以集成到硅光子芯片上，而不是光纤耦合。该提案要求提供资金，用于购买非常适合研发和原型制造的X-Celeprint（XDC）µTP系统，该系统能够使用更大的XDC自动化系统将技术无缝转移到中试线或大批量生产。 拟议的仪器将支持显示设备、计算、能量转换、量子光子学、2D材料和生物传感器等技术领域的下一代研究活动。支持的研究结果将为相关和新兴科学领域的文献提供重大贡献。参与者将包括工程和科学的几个学科的研究生和本科生研究人员，特别强调多样性和包容性。 拟议的调查将促进科学知识和支持有助于改善社会的活动。其中包括为下一代工程师和科学家准备多元化的劳动力，在纽约州罗切斯特地区开展K-12计划的推广活动，以促进STEM，以及为高中教师和行业合作伙伴提供专业发展机会。 异质集成涉及单独制造的微器件（例如，晶体管、LED、传感器）或设备组件（例如，界面层、多孔膜）。µTP系统使用通常由聚二甲基硅氧烷（PDMS）制成的弹性体印模，该印模具有可变形、表面柔顺、透明和粘性等特性，这些特性都是精确对准传输器件所需的。必须使用牺牲材料的底切蚀刻来将器件单片化和释放，但仍然在周边处用一个或多个系链锚定到源衬底。牺牲释放层被设计成使得系链将被拾取力克服，这允许器件试样从其原生衬底移除。印模粘附性是牵引速率敏感的或动力学调制的，允许其使用高牵引速率移除锚定或拴系的器件，并使用低牵引速率将相同器件释放到目的地衬底上。在紧密接近的混合技术设备之间形成局部电/光互连，使它们能够在亲密的水平上相互作用，实现否则不可能实现的微系统。研究人员建议在多个研究领域中利用µTP系统实现器件组件的异构集成。 列出了这些（具体应用）如下：硅CMOS和薄膜电子（背板平台、后端设备）;显示设备（III V和III N微发光二极管）;光致发光和功率转换（III V多结电池）;集成光子学（激光器、电光材料、调制器）;量子集成光子学（量子发射器、单光子探测器、光子腔）;混合维混合纳米系统（2D单层上的III-V族器件）;纳米多孔生物器件（电极转移、传感器阵列）。µTP系统将实现“类单片”微系统，并在电子/光子系统性能方面具有相关优势。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。