CAREER: Scalable Lamination Printing of Near Atomically Thin Electronic Materials with Mechanical Stretchability

该奖项全部或部分根据2021年美国救援计划法案（公法117-2）资助。该教师早期职业发展（CAREER）赠款将支持研究，以创造新的基础知识，使原子级薄和机械可拉伸电子材料的可扩展制造，促进科学进步以及推进国家繁荣。传统的电子设备不能以机械可拉伸的形式操作，受限于其构成材料的物理刚性和庞大性。二维（2D）层状电子材料由于其极小的厚度和大的拉伸极限而在这方面有希望。制造策略，以可靠地将它们集成到所需的设备平台，保持其结构质量的开发下，这一补助金。这项研究将研究制造方法，以精确分层，打印和组装各种物理形式的2D材料，以实现其规模化的异质集成。制造方法应可扩展到二维材料的不断增长的家族中的许多材料，从而允许其装置并入。可拉伸电子产品领域的技术机会可以影响广泛的应用，如医疗保健，医疗和光电传感器。这项研究可以对半导体制造业和电子工业产生广泛的影响，加强国家在这些重要领域的竞争力。该项目所设想的综合研究和教育项目的跨学科性质将促进不同背景的本科生和代表性不足的学生的参与。传统的制备薄电子材料（如可机械变形形式的硅）的制造方法需要设备密集型和昂贵的光刻图案化和蚀刻工艺。目前采用的材料的厚度不允许无缺陷的机械拉伸性。可内延展的二维层状材料存在粘附不稳定性，这使得它们的系统集成困难。本研究旨在填补这一知识空白，通过研究毛细作用力驱动的二维材料分层和层压的基本机制。基本的热力学能量原理将被研究，支配各种二维材料相对于其生长晶片的货车德瓦尔斯粘附，并将通过实验和计算方法建立其结构-工艺-性能关系。将研究有限元力学建模、原位电气和结构表征以及化学气相沉积生长，以提高对制造工艺的理解和能力。该层压技术将用于以确定性的方式将晶圆级2D材料打印和组装到基板上，并研究其应变不变的电气特性。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

This award is funded in whole or in part under the American Rescue Plan Act of 2021 (Public Law 117-2).This Faculty Early Career Development (CAREER) grant will support research to create new fundamental knowledge that enables the scalable manufacturing of atomically thin and mechanically stretchable electronic materials, promoting the progress of science as well as advancing national prosperity. Conventional electronic devices are unable to operate in mechanically stretchable forms, limited by the physical rigidness and bulkiness of their constituting materials. Two-dimensional (2D) layered electronic materials hold promise in this respect owing to their extremely small thickness and large stretch limits. Manufacturing strategies to reliably integrate them into desired device platforms maintaining their structural quality are developed under this grant. This research will investigate manufacturing methods to precisely delaminate, print, and assemble 2D materials of various kinds in any physical forms toward their scaled-up heterogeneous integrations. The manufacturing methods should be extendable to many materials of the growing family of two-dimensional materials allowing for their device incorporation. Technological opportunities in the field of stretchable electronics can impact a wide range of applications such as healthcare, medical, and opto-electrical sensors. This research can have a broad impact on semiconductor manufacturing and electronics industries, strengthening the nation’s competitiveness in these important domains. The interdisciplinary nature of the integrated research and educational programs envisioned in this project will promote the participation of undergrad and underrepresented students of diverse backgrounds.Conventional manufacturing methods to prepare for thin electronic materials such as silicon in mechanically deformable forms have demanded equipment-intensive and costly lithographic patterning and etching processes. The thickness of the currently employed materials does not allow for the defect-free mechanical stretchability. Intrinsically extensible 2D layered materials suffer from adhesion instability which makes their system integration difficult. This research is to fill this knowledge gap by investigating the fundamental mechanism for the capillary-force driven delamination and lamination of 2D materials. The underlying thermodynamic energy principles will be studied that govern the van der Waals adhesion of various 2D materials with respect to their growth wafers and will establish their structure-process-property relationships through experimental and computational approaches. Finite element mechanics modeling, in-situ electrical and structural characterizations, as well chemical vapor deposition growth will be studied to develop the understanding and capabilities of the manufacturing process. The lamination technique will be used to print and assemble wafer-scale 2D materials onto substrates in a deterministic manner and study their strain-invariant electrical properties.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.