CAREER: Scalable Lamination Printing of Near Atomically Thin Electronic Materials with Mechanical Stretchability

该奖项全部或部分由《2021年美国救援计划法案》（公法117-2）资助。这项教师早期职业发展（Career）基金将支持研究，以创造新的基础知识，使原子薄和机械可拉伸的电子材料的可扩展制造成为可能，促进科学进步，促进国家繁荣。由于其构成材料的物理刚性和体积的限制，传统的电子设备无法以机械可拉伸的形式运行。二维（2D）层状电子材料由于其极小的厚度和较大的拉伸极限而在这方面具有前景。将其可靠地集成到所需的设备平台中以保持其结构质量的制造策略是在该资助下开发的。本研究将探讨精确分层、打印和组装各种物理形式的二维材料的制造方法，以实现其规模扩大的异质集成。制造方法应扩展到许多材料的增长家族的二维材料允许他们的设备合并。可拉伸电子领域的技术机遇可以影响广泛的应用，如医疗保健、医疗和光电传感器。这项研究可以对半导体制造和电子工业产生广泛的影响，加强国家在这些重要领域的竞争力。本项目设想的综合研究和教育计划的跨学科性质将促进不同背景的本科生和未被充分代表的学生的参与。传统的制造方法，以制备薄电子材料，如硅在机械可变形的形式，要求设备密集和昂贵的光刻图案和蚀刻工艺。目前所用材料的厚度不允许无缺陷的机械拉伸性。本质上可扩展的二维层状材料存在粘附不稳定性，这给其系统集成带来了困难。本研究旨在通过研究毛细管力驱动二维材料分层和叠层的基本机制来填补这一知识空白。将研究控制各种二维材料相对于其生长晶圆的范德华粘附的潜在热力学能量原理，并通过实验和计算方法建立它们的结构-工艺-性能关系。将研究有限元力学建模、原位电学和结构表征以及化学气相沉积生长，以发展对制造过程的理解和能力。层压技术将用于在衬底上以确定的方式打印和组装晶圆级二维材料，并研究其应变不变电学特性。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

This award is funded in whole or in part under the American Rescue Plan Act of 2021 (Public Law 117-2).This Faculty Early Career Development (CAREER) grant will support research to create new fundamental knowledge that enables the scalable manufacturing of atomically thin and mechanically stretchable electronic materials, promoting the progress of science as well as advancing national prosperity. Conventional electronic devices are unable to operate in mechanically stretchable forms, limited by the physical rigidness and bulkiness of their constituting materials. Two-dimensional (2D) layered electronic materials hold promise in this respect owing to their extremely small thickness and large stretch limits. Manufacturing strategies to reliably integrate them into desired device platforms maintaining their structural quality are developed under this grant. This research will investigate manufacturing methods to precisely delaminate, print, and assemble 2D materials of various kinds in any physical forms toward their scaled-up heterogeneous integrations. The manufacturing methods should be extendable to many materials of the growing family of two-dimensional materials allowing for their device incorporation. Technological opportunities in the field of stretchable electronics can impact a wide range of applications such as healthcare, medical, and opto-electrical sensors. This research can have a broad impact on semiconductor manufacturing and electronics industries, strengthening the nation’s competitiveness in these important domains. The interdisciplinary nature of the integrated research and educational programs envisioned in this project will promote the participation of undergrad and underrepresented students of diverse backgrounds.Conventional manufacturing methods to prepare for thin electronic materials such as silicon in mechanically deformable forms have demanded equipment-intensive and costly lithographic patterning and etching processes. The thickness of the currently employed materials does not allow for the defect-free mechanical stretchability. Intrinsically extensible 2D layered materials suffer from adhesion instability which makes their system integration difficult. This research is to fill this knowledge gap by investigating the fundamental mechanism for the capillary-force driven delamination and lamination of 2D materials. The underlying thermodynamic energy principles will be studied that govern the van der Waals adhesion of various 2D materials with respect to their growth wafers and will establish their structure-process-property relationships through experimental and computational approaches. Finite element mechanics modeling, in-situ electrical and structural characterizations, as well chemical vapor deposition growth will be studied to develop the understanding and capabilities of the manufacturing process. The lamination technique will be used to print and assemble wafer-scale 2D materials onto substrates in a deterministic manner and study their strain-invariant electrical properties.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.