SBIR Phase II: Low-Cost High Efficiency Gallium-Nitride RFIC-PAs

SBIR 第二阶段：低成本高效率氮化镓 RFIC-PA

• 批准号: 2208207
• 负责人: Nick Chopra
• 金额: $ 100万
• 依托单位: RECON RF, INC.
• 依托单位国家: 美国
• 项目类别: Cooperative Agreement
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-09-15 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2208207&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Low; Cost

The broader impact of this Small Business Innovation Research (SBIR) Phase II project will contribute to the advancement of the US’s competitiveness in Semiconductor based products, while also enhancing the national defense and minimizing the electricity requirements of next-generation wireless communications infrastructure equipment. This project will develop state-of-the-art Radio-Frequency Integrated Circuit Power Amplifiers (RFIC-PA), Mixers, and Switches through a leading U.S.-based semiconductor foundry. These innovated circuits will contribute to modernizing the U.S.’s 5G communications infrastructure while restoring the country’s prominence in semiconductor-based technologies. This Small Business Innovation Research (SBIR) Phase II project will significantly enhance the output power and efficiency of RFIC-PA technologies over the present-day/competing state-of-the-art products. The RFIC-PA is the most voluminous, costly, and power consumptive component of emerging 5G macro and small cellular base stations, and the wireless devices connected to them. For this reason, this project will apply innovative RFIC-PA design methods at the very forefront of high-efficiency RFIC design techniques toward the design, fabrication, test, and commercialization of five discriminating RFIC-PA products at the conclusion of this NSF Phase-2 project.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这一小型企业创新研究（SBIR）第二阶段项目的广泛影响将有助于提高美国在半导体产品方面的竞争力，同时还将加强国防，并最大限度地减少下一代无线通信基础设施设备的电力需求。该项目将通过美国领先的射频集成电路功率放大器（RFIC-PA），混频器和开关开发国家的最先进的。半导体代工厂。这些创新的电路将有助于美国的现代化。5G通信基础设施，同时恢复该国在基于物联网技术方面的突出地位。 与当今/竞争的最先进产品相比，这个小企业创新研究（SBIR）第二阶段项目将显着提高RFIC-PA技术的输出功率和效率。RFIC-PA是新兴5G宏和小型蜂窝基站以及连接到它们的无线设备中体积最大、成本最高、功耗最大的组件。因此，该项目将在高效RFIC设计技术的最前沿应用创新的RFIC-PA设计方法，用于设计，制造，测试，和商业化的五个区别RFIC-PA产品在这个NSF阶段结束-该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查进行评估，被认为值得支持的搜索.