Novel nano scale reactive material systems for bonding with internal heat source

在本提案中，研究了由于其化学计量成分和几何尺寸而允许自我维持的放热化学反应的材料系统，释放出可以用作内部热源的能量。这种局部产生的热量可以用于微系统技术中的键合。本提案的目的是为微系统的开发提供更灵活和强大的技术。因此，新材料和新功能可以通过减少热输入和热损伤、增加粘合强度和简单灵活的应用来集成。该项目的目的是沉积和分析反应性纳米材料系统，与传统方法相比，它涉及一个新的原理。在这些新的所谓的垂直排列系统的帮助下，单个工艺步骤以及沉积温度可以降低。在该项目中，证明了与这些新的纳米级反应材料体系键合的可行性。

In this proposal, material systems are investigated which allow due to their stoichiometric composition and geometric dimensions a self-sustaining, exothermic chemical reaction, releasing energy that can be used as an internal heat source. This locally generated heat can be used for bonding in microsystems technology. The aim of this proposal is to provide more flexible and powerful technologies for the development of microsystems. Thus, new materials as well as new functionalities can be integrated by the reduced heat input as well as heat damage, the increased bonding strength and a simple and flexible application.The aim of this project is the deposition and analysis of reactive nanoscale material systems, which, in contrast to the conventional approaches, involves a new principle. With the help of these new so called vertically arranged systems individual process steps as well as deposition temperatures can be reduced. In the proposed project, the bonding feasibility with these new nanoscale reactive material systems is demonstrated.