FuSe-TG: Electronic-Photonic Systems-on-Chip for Computation, Communication and Sensing

FuSe-TG：用于计算、通信和传感的电子光子片上系统

• 批准号: 2235466
• 负责人: Vladimir Stojanovic
• 金额: $ 40万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-06-01 至 2025-05-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2235466&HistoricalAwards=false
• 关键词: FuSe; TG; Electronic; Photonic; Systems

The research vision is to create a breakthrough in the capability of future semiconductor technologies - to develop devices, circuits, systems, process, design flow and tools, and train students, in a novel platform for electronic-photonic systems-on-chip (EPSoCs) in advanced CMOS foundry processes, addressing a range of key applications in computing, communication and sensing. Semiconductor technology is entering a new age as the transistor scaling that has provided the past 50 years of progress slows down. Electronic-photonic (EP) integration offers a path to revolutionizing these capabilities via powerful new systems-on-chip (SoCs) for applications from optical input/output (I/O) today, through future radio frequency/mm-wave signal processing for 5G/6G wireless, light detection and ranging (lidar) imaging, and new paradigms for computing like artificial intelligence (AI) scale-out fabrics, photonics-interfaced superconducting electronics, and quantum computing. This path of innovation requires a convergent, interdisciplinary co-design approach intertwining the skills of photonics designers, electronic circuit/system designers, process engineers, and system/application experts. Researchers plan to utilize initial proof-of-concept developments to team with the domain and application experts and establish a base research and educational portfolio and a research team to shape the Center-scale Co-Design research effort.Monolithic electronics-photonics integration has been demonstrated by the members of the team - its use and advantage in classical optical interconnects, as well as the design of the first photon-pair source with integrated electronic sensing and control, molecular and ultrasound eletronic-photonic sensor systems-on-chip, a design of the mm-wave analog photonic link and a demonstration of the first cryo-photonic link. The goal in this work is to establish an effective co-design team with application domain experts to further develop the architectures and system-to-device modeling methodologies and co-design efforts along the three key research vectors in computation, communication and sensing, to establish a research and educational foundation for future Center-scale Co-Design research effort. Furthermore, these EPSoC concepts will be developed in a new, photonics-optimized high-volume electronic-photonic process (45nm SPCLO SOI CMOS) enabled by the team’s previous work. In the long-term, this work will create an EPSoCs platform that leverages state-of-the-art CMOS foundry technology. It will develop a framework (block libraries, tools, models and design methodologies) for low cost, rapid innovation and design of sophisticated EPSoCs. It will also democratize EPSoC technology making it accessible to a broader research, industrial and even educational community (e.g. making possible EPSoC chip design through open-source design tools and generator libraries).This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该研究的愿景是在未来半导体技术的能力上创造突破-开发器件、电路、系统、工艺、设计流程和工具，并在先进的CMOS铸造工艺中的电子-光子系统(EPSoC)的新平台上培训学生，满足计算、通信和传感的一系列关键应用。半导体技术正在进入一个新时代，因为过去50年来提供进步的晶体管规模放缓。电子-光子(EP)集成为这些能力提供了一条革命性的道路，通过面向当今光学输入/输出(I/O)应用的强大新型片上系统(SoC)、用于5G/6G无线的未来射频/毫米波信号处理、光探测和测距(激光雷达)成像以及人工智能(AI)横向扩展结构、光子学接口超导电子学和量子计算等计算新范式，提供了一条革命性的途径。这条创新之路需要一种融合了光电子设计师、电子电路/系统设计师、工艺工程师和系统/应用专家技能的融合、跨学科的合作设计方法。研究人员计划利用初步的概念验证开发来与该领域和应用专家合作，并建立一个基础研究和教育组合以及一个研究团队来塑造中心规模的联合设计研究工作。团队成员已经展示了单片电子-光子学集成-它在经典光学互连中的用途和优势，以及第一个集成了电子传感和控制的光子对源的设计，分子和超声电子-光子传感器系统的芯片上，毫米波模拟光子链路的设计和第一个低温-光子链路的演示。这项工作的目标是建立一个有效的协同设计团队，与应用领域的专家一起，沿着计算、通信和传感这三个关键研究载体，进一步开发体系结构和系统到设备的建模方法和协同设计工作，为未来的中心尺度协同设计研究工作奠定研究和教育基础。此外，这些EPSoC概念将在团队先前工作的基础上，在一种新的、光子学优化的大容量电子-光子工艺(45 Nm SPCLO SOI CMOS)中进行开发。从长远来看，这项工作将创建一个利用最先进的CMOS铸造技术的EPSoCS平台。它将开发一个框架(块库、工具、模型和设计方法)，用于低成本、快速创新和设计复杂的EPSoC。它还将使EPSoC技术大众化，使其可供更广泛的研究、工业甚至教育社区使用(例如，通过开源设计工具和生成器库使EPSoC芯片设计成为可能)。该奖项反映了NSF的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。