FuSe-TG: Open, Multiscale, Application-Agnostic Platform for Heterogeneous System-in-Package Co-Design

FuSe-TG：开放、多尺度、与应用无关的异构系统级封装协同设计平台

• 批准号: 2235414
• 负责人: Dan Jiao
• 金额: $ 55万
• 依托单位: Purdue University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-04-01 至 2025-03-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2235414&HistoricalAwards=false
• 关键词: FuSe; TG; Open; Multiscale; Application

Heterogeneous integration (HI) has shown tremendous potential to overcome the cost and performance challenges of advanced monolithic integration technology and effectively combat the slow-down of Moore’s law. However, HI constitutes a grand challenge in engineering since it must simultaneously address the electrical, optical, thermal, mechanical, and material challenges of integrating separately manufactured/designed components into a higher-level System-in-Package (SiP), for a diverse range of technologies. Currently, the design and optimization of functional blocks and chips are implemented in different domains without self-consistent links between different models, and without co-design or co-optimization between them. This project, if successful, will translate to sustained innovations in the microelectronics industry at-large and permit the US to maintain global leadership in microelectronics, delivering systems that achieve more-than-Moore scaling for years to come. This teaming project will help meet the future workforce needs in microelectronics, utilizing the Nation’s First Semiconductor Degrees Program (SDP) just launched at Purdue University. The project will leverage partnerships with U of Central Florida, UC Santa Barbara, and UC San Diego, all minority-serving institutions to attract underrepresented students, and will also partner with Community Colleges to develop training programs.The technical objective of this teaming effort is to break the barriers across applications, design domains, and abstraction levels, in modeling, simulation, optimization, and design through an open-source, multiscale, application-agnostic platform (Open-MAP) for heterogeneous SiP co-design. Open-MAP encompasses three key components: (1) A multiscale multiphysics modeling and analysis seamlessly integrated with either first-principles accuracy or a user-desired level of accuracy, which is further enriched by data, ML-assisted, and uncertainty quantification techniques; (2) A suite of multiphysics-informed design and optimization tools to automate co-design from intent to fabrication; (3) A series of co-design projects that will be conducted to identify critical barriers to co-design, for informing and guiding the development of Open-MAP, and eventually demonstrating the co-design advantages using the Open-MAP capabilities.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

异构集成（HI）在克服先进单片集成技术的成本和性能挑战以及有效地对抗摩尔定律的减速方面显示出巨大的潜力。然而，HI在工程上构成了一个巨大的挑战，因为它必须同时解决将单独制造/设计的组件集成到更高级别的系统级封装（SiP）中的电气、光学、热、机械和材料挑战。目前，功能块和芯片的设计和优化是在不同领域实现的，不同模型之间没有自洽的联系，它们之间也没有协同设计或协同优化。该项目如果成功，将转化为整个微电子行业的持续创新，并使美国能够保持微电子领域的全球领导地位，在未来几年内提供实现超过摩尔缩放的系统。这个团队合作项目将有助于满足微电子未来的劳动力需求，利用刚刚在普渡大学推出的国家第一个半导体学位计划（SDP）。该项目将利用与中佛罗里达大学、加州大学圣巴巴拉分校和加州大学圣地亚哥分校的合作关系，这些学校都是为少数民族服务的机构，以吸引代表性不足的学生，并将与社区学院合作开发培训项目。这一合作努力的技术目标是通过一个开源的，用于异构SiP协同设计的多尺度、应用无关平台（Open-MAP）。Open-MAP包含三个关键组件：（1）多尺度多物理场建模和分析，与第一原理精度或用户期望的精度水平无缝集成，并通过数据、ML辅助和不确定性量化技术进一步丰富;（2）一套多物理场设计和优化工具，用于从意图到制造的自动协同设计;（3）将开展一系列共同设计项目，以确定共同设计的关键障碍，为开发开放式管理计划提供信息和指导，并最终展示了使用Open-MAP能力。该奖项反映了NSF的法定使命，并通过使用基金会的智力价值进行评估，被认为值得支持和更广泛的影响审查标准。