Three Dimensional Integrated Circuits

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Pushing the boundaries of current silicon fabrication technology, this proposal will investigate the possibilities of new 3D architectures to ensure that Australia remains at the forefront of world-wide research into atomic-scale electronics. It creates an important link to the latest technologies in atomistic device modelling in the US, developed at Texas Instruments. More importantly, by anticipating the problems that electronic device manufacturers are currently facing, and will face over their long-term horizons, the proposed research also seeks to provide Australia with a chance to lift its involvement in the multi-trillion dollar global semiconductor industry.