Multi-target ultra-high-vacuum (UHV) RF Sputtering System

多靶超高真空（UHV）射频溅射系统

• 批准号: 282221095
• 金额: --
• 依托单位: Universität zu Köln
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2015
• 资助国家: 德国
• 起止时间: 2014-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/282221095?language=en
• 关键词: Multi; target; ultra; vacuum; UHV

The head of the group is a researcher of topological insulators (TIs) and topological superconductors (TSCs). Our group has been doing research at Osaka University, but is moving to the University of Cologne to focus more on the fundamental physics of TIs and TSCs. One of the objectives of our research is to discover novel quantum phenomena in TIs and TSCs, which requires fabrications of state-of-the-art devices based on these materials. For this purpose, the University of Cologne will build a dedicated clean room for our group. The RF sputtering system is a general and essential tool for depositing metals and insulators in the nano-device fabrication process. Needless to say, such a process must be done within the same clean room as the other lithography processes. Therefore, an RF sputtering system is a necessary apparatus in a clean room for nanodevice fabrications.

该小组的负责人是拓扑绝缘体（TI）和拓扑超导体（TSC）的研究人员。我们的团队一直在大坂大学进行研究，但正在转移到科隆大学，以更多地关注TI和TSC的基础物理学。我们研究的目标之一是发现TI和TSC中的新量子现象，这需要基于这些材料制造最先进的设备。为此，科隆大学将为我们集团建造一个专用的洁净室。RF溅射系统是用于在纳米器件制造过程中沉积金属和绝缘体的通用且必要的工具。不用说，这样的工艺必须在与其他光刻工艺相同的洁净室中完成。因此，RF溅射系统是用于纳米器件制造的洁净室中的必要设备。