Connection of functional blocks and RF system integration

考虑到基于SiCer的RF微电子和微机电设备和功能块的组合和实施，RF系统集成在MUSIK的第2阶段中起着重要作用;这需要并证明了增加这个新的和全面的工作部分C3。基于第一阶段的成功和有希望的结果，该项目基于数值模拟，对整个系统的跨层RF设计进行了验证，包括器件、模块和基板层之间的所有必要过渡和连接。另一个工作包涉及无源电路元件（R，L，C）和网络的设计、建模、分析和适配，嵌入到SiCer衬底中，需要实现演示器的全部功能。此外，应分析集成模块之间的相互寄生相互作用，从而对适当的设计规则和缓解方法有新的认识。为了解决这些RF相关方面的问题，应考虑项目组A提出的参数行为模型（包括寄生效应），以模拟系统响应。最终，射频系统应与部件C1和C2一起制造、组装和包装，然后进行实验验证和分析，并将其移交给项目组A（K-和F-系统）和项目组B（F-和M-系统）。应确定并设计合适的RF信号耦合架构，包括RF、LF和DC电路。随着项目的持续进展，C3部分应负责设备、模块的射频测量以及整个复杂系统的协调设计验证。

In view of the combination and implementation of SiCer-based RF microelectronic and microelectromechanic devices and functional blocks, the RF system integration plays a major role in phase 2 of MUSIK; this necessitates and justifies the addition of this new and comprehensive workpart C3. Based on the successful and promising results of phase 1, this project comprizes the cross-layer RF design, based on numerical simulations, of the complete system, including all necessary transitions between, and connections of, devices, modules and substrate layers.Another workpackage deals with the design, modelling, analysis, and adaptation of the passive circuit elements (R, L, C) and networks, embedded into the SiCer substrate and needed to achieve full functionality of the demonstrator. In addition, the mutual parasitic interaction between the integrated modules shall be analysed, consequently leading to new insight into appropriate design rules and mitigation approaches. To address these RF-relevant aspects, the parametric behavioral models including parasitic effects, put forward by project group A, shall be taken into account for the simulation of the system response. Eventually, the RF system shall be manufactured, assembled and packaged, jointly with parts C1 and C2, followed by experimental verification and analysis, which will be handed over to project group A (K- and F-systems) and project group B (F- and M-systems). Suitable RF signal coupling architectures shall be identified and designed, including RF, LF, and DC ciruitry. With continuing progress of the project, part C3 shall lead the RF measurements of devices, modules, and the coordinated design verification of the entire complex system.