Connection of functional blocks and RF system integration

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In view of the combination and implementation of SiCer-based RF microelectronic and microelectromechanic devices and functional blocks, the RF system integration plays a major role in phase 2 of MUSIK; this necessitates and justifies the addition of this new and comprehensive workpart C3. Based on the successful and promising results of phase 1, this project comprizes the cross-layer RF design, based on numerical simulations, of the complete system, including all necessary transitions between, and connections of, devices, modules and substrate layers.Another workpackage deals with the design, modelling, analysis, and adaptation of the passive circuit elements (R, L, C) and networks, embedded into the SiCer substrate and needed to achieve full functionality of the demonstrator. In addition, the mutual parasitic interaction between the integrated modules shall be analysed, consequently leading to new insight into appropriate design rules and mitigation approaches. To address these RF-relevant aspects, the parametric behavioral models including parasitic effects, put forward by project group A, shall be taken into account for the simulation of the system response. Eventually, the RF system shall be manufactured, assembled and packaged, jointly with parts C1 and C2, followed by experimental verification and analysis, which will be handed over to project group A (K- and F-systems) and project group B (F- and M-systems). Suitable RF signal coupling architectures shall be identified and designed, including RF, LF, and DC ciruitry. With continuing progress of the project, part C3 shall lead the RF measurements of devices, modules, and the coordinated design verification of the entire complex system.