Connection of functional blocks and RF system integration

功能块连接和射频系统集成

• 批准号: 282852716
• 负责人: Professor Dr. Matthias Hein
• 金额: --
• 依托单位: Fachgebiet Hochfrequenz- und Mikrowellentechnik (HMT)
• 依托单位国家: 德国
• 项目类别: Research Units
• 财政年份: 2015
• 资助国家: 德国
• 起止时间: 2014-12-31 至 2019-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/282852716?language=en
• 关键词: Connection; functional; blocks; RF; system

In view of the combination and implementation of SiCer-based RF microelectronic and microelectromechanic devices and functional blocks, the RF system integration plays a major role in phase 2 of MUSIK; this necessitates and justifies the addition of this new and comprehensive workpart C3. Based on the successful and promising results of phase 1, this project comprizes the cross-layer RF design, based on numerical simulations, of the complete system, including all necessary transitions between, and connections of, devices, modules and substrate layers.Another workpackage deals with the design, modelling, analysis, and adaptation of the passive circuit elements (R, L, C) and networks, embedded into the SiCer substrate and needed to achieve full functionality of the demonstrator. In addition, the mutual parasitic interaction between the integrated modules shall be analysed, consequently leading to new insight into appropriate design rules and mitigation approaches. To address these RF-relevant aspects, the parametric behavioral models including parasitic effects, put forward by project group A, shall be taken into account for the simulation of the system response. Eventually, the RF system shall be manufactured, assembled and packaged, jointly with parts C1 and C2, followed by experimental verification and analysis, which will be handed over to project group A (K- and F-systems) and project group B (F- and M-systems). Suitable RF signal coupling architectures shall be identified and designed, including RF, LF, and DC ciruitry. With continuing progress of the project, part C3 shall lead the RF measurements of devices, modules, and the coordinated design verification of the entire complex system.

鉴于基于sicer的射频微电子和微机电器件和功能模块的组合和实现，射频系统集成在MUSIK的第二阶段起着重要作用；这就需要并证明添加这个新的和全面的工作部件C3是合理的。基于第一阶段的成功和有希望的结果，本项目包括基于数值模拟的完整系统的跨层射频设计，包括器件、模块和基板层之间所有必要的转换和连接。另一个工作包处理无源电路元件（R， L， C）和网络的设计，建模，分析和自适应，嵌入到SiCer基板中，需要实现演示器的全部功能。此外，应分析集成模块之间的相互寄生相互作用，从而对适当的设计规则和缓解方法产生新的见解。为了解决这些与射频相关的问题，应考虑项目组A提出的包含寄生效应的参数行为模型来模拟系统响应。最终，RF系统将与C1、C2部件共同制造、组装、封装，并进行实验验证和分析，移交给项目组A （K、F系统）和项目组B （F、m系统）。应确定和设计合适的射频信号耦合架构，包括射频、低频和直流电路。随着项目的不断推进，C3部分将主导器件、模块的射频测量，以及整个复杂系统的协同设计验证。