プラズマを援用した単結晶ダイヤモンド基板の高能率ダメージフリー研磨法の開発

采用四种不同的抛光板对单晶金刚石（SCD）衬底进行等离子体辅助抛光（PAP），石英玻璃最适合获得原子级光滑的表面，且材料去除率高，当抛光压力变化时，在较低的抛光压力（62.5kPa）下，各向同性的化学去除作用占主导地位，而当PAP在高抛光压力如350.0kPa下进行时，各向异性机械诱导的去除作用占主导地位。而改变抛光板与SCD基板间的滑动速度并不影响PAP的材料去除机理，PAP应用于SCD基板的抛光时无损伤。

A single crystal diamond (SCD) substrate is processed by plasma-assisted polishing (PAP) using four types of polishing plates, the quartz glass is the most suitable to obtain an atomically smooth surface with high material removal rate.As the polishing pressure applied to the SCD substrate varied, the isotropic chemical removal action was dominant when the PAP was performed at low polishing pressures such as 62.5 kPa, whereas the anisotropic mechanically induced removal action was dominant when the PAP was performed at high polishing pressures such as 350.0 kPa. In contrast, changing the sliding speed between the polishing plate and the SCD substrate did not affect the material removal mechanism of PAP.PAP was damage-free when applied to the polishing of SCD substrate.